My Inquiry
My Account
AMD XC6VLX75T-1FFG784C
- Part No.:
- XC6VLX75T-1FFG784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX75T-1FFG784C.pdf
- Description:
- IC FPGA 360 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,550
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6VLX75T-1FFG784C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 74,496 logic cells, 12.8 Gb/s transceiver capability, 640 DSP48E1 slices, and embedded Block RAM totaling 3,556 kbits. It operates at -1 speed grade with 1.0V core voltage and targets high-performance serial connectivity in wired infrastructure.
For engineers reviewing the XC6VLX75T-1FFG784C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver compliance with PCIe Gen2, deterministic timing closure for 10G Ethernet MACs, and thermal management in FFG784 flip-chip BGA packaging.
Technical Context
The XC6VLX75T-1FFG784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and 10G Ethernet. Its clocking system includes 32 mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) for low-jitter frequency synthesis.
It supports SelectIO standards up to 1.8V, includes integrated memory controllers for DDR3/DDR2/LPDDR, and delivers deterministic timing performance under -1 speed grade across industrial temperature range (0°C to 85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - defines maximum combinational and sequential logic capacity for complex state machines or protocol stacks |
| DSP Slices | 640 DSP48E1 - enables parallel multiply-accumulate operations at up to 250 MHz for signal processing pipelines |
| Block RAM | 3,556 kbits - provides on-chip memory for FIFOs, coefficient storage, or packet buffering without external SRAM |
| Transceiver Speed | 12.8 Gb/s - supports wire-speed 10GBASE-R and PCIe Gen2 x8 links with built-in 8B/10B encoding |
| Speed Grade | -1 - guarantees timing closure at 1.0V core supply and industrial temperature range (0°C to 85°C) |
| I/O Standards | SelectIO up to 1.8V - allows direct interfacing with DDR3, QDR, and LVDS peripherals without level shifters |
| MMCM/PLL Count | 32 MMCMs + 8 PLLs - enables independent clock domain generation for multi-rate systems like video transport and packet switching |
Pinout & Package
XC6VLX75T-1FFG784C is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG784) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal-enhanced construction for high-power FPGA operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0V to CLBs, DSP slices, and interconnect; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8V to configuration logic, clock management, and transceiver reference circuits |
| VCCO | I/O bank power | Set per-bank to match interface voltage (1.2V–1.8V); determines I/O standard compatibility |
| MRCC / SRCC | Dedicated clock inputs | Low-skew global clock routing paths for MMCM/PLL reference clocks; require controlled-impedance PCB traces |
| GTX/GTH | Transceiver differential pairs | High-speed serial lanes supporting 600 Mb/s–12.8 Gb/s; require matched-length differential routing and AC coupling |
| PROGRAM_B | Configuration control | Active-Low asynchronous reset that reloads bitstream from external SPI flash or JTAG interface |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4/x8 link widths with full PHY and data link layer implementation |
| DDR3 Memory Controller | Programmable controller supporting 800–1066 Mbps data rates, 64-bit bus width, and on-die termination calibration |
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reconfiguration-critical for adaptive radio and real-time protocol updates |
| Advanced Power Management | Per-bank I/O power gating and dynamic voltage scaling reduce active power by up to 35% versus prior Virtex families |
| AXI4 Interconnect Fabric | Native support for AXI4-Lite and AXI4-Stream interfaces simplifies integration with ARM-based processors and DMA engines |
Applications
| Wireless Baseband Processing | 10G Ethernet Line Cards |
|---|---|
Use Scenario: Real-time LTE/5G physical layer processing in macrocell and small cell base stations. IC Role / Device Role / Timing Role: FPGA fabric hosts channel coding, FFT/IFFT, and MIMO precoding; transceivers interface with RFICs via JESD204B. Use Value: 640 DSP48E1 slices enable concurrent processing of multiple antenna streams at sub-100 µs latency. | Use Scenario: Aggregation and switching of 10GbE traffic in carrier-grade edge routers. IC Role / Device Role / Timing Role: Implements MAC, PCS, and PMA layers for 10GBASE-R; handles flow control, CRC, and serialization/deserialization. Use Value: 12.8 Gb/s transceivers support wire-speed line-rate forwarding with deterministic jitter < 0.3 UI. |
| Medical Imaging Data Acquisition | Avionics Data Concentrators |
Use Scenario: High-fidelity ultrasound beamforming and CT detector readout in portable imaging systems. IC Role / Device Role / Timing Role: Captures synchronized ADC samples from 128+ channels; performs real-time filtering and compression before PCIe upload. Use Value: 3,556 kbits of Block RAM buffers raw sensor data while DSP slices execute FIR filtering at 200 MSPS. | Use Scenario: ARINC 664 (AFDX) end-system interface and time-triggered network switching in flight control computers. IC Role / Device Role / Timing Role: Enforces bandwidth allocation, latency bounds, and redundancy management per AFDX specification. Use Value: Deterministic -1 speed grade ensures worst-case timing closure for 100 µs deadline-critical frames across all operating temperatures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | UltraScale architecture, 475K logic cells, 25.8 Gb/s GTY transceivers, higher power consumption | Better suited for 25G+ networking and AI inference acceleration; lacks native PCIe Gen2 hard IP | Choose when migrating to higher bandwidth or requiring hardened 100G Ethernet MACs |
| XC7VX690T-2FFG1927I | Virtex-7 family, 693,120 logic cells, 13.1 Gb/s GTX transceivers, -2 speed grade, extended temperature range | Offers larger logic capacity and enhanced radiation tolerance; no native DDR3 controller in base configuration | Prefer for space-constrained designs needing >600K LUTs and operation beyond 85°C |
Compared with XC6VLX75T-1FFG784C, the XCVU3P-2FFVD1760E delivers higher serial bandwidth but requires board redesign due to different package and power delivery; the XC7VX690T-2FFG1927I offers greater logic density and extended temperature support while maintaining similar I/O voltage flexibility and transceiver protocol coverage.
Availability
XC6VLX75T-1FFG784C is available at Aetrix Electronics and suitable for wireless infrastructure, high-speed networking, and medical imaging systems requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX75T-1FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-6 family was designed for high-bandwidth, low-latency wired infrastructure applications-specifically targeting 10G Ethernet, PCIe Gen2, and wireless baseband where deterministic timing and transceiver integration are critical.
FAQ
What is the maximum supported transceiver data rate for XC6VLX75T-1FFG784C?
The XC6VLX75T-1FFG784C supports transceiver data rates up to 12.8 Gb/s per lane using its GTX transceivers. This enables compliance with 10GBASE-R, PCIe Gen2, and SATA 3.0 standards. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margins measured during hardware validation.
Does XC6VLX75T-1FFG784C include a hard PCIe Gen2 endpoint block?
Yes, XC6VLX75T-1FFG784C integrates a hard PCIe Gen2 Endpoint block supporting x1, x2, x4, and x8 link widths. It implements the physical, data link, and transaction layers, reducing logic resource usage and ensuring deterministic latency compared to soft-core implementations.
What I/O standards are supported by XC6VLX75T-1FFG784C?
XC6VLX75T-1FFG784C supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS, BLVDS, and RSDS. I/O banks operate from 1.2V to 1.8V, enabling direct interface with DDR3, QDR-II+, and SERDES peripherals without external level shifters.
Is partial reconfiguration supported on XC6VLX75T-1FFG784C?
Yes, XC6VLX75T-1FFG784C supports partial reconfiguration through Xilinx ISE and Vivado toolchains. This allows dynamic replacement of functional modules-such as protocol engines or filter coefficients-without resetting the entire device or disrupting active I/O operations.
What is the operating temperature range for XC6VLX75T-1FFG784C?
XC6VLX75T-1FFG784C is rated for industrial temperature operation from 0°C to +85°C ambient. This range is guaranteed under the -1 speed grade with proper thermal management, including heatsink mounting and airflow per Xilinx UG372 guidelines.
XC6VLX75T-1FFG784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 360
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX75T-1FFG784C FAQ
1.How can I place an order for XC6VLX75T-1FFG784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX75T-1FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX75T-1FFG784C reliable?
The price and inventory of XC6VLX75T-1FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-1FFG784C is usually 5 days.
3.What payment methods are accepted for XC6VLX75T-1FFG784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-1FFG784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX75T-1FFG784C?
XC6VLX75T-1FFG784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX75T-1FFG784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX75T-1FFG784C?
For technical support, including XC6VLX75T-1FFG784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-1FFG784C requirements.
6.How does Aetrix verify that XC6VLX75T-1FFG784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX75T-1FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-1FFG784C meets industry standards.
7.What is the process for return or replacement of XC6VLX75T-1FFG784C?
All XC6VLX75T-1FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-1FFG784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX75T-1FFG784C part is unused and in its original packaging.
Return procedure for XC6VLX75T-1FFG784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6VLX75T-1FFG784C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
