AMD XC6VLX75T-1FFG784I

Overview

XC6VLX75T-1FFG784I from AMD (formerly Xilinx) is a Virtex-6 FPGA with 74,496 logic cells, 12.8 Gb/s transceiver capability, and -1 speed grade operating at industrial temperature range (-40°C to +100°C). It integrates 36-Kb block RAM, DSP48E1 slices, and PCIe Gen2 x8 endpoint support, deployed in high-bandwidth wired infrastructure line cards.

For engineers reviewing the XC6VLX75T-1FFG784I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver compliance (ANSI TIA/EIA-644-A), I/O voltage support (1.2 V to 3.3 V), thermal performance under sustained 2.5 W dynamic power, and configuration interface options (JTAG, SelectMAP, SPI).

Technical Context

The XC6VLX75T-1FFG784I implements a hierarchical FPGA architecture with CLB-based logic fabric, dedicated 18×25 multiplier blocks, and integrated GTX transceivers supporting 600 Mb/s to 6.6 Gb/s serial rates. It features dual-register LUTs, carry chains for arithmetic, and clock management tiles with MMCM and PLL.

Configuration occurs via Master SelectMAP or JTAG using external SPI flash or PROM; bitstream security includes AES-256 encryption and HMAC authentication. The device supports partial reconfiguration and IEEE 1149.1 boundary-scan testing.

Key Specifications

Pinout & Package

XC6VLX75T-1FFG784I is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Thermal characteristics include θ_JA = 12.5°C/W and θ_JB = 3.2°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based infrastructure applications.

Compared with XC6VLX75T-1FFG784I, the XC6VLX130T-1FFG1156I offers scalable logic and transceiver count within the same Virtex-6 family but demands board redesign, while the XCKU040-1FBVA676I delivers generational improvements in speed and integration at the cost of architectural discontinuity and toolchain requalification.

Availability

XC6VLX75T-1FFG784I is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX75T-1FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client applications through its acquisition of Xilinx.

The Virtex-6 family was engineered for high-performance wired infrastructure, emphasizing transceiver bandwidth, deterministic timing, and industrial reliability in carrier-grade networking and signal processing systems.

FAQ

What is the maximum supported transceiver data rate for XC6VLX75T-1FFG784I?

The XC6VLX75T-1FFG784I supports GTX transceivers with a maximum data rate of 6.6 Gb/s, compliant with ANSI TIA/EIA-644-A standards. This enables implementation of PCIe Gen2, SATA II, and SRIO Gen2 interfaces. The XC6VLX75T-1FFG784I achieves this rate with built-in clock recovery and equalization circuitry, and requires proper PCB impedance control and reference clock stability below 100 ppm.

Does XC6VLX75T-1FFG784I support partial reconfiguration?

Yes, XC6VLX75T-1FFG784I supports partial reconfiguration through Xilinx ISE Design Suite tools and dedicated configuration logic. This allows dynamic replacement of functional modules without resetting the entire device. The XC6VLX75T-1FFG784I requires specific floorplanning, modular HDL design, and encrypted bitstream partitioning to ensure safe runtime updates in mission-critical systems.

What configuration modes are available for XC6VLX75T-1FFG784I?

XC6VLX75T-1FFG784I supports Master SelectMAP, Slave SelectMAP, JTAG, and Slave Serial configuration modes, selected via M0–M2 pins. The XC6VLX75T-1FFG784I can load configuration from SPI flash (Master SelectMAP), external processor (Slave SelectMAP), or boundary-scan controller (JTAG), with INIT_B and DONE signals providing status feedback during boot.

Is XC6VLX75T-1FFG784I qualified for industrial temperature operation?

Yes, XC6VLX75T-1FFG784I is rated for industrial temperature range (-40°C to +100°C) and tested per Xilinx qualification standards. The XC6VLX75T-1FFG784I maintains full timing compliance and I/O voltage specifications across this range, with thermal design requiring attention to θ_JA = 12.5°C/W and recommended heatsink mounting for sustained >2 W power dissipation.

What clock management resources does XC6VLX75T-1FFG784I include?

XC6VLX75T-1FFG784I integrates two Mixed-Mode Clock Managers (MMCM) and one Phase-Locked Loop (PLL) per clock region. These provide jitter filtering, frequency synthesis, phase shifting, and duty-cycle correction. The XC6VLX75T-1FFG784I uses these resources to generate multiple synchronous clock domains for transceivers, memory interfaces, and logic fabric, with MMCM output jitter as low as 150 fs RMS.