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AMD XC6VLX75T-2FF484C
- Part No.:
- XC6VLX75T-2FF484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC6VLX75T-2FF484C.pdf
- Description:
- IC FPGA 240 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,283
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Product details
Overview
XC6VLX75T-2FF484C from AMD (formerly Xilinx) is a Virtex-6 FPGA with 74,496 logic cells, 12.8 Gb/s transceiver capability, and 1.2 V core voltage, deployed in high-speed serial interface and DSP-intensive embedded systems.
For engineers reviewing the XC6VLX75T-2FF484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (364 user I/Os), transceiver lane count (16 lanes), LVDS support, and -2 speed grade timing performance.
Technical Context
The XC6VLX75T-2FF484C implements a 40 nm FPGA architecture with integrated multi-gigabit transceivers (MGTs), block RAM (4,824 kbits), and DSP48E1 slices (320 units). It supports PCIe Gen1/Gen2, SATA, and SRIO protocols via its transceivers.
Configuration is performed via JTAG or SelectMAP interface; configuration memory is external. The device uses HSTL, SSTL, and LVCMOS I/O standards across its 364 user I/O pins with programmable slew rate and drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - determines maximum combinational and sequential logic capacity for RTL implementation |
| User I/O Pins | 364 - supports high-density parallel bus interfaces and multi-standard I/O banking |
| Transceiver Lanes | 16 - enables dual x4 PCIe Gen2 links or eight SATA 3 Gb/s channels |
| Block RAM | 4,824 kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external memory |
| DSP Slices | 320 - accelerates fixed-point multiply-accumulate operations in signal processing pipelines |
| Speed Grade | -2 - guarantees timing closure at worst-case industrial temperature (0–85°C) and 1.2 V supply |
Pinout & Package
XC6VLX75T-2FF484C is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG484) package with 25 mm × 25 mm footprint and 1.0 mm ball pitch. I/O banks are grouped into eight banks supporting mixed-voltage operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK0P/N | Differential reference clock input | Provides low-jitter clock source for transceiver PLLs; requires matched 100 Ω differential termination |
| IO_L0N_0 | User I/O bank 0, negative differential pair | Configurable as LVDS, TMDS, or single-ended; supports programmable drive strength up to 24 mA |
| CCLK | Configuration clock output | Generated during master SPI configuration; used to clock external PROM data into FPGA |
| INIT_B | Configuration status indicator | Active-low open-drain signal indicating configuration memory readiness or error condition |
| GND & VCCINT | Power terminals | VCCINT = 1.2 V core supply; multiple dedicated power/ground balls per bank ensure low-noise switching |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MGTs | 16 transceiver lanes operating up to 6.6 Gb/s with built-in 8B/10B encoding and elastic buffers |
| PCIe Endpoint Support | Hard IP blocks for PCIe Gen1/Gen2 x1, x2, x4 configurations reduce soft logic overhead and latency |
| Partial Reconfiguration | Enables dynamic module swapping without full device reset-critical for runtime protocol adaptation |
| Advanced Clock Management | Eight DCMs and two PLLs per device provide jitter filtering, frequency synthesis, and phase alignment across domains |
| Multi-Voltage I/O Banks | Eight independent I/O banks support concurrent 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling standards |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; transceivers interface with ADC/DAC FMC mezzanine cards. Use Value: 320 DSP48E1 slices deliver >200 GMAC/s throughput; -2 speed grade ensures deterministic timing under thermal stress. | Use Scenario: High-throughput image reconstruction pipeline in CT and MRI scanners. IC Role / Device Role / Timing Role: XC6VLX75T-2FF484C acts as co-processor for back-end filtering, interpolation, and DICOM packetization. Use Value: 364 user I/Os enable direct connection to multiple DDR3 memory controllers and GigE PHYs without glue logic. |
| Avionics Data Concentrator | Test & Measurement Instrumentation |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 bridging in flight control subsystems. IC Role / Device Role / Timing Role: Configurable logic implements protocol state machines; transceivers handle deterministic AFDX traffic shaping. Use Value: Integrated PCIe endpoint allows host CPU offload of packet classification and timestamping tasks. | Use Scenario: Modular PXIe chassis controller managing high-speed digitizer and arbitrary waveform generator modules. IC Role / Device Role / Timing Role: XC6VLX75T-2FF484C serves as real-time trigger sequencer and data aggregator across synchronized modules. Use Value: 16 transceiver lanes support simultaneous x4 PCIe Gen2 upstream + x4 downstream links for low-latency data streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVA676E | UltraScale architecture, 10 nm process, 114K logic cells, higher transceiver density (24 lanes @ 12.5 Gb/s) | Supports PCIe Gen3/Gen4 and coherent interconnects; requires updated toolchain (Vivado 2019.1+) | Preferred for new designs requiring higher bandwidth and lower power; not pin-compatible with XC6VLX75T-2FF484C |
| XC7VX690T-2FFG1927I | Virtex-7 architecture, 690K logic cells, 28 nm process, 36 transceiver lanes, -2I extended temp grade | Offers larger capacity and industrial temperature range; lacks native AFDX/MIL-STD-1553 hard IP | Used where logic density and extended temperature operation outweigh legacy protocol hard IP requirements |
Compared with XC6VLX75T-2FF484C, the XCVU3P-2FFVA676E delivers 53% more logic and double transceiver bandwidth but mandates architectural migration, while the XC7VX690T-2FFG1927I offers 830% more logic and wider temp range at the cost of increased board area and power draw.
Availability
XC6VLX75T-2FF484C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX75T-2FF484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Virtex product line as its flagship high-performance FPGA family for compute-intensive and protocol-rich systems.
The Virtex-6 family, including XC6VLX75T-2FF484C, was architected for applications demanding high-speed serial connectivity, deterministic real-time processing, and heterogeneous integration in aerospace, defense, and medical equipment.
FAQ
What is the maximum supported transceiver data rate for XC6VLX75T-2FF484C?
The XC6VLX75T-2FF484C supports transceiver data rates up to 6.6 Gb/s per lane. This rating applies to all 16 transceiver lanes and is validated under industrial temperature conditions with proper reference clock jitter compliance. The XC6VLX75T-2FF484C achieves this using its GTP transceiver architecture with integrated CDR and 8B/10B encoding.
Does XC6VLX75T-2FF484C include hard IP for PCI Express?
Yes, XC6VLX75T-2FF484C integrates dedicated PCIe endpoint hard IP blocks supporting Gen1 and Gen2 protocols at x1, x2, and x4 widths. These blocks implement the physical layer, data link layer, and transaction layer functions without consuming logic resources, enabling deterministic latency and reduced design effort compared to soft-core implementations.
What configuration modes does XC6VLX75T-2FF484C support?
XC6VLX75T-2FF484C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Configuration bitstream loading occurs via dedicated configuration pins (CCLK, DIN, INIT_B, DONE), with external flash memory typically used for passive serial or BPI mode. The XC6VLX75T-2FF484C does not support internal configuration memory.
Is XC6VLX75T-2FF484C qualified for extended temperature operation?
No, XC6VLX75T-2FF484C is rated for commercial temperature range (0°C to +85°C) only, as indicated by the 'C' suffix in the part number. For extended industrial operation (-40°C to +100°C), the 'I' grade variant XC6VLX75T-2FF484I must be selected. Thermal derating and timing closure validation are required when operating near upper limits.
How many block RAM columns does XC6VLX75T-2FF484C contain?
XC6VLX75T-2FF484C contains 128 block RAM columns, each providing 36 kbits of dual-port memory. These are organized as 18-kbit primitives (BRAM18K) that can be cascaded into 36-kbit configurations. Total usable block RAM capacity is 4,824 kbits, accessible with independent read/write clocks and programmable write width.
XC6VLX75T-2FF484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC6VLX75T-2FF484C FAQ
1.How can I place an order for XC6VLX75T-2FF484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX75T-2FF484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX75T-2FF484C reliable?
The price and inventory of XC6VLX75T-2FF484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-2FF484C is usually 5 days.
3.What payment methods are accepted for XC6VLX75T-2FF484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-2FF484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX75T-2FF484C?
XC6VLX75T-2FF484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX75T-2FF484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX75T-2FF484C?
For technical support, including XC6VLX75T-2FF484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-2FF484C requirements.
6.How does Aetrix verify that XC6VLX75T-2FF484C is sourced from the original manufacturer or authorized distributors?
All XC6VLX75T-2FF484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-2FF484C meets industry standards.
7.What is the process for return or replacement of XC6VLX75T-2FF484C?
All XC6VLX75T-2FF484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-2FF484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX75T-2FF484C part is unused and in its original packaging.
Return procedure for XC6VLX75T-2FF484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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