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AMD XC6VLX75T-2FFG484C
- Part No.:
- XC6VLX75T-2FFG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX75T-2FFG484C.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,952
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Product details
Overview
XC6VLX75T-2FFG484C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 74,496 logic cells, 12.8 Gb/s transceiver capability, and embedded Block RAM totaling 3,556 kbits. It implements high-speed serial I/O in telecom line cards and supports PCIe Gen2 x8 endpoint functionality.
For engineers reviewing the XC6VLX75T-2FFG484C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O standard support (LVDS, SSTL, HSTL), static timing analysis constraints, and thermal management for 484-pin flip-chip BGA packaging.
Technical Context
The XC6VLX75T-2FFG484C integrates 16 RocketIO GTP transceivers operating up to 3.75 Gb/s per lane, with dedicated clocking resources including MMCM and PLL blocks supporting jitter filtering and frequency synthesis. It uses 40 nm copper process technology and supports partial reconfiguration.
Configurable I/O banks support 1.2 V to 3.3 V signaling with programmable drive strength, slew rate, and on-die termination. The device includes 240 DSP48E1 slices for arithmetic-intensive tasks and supports IEEE 1149.1 JTAG boundary-scan testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - total configurable logic resources for LUT-based combinatorial and sequential logic implementation |
| Block RAM | 3,556 kbits - distributed memory capacity usable as true dual-port RAM or FIFO buffers |
| GTP Transceivers | 16 lanes - each supports 600 Mb/s to 3.75 Gb/s data rates for serial protocols including SATA and PCIe Gen2 |
| DSP Slices | 240 × DSP48E1 - fixed-point arithmetic units with 25×18 multipliers and 48-bit accumulators |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II, LVCMOS - supports mixed-voltage interface design across 16 I/O banks |
| Package | FFG484 - 484-pin flip-chip BGA with 25 mm × 25 mm body and 1.0 mm pitch, RoHS-compliant |
| Speed Grade | -2 - worst-case timing performance guarantee at industrial temperature range (–40°C to +100°C) |
Pinout & Package
XC6VLX75T-2FFG484C is housed in a 484-pin flip-chip BGA (FFG484) package with 25 mm × 25 mm footprint, 1.0 mm ball pitch, and thermal pad on underside for enhanced heat dissipation. Pin functions are bank-specific and voltage-referenced.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, JTAG, and transceiver reference circuitry |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank; sets output voltage level and compatible I/O standards |
| MRCC / SRCC | Multi-/Single-ended clock input | Dedicated differential clock inputs feeding global clock networks with low skew |
| GTxP/N | Transceiver differential pair | High-speed serial I/O pins supporting CDR, 8B/10B encoding, and protocol-specific electrical compliance |
| PROGRAM_B | Configuration reset | Active-low asynchronous signal initiating FPGA reconfiguration from external source or flash |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in runtime-adaptive systems |
| Integrated PCIe Endpoint Logic | Hard IP block implementing PCIe Gen2 x8 endpoint functionality, eliminating need for external bridge ICs |
| MMCM and PLL Clock Management | On-chip clock synthesis with phase alignment, jitter filtering, and frequency multiplication/division for multi-domain timing |
| Advanced Configuration Security | Bitstream encryption using AES-256 and HMAC authentication prevents unauthorized configuration and cloning |
| Thermal Monitoring Diode | On-die diode enables real-time junction temperature measurement via external ADC for thermal throttling control |
Applications
| Wireless Baseband Processing | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Real-time baseband signal processing in LTE-Advanced macrocell base stations requiring adaptive modulation and MIMO channel estimation. IC Role / Device Role / Timing Role: FPGA fabric executes custom DSP kernels; transceivers interface with RFICs via JESD204B; clocking subsystem synchronizes sampling and symbol timing. Use Value: 16 GTP lanes enable four independent JESD204B links (each at 3.125 Gbps), supporting 8×8 MIMO antenna arrays with deterministic latency. | Use Scenario: High-throughput CT scanner data path handling raw detector output at >1 GSPS aggregate rate. IC Role / Device Role / Timing Role: XC6VLX75T-2FFG484C aggregates parallel ADC streams, performs real-time beamforming correction, and formats data for PCI Express host transfer. Use Value: 240 DSP48E1 slices execute floating-point-to-fixed-point conversion and convolution kernels within sub-microsecond latency. |
| Avionics Data Concentrator Unit | Industrial Machine Vision Controller |
Use Scenario: ARINC 664 (AFDX) end-system node consolidating sensor data from flight control, navigation, and environmental systems. IC Role / Device Role / Timing Role: Implements AFDX virtual link scheduler, CRC generation, and redundant port switching; uses deterministic timing engine for sub-10 µs latency guarantees. Use Value: -2 speed grade ensures timing closure at 100°C ambient, meeting DO-254 Level A hardware design assurance requirements. | Use Scenario: Embedded vision controller synchronizing multi-camera capture, executing CNN inference pre-processing, and streaming results over GigE Vision. IC Role / Device Role / Timing Role: Configures I/O banks for Camera Link and SLVS-EC interfaces; runs pixel-level image enhancement pipelines in logic fabric. Use Value: 16 I/O banks allow simultaneous support of 4× Camera Link Full (24-bit) and 2× SLVS-EC (1.2 Gbps) interfaces with independent voltage domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX130T-2FFG784C | Higher logic density (128,000 LC), 24 GTP lanes, larger FFG784 package (29 mm × 29 mm) | Required for designs needing >74K LC or >16 transceiver lanes; not pin-compatible | Select when additional DSP slices, Block RAM, or transceiver count exceeds XC6VLX75T-2FFG484C capacity |
| XC7K325T-2FFG901I | Kintex-7 architecture; 326,000 logic cells, 20 GTP transceivers, -2I industrial temp grade | Offers higher performance per watt and integrated PCIe Gen3 x8; requires migration effort due to different toolchain and pinout | Choose for new designs targeting lower power, higher bandwidth, or Gen3 protocol support; not drop-in replaceable |
Compared with XC6VLX75T-2FFG484C, the XC6VLX130T-2FFG784C scales logic and transceiver resources in the same Virtex-6 family, while the XC7K325T-2FFG901I represents a generational shift to 28 nm Kintex-7 with improved DSP efficiency and Gen3 serial I/O-both require PCB and firmware redesign.
Availability
XC6VLX75T-2FFG484C is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging equipment, avionics data concentrators, and industrial machine vision controllers requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX75T-2FFG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software-defined hardware solutions.
The Virtex-6 family was originally designed by Xilinx for high-end applications demanding high logic density, multi-gigabit serial connectivity, and deterministic real-time processing in wired/wireless infrastructure and defense systems.
FAQ
What is the maximum supported transceiver data rate for XC6VLX75T-2FFG484C?
The XC6VLX75T-2FFG484C supports RocketIO GTP transceivers operating from 600 Mb/s up to 3.75 Gb/s per lane. This enables compliance with PCIe Gen2, SATA II, and XAUI protocols. The actual achievable rate depends on board layout, reference clock stability, and signal integrity margins verified during IBIS-AMI simulation.
Does XC6VLX75T-2FFG484C support partial reconfiguration?
Yes, XC6VLX75T-2FFG484C supports partial reconfiguration through its configuration port interface and hierarchical design flow in Vivado Design Suite. This allows dynamic replacement of logic modules without resetting the entire device, critical for applications like adaptive radio protocols and real-time fault recovery systems.
What I/O standards are supported by XC6VLX75T-2FFG484C?
XC6VLX75T-2FFG484C supports LVDS, SSTL-18/25, HSTL-I/II, LVCMOS, and differential HSTL across 16 configurable I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V, enabling mixed-standard interfaces such as DDR3 memory controllers alongside high-speed serial links.
Is XC6VLX75T-2FFG484C qualified for industrial temperature operation?
Yes, the -2 speed grade of XC6VLX75T-2FFG484C is rated for industrial temperature range (–40°C to +100°C). This qualification includes characterization of timing parameters, power consumption, and configuration reliability across the full thermal envelope, making it suitable for harsh-environment deployments.
What configuration modes does XC6VLX75T-2FFG484C support?
XC6VLX75T-2FFG484C supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. It can load bitstreams from SPI flash, BPI flash, or external processors via parallel or serial interfaces, with fallback mechanisms for field-upgradable and fail-safe deployment scenarios.
XC6VLX75T-2FFG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX75T-2FFG484C FAQ
1.How can I place an order for XC6VLX75T-2FFG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX75T-2FFG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX75T-2FFG484C reliable?
The price and inventory of XC6VLX75T-2FFG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-2FFG484C is usually 5 days.
3.What payment methods are accepted for XC6VLX75T-2FFG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-2FFG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX75T-2FFG484C?
XC6VLX75T-2FFG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX75T-2FFG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX75T-2FFG484C?
For technical support, including XC6VLX75T-2FFG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-2FFG484C requirements.
6.How does Aetrix verify that XC6VLX75T-2FFG484C is sourced from the original manufacturer or authorized distributors?
All XC6VLX75T-2FFG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-2FFG484C meets industry standards.
7.What is the process for return or replacement of XC6VLX75T-2FFG484C?
All XC6VLX75T-2FFG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-2FFG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX75T-2FFG484C part is unused and in its original packaging.
Return procedure for XC6VLX75T-2FFG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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