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AMD XC6VLX75T-2FFG484I
- Part No.:
- XC6VLX75T-2FFG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX75T-2FFG484I.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,004
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Product details
Overview
XC6VLX75T-2FFG484I from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 74,496 logic cells, 12.8 Gb/s transceiver capability, and -2 speed grade in a 484-pin FCBGA package. It integrates Block RAM, DSP48E1 slices, and PCI Express® Gen1/Gen2 endpoints for high-performance digital signal processing and protocol acceleration in wired infrastructure.
For engineers reviewing the XC6VLX75T-2FFG484I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (XAUI, SATA, PCIe), I/O bank voltage flexibility (1.2 V to 3.3 V), and thermal performance under sustained 2.5 W dynamic power at 85°C junction temperature.
Technical Context
The XC6VLX75T-2FFG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 18×25 multiplier-based DSP48E1 slices, and integrated 6.6 Gb/s multi-gigabit transceivers supporting protocols including PCIe Gen2 x8 and Serial RapidIO. Its SelectIO™ technology supports single-ended and differential standards across 12 I/O banks.
It uses 40 nm bulk CMOS process technology, includes dual-register flip-flops per LUT, and supports partial reconfiguration via ICAP interface. Configuration is performed through JTAG, Master SelectMAP, or SPI interfaces with AES encryption support for bitstream security.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - total programmable resources for complex state machines and datapaths |
| Transceiver Speed | 6.6 Gb/s - supports PCIe Gen2 x8 and Serial RapidIO 2.1 physical layer |
| Block RAM | 3,528 kbits - distributed memory for FIFOs, buffers, and lookup tables |
| DSP Slices | 168 × DSP48E1 - 25×18 signed multiplication with pre-adder and pipeline registers |
| I/O Pins | 240 user-configurable - supports LVCMOS, LVDS, SSTL, HSTL across 12 banks |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Package | FFG484 - 484-pin Fine-Pitch Flip-Chip BGA, 23×23 mm, 1.0 mm pitch |
Pinout & Package
XC6VLX75T-2FFG484I is housed in a 484-pin Fine-Pitch Flip-Chip BGA (FFG484) package with 240 user I/O pins distributed across 12 selectable I/O banks. Thermal pad on underside requires solder paste stencil design per Xilinx UG373.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V ±3% required for CLB and routing fabric; decoupling critical below 100 MHz operation |
| VCCAUX | Auxiliary supply | 2.5 V ±3% powers configuration logic, clock management, and transceivers |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V per bank; sets output swing and input threshold for associated pins |
| M0–M2 | Mode pins | Set configuration mode at power-up: JTAG, Master SelectMAP, or SPI |
| INIT_B | Status indicator | Open-drain active-low signal indicating configuration status and bitstream validity |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint | Integrated hard IP supporting x1/x2/x4/x8 link widths with LTSSM and TLP handling |
| Partial Reconfiguration | Enables dynamic module swapping without full device reset via ICAP interface |
| Multi-Gigabit Transceivers | 24 transceivers with built-in CDR, 8B/10B encoding, and PRBS pattern generation |
| SelectIO Technology | Supports 21 I/O standards including LVDS DCI, SSTL-18, and HSTL-I with programmable drive strength |
| AES Bitstream Encryption | 256-bit key protection prevents unauthorized readback and cloning of configuration data |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation and MIMO signal processing in LTE-A and 5G NR base stations. IC Role / Device Role / Timing Role: Programmable baseband accelerator offloading DSP tasks from host processor; provides deterministic latency via fixed-pipeline logic. Use Value: Enables 4×200 MHz carrier aggregation with sub-100 ns timing alignment across RF chains using deterministic transceiver lanes. | Use Scenario: High-speed digital pattern generation and acquisition in automated test equipment (ATE) for SoC validation. IC Role / Device Role / Timing Role: Reconfigurable stimulus engine synchronizing multiple 1.25 Gb/s parallel data streams with <15 ps channel-to-channel skew. Use Value: Achieves 12-bit analog-equivalent resolution in digital sampling through synchronized DDR I/O and internal delay calibration. |
| Avionics Data Concentrators | Industrial Imaging Systems |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control networks. IC Role / Device Role / Timing Role: Deterministic packet switch implementing time-triggered scheduling and redundancy management. Use Value: Guarantees ≤2 µs end-to-end latency with zero packet loss under 100% sustained 100 Mbps load per port. | Use Scenario: Real-time image preprocessing and compression in medical endoscopy and machine vision cameras. IC Role / Device Role / Timing Role: Pipeline-based image filter engine performing Bayer demosaicing, gamma correction, and JPEG entropy coding. Use Value: Processes 4K@60 fps raw sensor data with <3 line buffering depth using embedded Block RAM and DSP slices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture, 258K LUTs, 16.3 Gb/s transceivers, 2104-pin FC-BGA | Higher bandwidth and density; requires PCB redesign and new thermal solution | Choose for new designs requiring >10 Gb/s serial links or >100K logic cells |
| XC6VLX130T-2FFG1156I | Larger footprint (1156-pin), 128K logic cells, same -2 speed grade and transceiver spec | Same architecture and toolchain; supports higher gate count but increases board area and cost | Choose when XC6VLX75T-2FFG484I resource margin falls below 15% in synthesis |
Compared with XC6VLX75T-2FFG484I, the XCVU9P-2FLGA2104I delivers 2.3× more logic and 2.5× faster transceivers but demands new layout and power delivery; the XC6VLX130T-2FFG1156I offers direct architectural compatibility with 72% more logic cells at the cost of 137% larger package area.
Availability
XC6VLX75T-2FFG484I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC6VLX75T-2FFG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms based on FPGA, ACAP, and software-defined hardware architectures.
The Virtex-6 family was designed for high-throughput, low-latency signal processing in wired communications, military systems, and scientific instrumentation where deterministic timing and protocol integration are critical.
FAQ
What is the maximum supported transceiver data rate for XC6VLX75T-2FFG484I?
The XC6VLX75T-2FFG484I supports transceiver data rates up to 6.6 Gb/s per lane, enabling compliance with PCIe Gen2 x8, Serial RapidIO 2.1, and XAUI standards. This rate is guaranteed across industrial temperature range (-40°C to +100°C) when configured with appropriate reference clocks and termination.
Does XC6VLX75T-2FFG484I support partial reconfiguration?
Yes, XC6VLX75T-2FFG484I supports partial reconfiguration through its Internal Configuration Access Port (ICAP). This allows dynamic replacement of functional modules without resetting the entire device, enabling runtime adaptation in radar beamforming and protocol gateway applications.
What configuration modes are available for XC6VLX75T-2FFG484I?
XC6VLX75T-2FFG484I supports three primary configuration modes: JTAG for debugging and programming, Master SelectMAP for parallel loading from external flash, and SPI for serial bitstream loading. Mode selection is controlled by M0–M2 pins at power-up.
Is XC6VLX75T-2FFG484I qualified for automotive applications?
No, XC6VLX75T-2FFG484I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It is intended for telecom infrastructure, test equipment, and avionics-not automotive ECUs or ADAS control units.
What I/O standards does XC6VLX75T-2FFG484I support?
XC6VLX75T-2FFG484I supports 21 I/O standards including LVCMOS, LVDS, SSTL-18, HSTL-I, and differential signaling with internal termination. Each of its 12 I/O banks can be independently configured for voltage levels from 1.2 V to 3.3 V.
XC6VLX75T-2FFG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX75T-2FFG484I FAQ
1.How can I place an order for XC6VLX75T-2FFG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX75T-2FFG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX75T-2FFG484I reliable?
The price and inventory of XC6VLX75T-2FFG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-2FFG484I is usually 5 days.
3.What payment methods are accepted for XC6VLX75T-2FFG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-2FFG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX75T-2FFG484I?
XC6VLX75T-2FFG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX75T-2FFG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX75T-2FFG484I?
For technical support, including XC6VLX75T-2FFG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-2FFG484I requirements.
6.How does Aetrix verify that XC6VLX75T-2FFG484I is sourced from the original manufacturer or authorized distributors?
All XC6VLX75T-2FFG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-2FFG484I meets industry standards.
7.What is the process for return or replacement of XC6VLX75T-2FFG484I?
All XC6VLX75T-2FFG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-2FFG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX75T-2FFG484I part is unused and in its original packaging.
Return procedure for XC6VLX75T-2FFG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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