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AMD XC6VLX75T-2FFG784C
- Part No.:
- XC6VLX75T-2FFG784C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 784-BBGA, FCBGA
- Datasheet:
-
XC6VLX75T-2FFG784C.pdf
- Description:
- IC FPGA 360 I/O 784FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,856
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Product details
Overview
XC6VLX75T-2FFG784C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 74,496 logic cells, 12.8 Gb/s transceiver capability, and 1.2 V core voltage in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. It serves as a high-performance programmable logic fabric for reconfigurable digital signal processing in radar baseband systems.
For engineers reviewing the XC6VLX75T-2FFG784C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, CLB count, I/O bank voltage support, and thermal performance under sustained 2.0 ns clock timing.
Technical Context
The XC6VLX75T-2FFG784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), DSP48E1 slices, and multi-gigabit transceivers (MGTs). It supports PCIe Gen2 x8, SATA II, and SRIO 1.2 protocols via its 16 transceiver lanes.
It integrates SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS signaling across 16 I/O banks, with dedicated clock management tiles (CMTs) containing DCMs and PLLs for jitter reduction and phase alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Transceiver Speed | 12.8 Gb/s - maximum line rate per MGT lane, enabling 10G Ethernet and CPRI interfaces |
| Block RAM | 3,328 kbits - on-chip memory for FIFOs, buffers, or lookup tables without external memory access |
| DSP Slices | 168 - fixed-point arithmetic units optimized for multiply-accumulate operations in filter and FFT engines |
| I/O Pins | 408 - user-configurable single-ended or differential I/Os distributed across 16 banks with independent voltage support |
| Core Voltage | 1.2 V ±3% - required supply for CLB and interconnect operation; impacts dynamic power and thermal design |
Pinout & Package
XC6VLX75T-2FFG784C is housed in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply to CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8 V supply to configuration circuitry, JTAG, and select I/O banks |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3 V output driver supply for Bank 0; sets compatible interface standards |
| MGTAVCC | Transceiver analog supply | 1.2 V analog rail for MGT PLLs and serializers; sensitive to ripple and noise |
| CLK_IN | Primary clock input | Dedicated differential input for system reference clock feeding CMTs and transceivers |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP enables direct connection to host CPU without external bridge logic or firmware overhead |
| DSP48E1 Slices | 168 dedicated arithmetic units deliver 215 GMAC/s peak throughput for real-time radar pulse compression |
| SelectIO Technology | Supports 21 I/O standards including LVDS DCI and SSTL-18 with programmable drive strength and slew rate |
| Multi-Mode Clock Management | Each CMT contains two DCMs and one PLL for simultaneous frequency synthesis, phase shifting, and jitter filtering |
| Transceiver Calibration | Automatic calibration of MGT analog front-end at power-up ensures consistent 12.8 Gb/s link margin across temperature |
Applications
| Radar Baseband Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Reconfigurable signal processor handling ADC data ingestion, FIR filtering, and FFT computation at 200 MSPS. Use Value: 168 DSP48E1 slices enable 128-channel beamformer with sub-microsecond latency and deterministic timing. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backends. IC Role / Device Role / Timing Role: Data concentrator and parallel accelerator interfacing with 32-channel ADCs and DDR3 memory subsystems. Use Value: 408 I/O pins support concurrent LVDS camera links and DDR3-1066 memory interface with matched trace routing. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 and MIL-STD-1553 protocol bridging in flight control data networks. IC Role / Device Role / Timing Role: Protocol-aware packet router with deterministic latency and time-stamped message queuing. Use Value: Dual CMTs provide independent clock domains for 100 MHz ARINC and 12.5 MHz 1553 interfaces with zero-jitter synchronization. | Use Scenario: Bit-error-rate tester (BERT) pattern generation and analysis at 10.3125 Gb/s. IC Role / Device Role / Timing Role: Programmable PRBS generator and error detector using MGT TX/RX lanes and internal loopback paths. Use Value: On-die 12.8 Gb/s transceivers eliminate external retimers, reducing test head complexity and jitter accumulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture; 1.4× higher logic density, 16.3 Gb/s transceivers, 0.85 V core | Supports PCIe Gen4 and 25G Ethernet; requires updated PCB stackup and power delivery | Preferred for new designs targeting >10-year lifecycle and higher bandwidth scalability |
| XC7VX690T-2FFG1927I | Virtex-7 generation; 690K logic cells, 28 nm process, no built-in PCIe hard IP | Lacks native PCIe Gen3 endpoint; relies on soft IP or external controller for host interface | Suitable when legacy toolchain compatibility and mature silicon qualification are prioritized over transceiver integration |
Compared with XC6VLX75T-2FFG784C, the XCVU9P offers higher bandwidth and lower power per function but demands newer tooling and layout practices, while the XC7VX690T provides proven reliability and broader vendor support at the cost of transceiver flexibility and logic efficiency.
Availability
XC6VLX75T-2FFG784C is available at Aetrix Electronics and suitable for radar systems, medical imaging equipment, and avionics data concentrators requiring stable component supply across extended production cycles.
Supply support for XC6VLX75T-2FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Virtex-6 family was designed for high-bandwidth, low-latency reconfigurable computing in aerospace, defense, and high-end instrumentation applications where signal integrity and thermal stability are critical.
FAQ
What is the maximum supported transceiver line rate for XC6VLX75T-2FFG784C?
The XC6VLX75T-2FFG784C supports a maximum transceiver line rate of 12.8 Gb/s per lane. This specification is validated across commercial temperature range (0°C to 85°C) and enables compliance with CPRI Option 10, 10GBASE-R, and SRIO 1.2 standards. The XC6VLX75T-2FFG784C achieves this using calibrated analog front-end circuitry and integrated clock data recovery (CDR) with adaptive equalization.
Does XC6VLX75T-2FFG784C include hard IP for PCIe Gen2?
Yes, XC6VLX75T-2FFG784C integrates hard PCIe Gen2 x8 endpoint logic compliant with PCI Express Base Specification v2.0. This eliminates the need for soft-core implementations and reduces resource utilization by ~12,000 LUTs. The XC6VLX75T-2FFG784C supports both root complex and endpoint configurations through configuration space registers and AXI-Stream interfaces.
What I/O standards are supported by XC6VLX75T-2FFG784C?
XC6VLX75T-2FFG784C supports 21 I/O standards including LVDS, SSTL-18, HSTL-I, TMDS, and Differential Signaling with Digital Controlled Impedance (DCI). Each of its 16 I/O banks operates independently, allowing mixed-voltage interfaces such as 1.8 V LVDS alongside 3.3 V LVTTL on the same device. The XC6VLX75T-2FFG784C implements programmable drive strength and slew rate control per bank.
What is the operating temperature grade for XC6VLX75T-2FFG784C?
The XC6VLX75T-2FFG784C is rated for commercial temperature operation (0°C to +85°C ambient), indicated by the 'C' suffix in the part number. It meets JEDEC JESD22-A104 reliability testing for thermal cycling and is qualified for use in non-extended-environment industrial systems. The XC6VLX75T-2FFG784C thermal design requires attention to FC-FBGA solder joint reliability under repeated power cycling.
How many block RAMs does XC6VLX75T-2FFG784C contain?
XC6VLX75T-2FFG784C contains 360 block RAM primitives, each configurable as 36 Kbits dual-port RAM or 18 Kbits single-port RAM, totaling 3,328 kbits of on-chip memory. These BRAMs support byte-write enable, parity generation, and synchronous read/write with independent clocks per port. The XC6VLX75T-2FFG784C uses BRAMs for deep buffering in radar pulse compression pipelines and video frame storage.
XC6VLX75T-2FFG784C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 784-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 360
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 784-FCBGA (29x29)
XC6VLX75T-2FFG784C FAQ
1.How can I place an order for XC6VLX75T-2FFG784C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX75T-2FFG784C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX75T-2FFG784C reliable?
The price and inventory of XC6VLX75T-2FFG784C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-2FFG784C is usually 5 days.
3.What payment methods are accepted for XC6VLX75T-2FFG784C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-2FFG784C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX75T-2FFG784C?
XC6VLX75T-2FFG784C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX75T-2FFG784C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX75T-2FFG784C?
For technical support, including XC6VLX75T-2FFG784C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-2FFG784C requirements.
6.How does Aetrix verify that XC6VLX75T-2FFG784C is sourced from the original manufacturer or authorized distributors?
All XC6VLX75T-2FFG784C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-2FFG784C meets industry standards.
7.What is the process for return or replacement of XC6VLX75T-2FFG784C?
All XC6VLX75T-2FFG784C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-2FFG784C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX75T-2FFG784C part is unused and in its original packaging.
Return procedure for XC6VLX75T-2FFG784C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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