AMD XC6VLX75T-2FFG784I

Overview

XC6VLX75T-2FFG784I from AMD (formerly Xilinx) is a Virtex-6 FPGA with 74,496 logic cells, 12.8 Gb/s transceiver capability, and -2 speed grade in a 784-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It serves as a high-performance programmable logic fabric for baseband processing in wireless infrastructure equipment.

For engineers reviewing the XC6VLX75T-2FFG784I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, CLB count, I/O voltage support (1.2 V to 3.3 V), and thermal performance in air-cooled 5G radio units.

Technical Context

The XC6VLX75T-2FFG784I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), DSP48E1 slices, and multi-gigabit transceivers (MGTs). It supports PCIe Gen2 x8, SRIO 2.1, and CPRI v6.1 protocols via dedicated hard IP.

Its -2 speed grade guarantees timing closure at 500 MHz system clock frequency with 1.0 V core supply and junction temperature up to 100°C. The FFG784 package provides 528 user I/Os across 18 banks with SelectIO™ technology supporting SSTL, HSTL, LVCMOS, and differential standards.

Key Specifications

Pinout & Package

XC6VLX75T-2FFG784I is housed in a 29×29 mm, 784-ball Flip-Chip Fine-Pitch BGA (FFG784) package with 1.0 mm ball pitch and thermal lid. The package supports reflow soldering per IPC/JEDEC J-STD-020D and includes dedicated VCCINT, VCCAUX, and VCCO power balls per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX75T-2FFG784I, the XCVU9P-2FLGA2104I enables protocol migration to 5G NR standalone, while the XC7VX690T-2FFG1927I extends lifetime support for LTE-Advanced deployments with minimal toolchain changes.

Availability

XC6VLX75T-2FFG784I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and medical ultrasound systems requiring stable component supply across extended product lifecycles.

Supply support for XC6VLX75T-2FFG784I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Virtex family as its flagship high-performance FPGA platform for compute-intensive edge and infrastructure applications.

The Virtex-6 family was engineered for deterministic, high-bandwidth signal processing in wireless baseband, defense radar, and high-speed test instrumentation - prioritizing transceiver performance, logic density, and thermal efficiency in air-cooled enclosures.

FAQ

What is the maximum supported transceiver line rate for XC6VLX75T-2FFG784I?

The XC6VLX75T-2FFG784I supports a maximum transceiver line rate of 12.8 Gb/s per lane using its GTX transceivers. This specification is validated across temperature and voltage corners per Xilinx DS152 v2.5. The XC6VLX75T-2FFG784I achieves this rate in CPRI v6.1 and SRIO 2.1 configurations with appropriate reference clock stability and PCB interconnect design.

Does XC6VLX75T-2FFG784I include hard IP for PCI Express?

Yes, the XC6VLX75T-2FFG784I integrates hardened PCIe Gen2 x8 endpoint logic compliant with the PCI-SIG specification. This hard IP eliminates the need for soft-core PCIe implementations and guarantees timing closure for endpoint operation. The XC6VLX75T-2FFG784I supports both root port and endpoint modes with integrated DMA engines and TLP parsing logic.

What I/O standards are supported by XC6VLX75T-2FFG784I?

The XC6VLX75T-2FFG784I supports SSTL-18, SSTL-15, HSTL-I, HSTL-II, LVCMOS, LVDS, BLVDS, RSDS, and Differential SSTL across its 18 SelectIO banks. Each bank operates independently at voltages from 1.2 V to 3.3 V. The XC6VLX75T-2FFG784I's I/O architecture enables mixed-standard interfaces without level-shifting components in wireless and test equipment designs.

What is the operating junction temperature range for XC6VLX75T-2FFG784I?

The XC6VLX75T-2FFG784I is rated for industrial temperature operation from −40°C to +100°C junction temperature. This rating is specified in Xilinx DS152 and applies to all speed grades including the -2 grade. Thermal design must ensure the XC6VLX75T-2FFG784I junction temperature remains within this range under worst-case power dissipation and airflow conditions.

Is XC6VLX75T-2FFG784I compatible with Vivado Design Suite?

No, the XC6VLX75T-2FFG784I requires Xilinx ISE Design Suite 14.7 for synthesis, implementation, and bitstream generation. Vivado does not support Virtex-6 devices. Users must maintain ISE 14.7 toolchain compatibility, and the XC6VLX75T-2FFG784I bitstream is not forward-compatible with newer FPGA families or tools.