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AMD XC6VLX75T-3FF484C
- Part No.:
- XC6VLX75T-3FF484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC6VLX75T-3FF484C.pdf
- Description:
- IC FPGA 240 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,402
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Product details
Overview
XC6VLX75T-3FF484C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 74,496 logic cells, 12.8 Gb/s transceiver capability, and -3 speed grade in a 484-pin Fine-Pitch Flip-Chip BGA package. It serves as a high-performance programmable logic fabric for reconfigurable signal processing in radar baseband systems.
For engineers reviewing the XC6VLX75T-3FF484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), integrated PCIe Gen2 x8 endpoint block, and thermal performance under sustained 1.2 W dynamic power at 100 MHz operation.
Technical Context
The XC6VLX75T-3FF484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 18×18 multipliers, and block RAMs organized in 36 Kb dual-port primitives. It supports SelectIO standards including LVDS, SSTL, and HSTL across 332 user I/Os.
This device integrates six RocketIO GTP transceivers operating up to 3.75 Gb/s per lane and includes a hard IP PCIe Gen2 x8 endpoint compliant with PCI Express Base Specification v2.0. Configuration occurs via Master SPI or JTAG interface with bitstream encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Block RAM | 3,328 kbits - distributed as 36 Kb dual-port RAM primitives supporting independent read/write clocks |
| GTP Transceivers | 6 × 3.75 Gb/s - serial I/O lanes enabling high-speed interfaces such as CPRI, SRIO, and JESD204B |
| User I/O Pins | 332 - configurable single-ended or differential I/Os supporting 1.2 V to 3.3 V signaling standards |
| PCIe Endpoint | Gen2 x8 hard IP - full-duplex 5 GT/s link with integrated DMA controller and TLP handling logic |
| Speed Grade | -3 - highest commercial speed bin, guaranteeing timing closure at maximum specified frequencies |
| Package | FF484 - 23×23 mm fine-pitch flip-chip BGA with 0.8 mm pitch and thermal lid for enhanced heat dissipation |
Pinout & Package
XC6VLX75T-3FF484C is housed in a 484-pin Fine-Pitch Flip-Chip BGA (FF484) package with thermal lid and 0.8 mm ball pitch. Pin functions are defined per Xilinx UG364 (v1.12) and include dedicated configuration, clock, transceiver, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock for Master SPI configuration mode; drives internal configuration state machine |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Control | Active-low bidirectional signal used to monitor and reset configuration process |
| M0–M2 | Mode Selection | Three-pin bus setting boot mode (JTAG, SPI, BPI, or Master SelectMAP) |
| VRP/VRN | Analog Reference | Dedicated pins for internal voltage reference generation in differential I/O banks |
| GTxCLK | Transceiver Clock | Dedicated differential input for GTP transceiver reference clock (100–375 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 x8 Endpoint | Reduces external interface IC count and simplifies board routing for host-connected acceleration applications |
| 6 GTP Transceivers (3.75 Gb/s) | Enables direct connection to high-speed ADCs/DACs without external serializer/deserializer chips |
| 332 User I/Os with Multi-Voltage Support | Allows mixed-voltage system integration (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) without level-shifting components |
| Block RAM with ECC Support | Provides single-bit error correction and double-bit error detection for safety-critical memory operations |
| Bitstream Encryption | Protects intellectual property by preventing unauthorized readback or cloning of programmed logic design |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: Programmable logic fabric executing custom FFT, FIR, and CORDIC algorithms with deterministic latency. Use Value: 74,496 logic cells and 3,328 kbits block RAM enable concurrent multi-channel processing at 100+ MSPS sample rates. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backends. IC Role / Device Role / Timing Role: Data coalescer and parallel accelerator interfacing with 16-bit ADCs and DDR3 memory subsystems. Use Value: 332 multi-voltage I/Os simplify connection to heterogeneous sensor and memory interfaces while maintaining signal integrity. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Protocol-aware bridge with time-stamped packet buffering and deterministic arbitration logic. Use Value: Integrated PCIe Gen2 x8 endpoint enables low-latency communication with host processor over standard backplane interface. | Use Scenario: High-fidelity digital stimulus generation for ATE platforms targeting SoC validation. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with sub-nanosecond timing resolution and jitter-controlled outputs. Use Value: Six 3.75 Gb/s GTP transceivers provide synchronized multi-lane vector streaming at 1.25 Gbps per lane. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6VLX130T-3FF784C | Higher logic capacity (128,000 CLBs), larger FF784 package, same -3 speed grade and GTP transceiver spec | Required when >74K logic cells or >332 I/Os are needed; additional I/O banks support wider memory interfaces | Select if design requires more fabric resources or expanded I/O count without changing transceiver or PCIe architecture |
| XC7K325T-2FFG901C | Kintex-7 successor with 326,000 logic cells, 12.5 Gb/s GT transceivers, and PCIe Gen3 x8 endpoint | Supports higher bandwidth protocols (e.g., 10G Ethernet, PCIe Gen3); not pin-compatible with Virtex-6 family | Choose for new designs needing higher throughput or longer product lifecycle; migration requires PCB redesign and toolchain update |
Compared with XC6VLX75T-3FF484C, XC6VLX130T-3FF784C offers scalable logic density within the same architecture, while XC7K325T-2FFG901C delivers generational improvements in speed and protocol support but mandates hardware and software requalification.
Availability
XC6VLX75T-3FF484C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and avionics data concentrators requiring stable component supply and long-term industrial availability.
Supply support for XC6VLX75T-3FF484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA portfolio for high-end reconfigurable computing.
The Virtex-6 family, including XC6VLX75T-3FF484C, was engineered for compute-intensive, high-bandwidth applications in defense, aerospace, and scientific instrumentation where deterministic latency and I/O flexibility are critical.
FAQ
What is the maximum supported transceiver data rate for XC6VLX75T-3FF484C?
The XC6VLX75T-3FF484C integrates six RocketIO GTP transceivers, each capable of operation up to 3.75 Gb/s. This rate is validated per Xilinx DS152 (v2.5) and applies to protocols including CPRI, SRIO, and JESD204B. The XC6VLX75T-3FF484C does not support rates beyond 3.75 Gb/s on GTP lanes.
Does XC6VLX75T-3FF484C include a hard PCIe endpoint?
Yes, XC6VLX75T-3FF484C contains a fully compliant PCIe Gen2 x8 endpoint hard IP block. It implements the physical, data link, and transaction layers per PCI Express Base Specification v2.0 and supports both endpoint and root complex configurations via configuration space mapping. This feature is intrinsic to the XC6VLX75T-3FF484C silicon.
What configuration modes are supported by XC6VLX75T-3FF484C?
XC6VLX75T-3FF484C supports four primary configuration modes: Master SPI, Slave Serial, JTAG, and Master SelectMAP. Mode selection is controlled by the M0–M2 pins at power-up. Configuration bitstream can be loaded from external SPI flash, parallel PROM, or host processor via dedicated interface pins. All modes are documented in Xilinx UG364.
Is XC6VLX75T-3FF484C pin-compatible with other Virtex-6 devices in the LX75T family?
No, XC6VLX75T-3FF484C is not pin-compatible with other LX75T variants such as XC6VLX75T-1FF484C or XC6VLX75T-2FF484C because all share the identical FF484 package and pinout. Speed grade differences (-1, -2, -3) affect timing performance only and do not alter physical connectivity or function mapping of pins.
What is the I/O voltage range supported by XC6VLX75T-3FF484C?
XC6VLX75T-3FF484C supports user I/O voltages from 1.2 V to 3.3 V across its 332 configurable pins. Each I/O bank operates independently with dedicated VCCO and VREF supplies, enabling simultaneous use of multiple signaling standards (LVCMOS, LVDS, SSTL, HSTL) on a single device. This capability is confirmed in Xilinx DS151 (v3.2).
XC6VLX75T-3FF484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC6VLX75T-3FF484C FAQ
1.How can I place an order for XC6VLX75T-3FF484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX75T-3FF484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX75T-3FF484C reliable?
The price and inventory of XC6VLX75T-3FF484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-3FF484C is usually 5 days.
3.What payment methods are accepted for XC6VLX75T-3FF484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-3FF484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX75T-3FF484C?
XC6VLX75T-3FF484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX75T-3FF484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX75T-3FF484C?
For technical support, including XC6VLX75T-3FF484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-3FF484C requirements.
6.How does Aetrix verify that XC6VLX75T-3FF484C is sourced from the original manufacturer or authorized distributors?
All XC6VLX75T-3FF484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-3FF484C meets industry standards.
7.What is the process for return or replacement of XC6VLX75T-3FF484C?
All XC6VLX75T-3FF484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-3FF484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX75T-3FF484C part is unused and in its original packaging.
Return procedure for XC6VLX75T-3FF484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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