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AMD XC6VLX75T-3FFG484C
- Part No.:
- XC6VLX75T-3FFG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX75T-3FFG484C.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,383
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Product details
Overview
XC6VLX75T-3FFG484C from AMD (formerly Xilinx) is a Virtex-6 FPGA with 74,496 logic cells, 12.8 Gb/s transceiver capability, and 1.2 V core voltage, deployed in high-speed serial interface and DSP-intensive embedded systems such as radar signal processors and optical line cards.
For engineers reviewing the XC6VLX75T-3FFG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O bank voltage support (1.2/1.5/1.8/2.5/3.3 V), GTX transceiver count (24), block RAM capacity (3,528 kbits), and thermal performance under sustained 3.0 ns CLB delay.
Technical Context
The XC6VLX75T-3FFG484C implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry chains, and integrated DSP48E1 slices supporting 25×18-bit multiply-accumulate operations at up to 400 MHz. It includes 24 GTX transceivers compliant with PCIe Gen2, SATA, and SRIO standards.
Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption and SEU mitigation features enabled. The device supports multi-boot and fallback configuration modes using external SPI flash memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - determines maximum combinational and sequential logic density for system-on-chip integration |
| GTX Transceivers | 24 × 12.8 Gb/s - enables dual 10GbE, quad 3G-SDI, or eight SATA 3.0 links without external retimers |
| Block RAM | 3,528 kbits - supports dual-port FIFOs, coefficient storage for FIR filters, or frame buffers up to 1080p60 |
| I/O Pins | 240 user-configurable - supports mixed-voltage banks (1.2 V to 3.3 V) for interfacing with DDR3, QDR-II+, and legacy peripherals |
| CLB Delay | 3.0 ns - defines worst-case combinational path timing margin for 200 MHz synchronous design closure |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply with ≤10 mV ripple to maintain timing stability |
Pinout & Package
XC6VLX75T-3FFG484C is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 1.0 mm pitch, 23×23 array, and thermal lid for industrial temperature operation (0°C to 85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for CLBs, interconnect, and configuration logic; requires local decoupling within 10 mm |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration, clocking, and transceiver reference circuitry |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3 V output driver supply per bank; sets compatible interface voltage levels |
| M0–M2 | Mode pins | Determine configuration mode (e.g., Master SelectMAP, JTAG, Slave Serial) at power-up |
| INIT_B | Configuration status | Open-drain active-low signal indicating bitstream loading progress and CRC pass/fail |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DSP48E1 Slices | 144 units delivering 25×18-bit MAC operations at 400 MHz - enables real-time FFT and beamforming in radar processing |
| PCIe Gen2 Endpoint Support | Native hard IP with 2.5/5.0 GT/s link layer - eliminates soft-core overhead and reduces latency for host-FPGA communication |
| SEU Mitigation | Single-event upset detection and correction via internal scrubbing controller - maintains functional integrity in aerospace and medical applications |
| Multi-Boot Configuration | Support for up to four independent bitstreams in external flash - enables field-upgradable firmware and fail-safe recovery |
Applications
| Radar Signal Processing | Optical Transport Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: Primary compute engine executing time-critical FFT, CFAR, and beam steering algorithms with deterministic latency. Use Value: 144 DSP48E1 slices and 24 GTX transceivers enable concurrent 4-channel 10 GbE data ingestion and 256-point FFT in <1.2 µs. | Use Scenario: Aggregation and framing of OTU2/OTU3 signals in metro DWDM line cards with forward error correction. IC Role / Device Role / Timing Role: Protocol-aware framer and FEC encoder/decoder with precise 156.25 MHz and 311.04 MHz clock domain crossing. Use Value: Integrated GTX transceivers meet SONET OC-192 jitter compliance (<0.3 UI p-p) without external CDR ICs. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: High-throughput ultrasound beamforming and digital RF receive chain in portable imaging systems. IC Role / Device Role / Timing Role: Time-synchronized acquisition controller interfacing 128-channel ADCs and managing DMA transfers to DDR3 memory. Use Value: 240 user I/O pins with programmable slew rate and on-die termination support 128 LVDS pairs at 1.25 Gbps with <15 ps skew. | Use Scenario: High-resolution arbitrary waveform generation and real-time spectrum analysis in benchtop analyzers. IC Role / Device Role / Timing Role: Sample-rate agile digital upconverter/downconverter with 16-bit DAC/ADC interface and 100 MS/s processing pipeline. Use Value: Block RAM depth (3,528 kbits) stores ≥2 M-sample waveform buffers while maintaining 200 MHz read/write throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-speed signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture, 2,586K logic cells, 128 GTY transceivers, 0.85 V core | Higher bandwidth, lower latency, but requires new PCB layout and power delivery redesign | Preferred for new designs targeting >25 Gb/s serial I/O or AI-accelerated inference |
| XC7K325T-2FFG900C | Kintex-7 architecture, 326K logic cells, 20 GTP transceivers, 1.0 V core | Lower gate count and transceiver speed; lacks PCIe Gen2 hard IP and SEU mitigation | Suitable for cost-sensitive upgrades where 6.6 Gb/s max serial rate and no radiation-hardened operation are acceptable |
Compared with XC6VLX75T-3FFG484C, the XCVU9P offers 3.5× more logic and 5.3× more transceivers but demands full platform requalification, while the XC7K325T provides pin-compatible migration path only for non-transceiver I/O and reduced feature set.
Availability
XC6VLX75T-3FFG484C is available at Aetrix Electronics and suitable for radar signal processing, optical transport equipment, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC6VLX75T-3FFG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and edge applications through its acquisition of Xilinx in 2022.
The Virtex-6 family was designed for high-performance serial connectivity and compute-intensive embedded systems, targeting applications demanding deterministic low-latency processing and multi-protocol transceiver flexibility.
FAQ
What is the maximum supported transceiver data rate for XC6VLX75T-3FFG484C?
The XC6VLX75T-3FFG484C supports GTX transceivers with a maximum data rate of 12.8 Gb/s per lane. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA III (6.0 Gb/s), and SRIO Gen2 (6.25 GT/s) protocols. The actual achievable rate depends on board layout quality, reference clock stability, and signal integrity margins measured per UG366.
Does XC6VLX75T-3FFG484C support bitstream encryption?
Yes, XC6VLX75T-3FFG484C supports AES-256 bitstream encryption using a 256-bit key stored in on-chip eFUSE. Encryption is enabled during bitstream generation in Vivado Design Suite and verified during configuration via the STARTUP_PRIMITIVE. This feature protects intellectual property against unauthorized cloning or reverse engineering of the programmed logic.
What I/O standards are supported by XC6VLX75T-3FFG484C?
XC6VLX75T-3FFG484C supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, BLVDS, RSDS, and mini-LVDS across its 240 user I/O pins. Each of the 12 I/O banks operates independently at voltages from 1.2 V to 3.3 V, enabling direct interfacing with DDR3 memory, QDR-II+ SRAM, and legacy parallel buses without level shifters.
Is XC6VLX75T-3FFG484C qualified for industrial temperature operation?
Yes, the XC6VLX75T-3FFG484C is rated for industrial temperature range (0°C to +85°C ambient) and packaged in the FFG484 RoHS-compliant flip-chip BGA. Thermal performance validation includes junction temperature monitoring under sustained 75% logic utilization and 12.8 Gb/s transceiver activity per UG372.
How many block RAMs does XC6VLX75T-3FFG484C contain?
XC6VLX75T-3FFG484C contains 360 block RAM primitives, each configurable as 36 kbits dual-port RAM or two 18 kbits single-port RAMs, totaling 3,528 kbits of on-chip memory. This capacity supports large coefficient tables for FIR filters, deep FIFOs for video buffering, or scratchpad memory for real-time control loops without external memory access.
XC6VLX75T-3FFG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX75T-3FFG484C FAQ
1.How can I place an order for XC6VLX75T-3FFG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX75T-3FFG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX75T-3FFG484C reliable?
The price and inventory of XC6VLX75T-3FFG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-3FFG484C is usually 5 days.
3.What payment methods are accepted for XC6VLX75T-3FFG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-3FFG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX75T-3FFG484C?
XC6VLX75T-3FFG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX75T-3FFG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX75T-3FFG484C?
For technical support, including XC6VLX75T-3FFG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-3FFG484C requirements.
6.How does Aetrix verify that XC6VLX75T-3FFG484C is sourced from the original manufacturer or authorized distributors?
All XC6VLX75T-3FFG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-3FFG484C meets industry standards.
7.What is the process for return or replacement of XC6VLX75T-3FFG484C?
All XC6VLX75T-3FFG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-3FFG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX75T-3FFG484C part is unused and in its original packaging.
Return procedure for XC6VLX75T-3FFG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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