AMD XC6VLX75T-3FFG784C

Overview

XC6VLX75T-3FFG784C from AMD (formerly Xilinx) is a Virtex-6 FPGA featuring 74,496 logic cells, 12.8 Gb/s transceiver capability, and 128 DSP48E1 slices, deployed in high-speed serial interface bridging and radar signal preprocessing systems.

For engineers reviewing the XC6VLX75T-3FFG784C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), -3 speed grade timing margin, FFG784 flip-chip BGA package with 448 user I/Os, and compliance with JESD78 Class II latch-up immunity.

Technical Context

The XC6VLX75T-3FFG784C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM) totaling 4,032 kbits, and integrated PCIe Gen2 x8 endpoint functionality. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gbps per I/O pair.

Its transceivers operate at 600 Mb/s to 6.6 Gb/s with built-in 8B/10B encoding, PRBS generation/checking, and clock data recovery (CDR). The device uses 40 nm CMOS process technology and requires dual-supply operation: 1.0 V core, 2.5 V auxiliary, and programmable I/O bank voltages.

Key Specifications

Pinout & Package

XC6VLX75T-3FFG784C is housed in a 29×29 mm, 784-pin flip-chip fine-pitch BGA (FFG784) package with 448 user-configurable I/Os distributed across 12 I/O banks. Power and ground pins are arranged in dedicated rows/columns per Xilinx UG373 v2.5.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VLX75T-3FFG784C, XC6VLX130T-3FFG1156C offers scalable logic headroom within the same family, while XCKU040-2FFVA1156I delivers architectural advancement at the cost of design environment transition and loss of hard PCIe endpoint.

Availability

XC6VLX75T-3FFG784C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics communication gateway applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for XC6VLX75T-3FFG784C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Virtex product line as its flagship high-performance FPGA family for demanding compute and signal processing workloads.

The Virtex-6 family, including XC6VLX75T-3FFG784C, was architected for applications requiring high logic density, multi-gigabit serial connectivity, and deterministic real-time processing in aerospace, defense, and test instrumentation.

FAQ

What is the maximum supported transceiver data rate for XC6VLX75T-3FFG784C?

The XC6VLX75T-3FFG784C supports transceiver data rates from 600 Mb/s up to 6.6 Gb/s per lane. This range enables compliance with protocols including PCIe Gen2, SATA II/III, and CPRI. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margins verified through IBIS-AMI simulation.

Does XC6VLX75T-3FFG784C include a hard PCIe endpoint block?

Yes, XC6VLX75T-3FFG784C integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. This eliminates external bridge components and reduces latency in host-facing acceleration applications. Configuration is managed via dedicated AXI-PCIe interface and requires Xilinx ISE 14.7 or later tools.

What I/O standards are supported by XC6VLX75T-3FFG784C?

XC6VLX75T-3FFG784C supports LVDS, SSTL-18/25, HSTL-I/II, LVCMOS (1.2 V to 3.3 V), and differential standards including BLVDS and RSDS. Each of its 12 I/O banks can be independently configured for voltage and standard, enabling mixed-voltage interfacing with DDR2/3 memory, ADCs, and other FPGAs without level-shifting components.

What is the purpose of the INIT_B pin on XC6VLX75T-3FFG784C?

The INIT_B pin on XC6VLX75T-3FFG784C is an open-drain output that signals configuration status. It goes low during configuration and returns high upon successful bitstream loading. If it remains low, it indicates a CRC error or incomplete configuration. External pull-up is required, and the pin must not be driven by other devices.

Is partial reconfiguration supported on XC6VLX75T-3FFG784C?

Yes, XC6VLX75T-3FFG784C supports partial reconfiguration through Xilinx ISE Design Suite with PlanAhead implementation tools. This allows dynamic swapping of logic modules during operation, enabling adaptive computing in radar, communications, and instrumentation systems where function sets change based on runtime conditions.