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AMD XC6VLX75T-L1FFG484C
- Part No.:
- XC6VLX75T-L1FFG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6VLX75T-L1FFG484C.pdf
- Description:
- IC FPGA 240 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,492
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Product details
Overview
XC6VLX75T-L1FFG484C from AMD is a Virtex-6 FPGA featuring 74,496 logic cells, 12.8 Gb/s transceiver capability, and -1 speed grade operating at 1.0V core voltage. It integrates 36-Kb block RAM, DSP48E1 slices, and clock management tiles for high-performance digital signal processing in wired communications infrastructure.
For engineers reviewing the XC6VLX75T-L1FFG484C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance with XAUI/SGMII, deterministic timing closure at 400 MHz system clock, and support for PCI Express Gen2 endpoint functionality.
Technical Context
The XC6VLX75T-L1FFG484C implements a column-based architecture with dedicated routing for high-speed serial I/O, supporting up to 24 GTX transceivers with built-in 8B/10B encoding and PRBS pattern generation. It includes integrated Clock Management Tiles (CMT) with dual DCMs and PLLs per tile for jitter reduction and phase alignment across multiple clock domains.
Configurable logic blocks (CLBs) contain six-input LUTs and dual flip-flops per slice, enabling efficient implementation of arithmetic pipelines and state machines. The device supports SelectIO™ technology with programmable I/O standards including LVDS, SSTL-18, and HSTL-I, with on-die termination and adjustable drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,496 - total configurable resources for combinatorial and sequential logic implementation |
| GTX Transceivers | 24 × 12.8 Gb/s - supports XAUI, SGMII, and CPRI protocols without external retimers |
| Block RAM | 4,032 Kb - distributed as 36-Kb dual-port RAM blocks for FIFOs and data buffering |
| DSP Slices | 180 × DSP48E1 - each performs 25×18 multiply-accumulate in one cycle for FIR filtering |
| Speed Grade | -1 - guarantees timing closure at 400 MHz system clock frequency under worst-case conditions |
| I/O Standards | LVDS, SSTL-18, HSTL-I - supports interface to DDR2/DDR3 memory and high-speed SerDes PHYs |
| Core Voltage | 1.0 V ±3% - requires precision regulation and low-noise power delivery network |
Pinout & Package
XC6VLX75T-L1FFG484C is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 25×25 mm body size, 1.0 mm ball pitch, and Pb-free / RoHS-compliant finish. Thermal pad on underside enables enhanced heat dissipation in high-power configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC | Analog supply for GTX transceivers | Must be filtered separately from digital supplies to maintain <1.5 ps RMS jitter |
| VRP/VRN | Reference voltage pair for differential I/O | Enables precise calibration of input thresholds for SSTL and HSTL interfaces |
| CCLK | Configuration clock input | Drives internal configuration logic during master SPI or JTAG programming |
| INIT_B | Configuration status indicator | Active-low open-drain output signaling successful bitstream loading or error condition |
| PROGRAM_B | Configuration reset control | Pulse-low initiates reconfiguration sequence and clears internal configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4 lane widths with full link training and error reporting |
| AXI Interconnect Support | Native integration with AXI4-Stream and AXI4-Lite protocols for SoC-level subsystem connectivity |
| Partial Reconfiguration | Enables dynamic module swapping without resetting entire device or halting system operation |
| Secure Boot with AES-256 | On-chip decryption engine validates encrypted bitstreams before configuration loading |
| Multi-Boot Capability | Supports up to 4 independent bitstreams stored in external flash with fail-safe fallback selection |
Applications
| 10G Ethernet Line Cards | Wireless Baseband Processing |
|---|---|
Use Scenario: Aggregation of four 10GBASE-R links into a single backplane interface using XAUI protocol. IC Role / Device Role / Timing Role: FPGA fabric implements MAC layer, forward error correction, and packet classification logic with deterministic latency. Use Value: GTX transceivers operate at 10.3125 Gb/s with <0.5 UI jitter, eliminating need for external retimers and reducing BOM cost. | Use Scenario: Real-time processing of LTE-Advanced baseband signals with MIMO-4x4 channel estimation and precoding. IC Role / Device Role / Timing Role: DSP48E1 slices execute complex matrix operations while CLBs manage scheduling and data flow control. Use Value: 180 DSP slices deliver 2.8 GOPS at 200 MHz, enabling real-time 20 MHz bandwidth LTE processing within thermal envelope. |
| PCIe Gen2 Embedded Vision Systems | High-Speed Test Equipment |
Use Scenario: Frame capture and preprocessing from four 4K@60fps MIPI CSI-2 camera inputs routed via PCIe Gen2 x4 to host CPU. IC Role / Device Role / Timing Role: Acts as PCIe endpoint with DMA controller and image pipeline accelerator using block RAM for line buffers. Use Value: Integrated PCIe hard IP achieves 2.5 GT/s per lane with sub-100 ns transaction latency, avoiding soft-core overhead and timing uncertainty. | Use Scenario: Pattern generation and acquisition for 12.5 Gb/s serial compliance testing using PRBS31 sequences. IC Role / Device Role / Timing Role: GTX transceivers generate and receive high-fidelity test patterns with calibrated jitter injection and eye diagram analysis logic. Use Value: On-die PRBS generator and error detector eliminate external test ICs, reducing test head complexity and calibration drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC6VLX130T-L1FFG784C | Higher logic density (133,152 LC), larger FFG784 package, +2 more GTX transceivers | Better suited for multi-protocol aggregation requiring >24 serial lanes or >100K logic cells | Select when XC6VLX75T-L1FFG484C resource utilization exceeds 85% in critical paths |
| Intel EP4CGX150DF31C8N | Cyclone IV GX with 150K LE, 8 × 3.125 Gb/s transceivers, no native PCIe hard IP | Lower-cost alternative for non-PCIe, lower-bandwidth applications where transceiver count and speed are relaxed | Choose only if design does not require >6 Gb/s serial I/O or PCIe Gen2 endpoint functionality |
Compared with XC6VLX75T-L1FFG484C, the XC6VLX130T-L1FFG784C offers scalable capacity for future expansion but increases PCB area and power by ~40%; the EP4CGX150DF31C8N reduces cost and complexity but lacks the transceiver performance and hard IP required for 10G+ infrastructure designs.
Availability
XC6VLX75T-L1FFG484C is available at Aetrix Electronics and suitable for 10G Ethernet line cards, wireless baseband units, and PCIe Gen2 embedded vision systems requiring stable component supply across extended production lifecycles.
Supply support for XC6VLX75T-L1FFG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, networking, and aerospace applications.
The Virtex-6 family was designed for high-bandwidth, low-latency infrastructure systems requiring deterministic timing, hardened serial I/O, and scalable logic resources - specifically targeting wired communications and high-end test equipment.
FAQ
What is the maximum guaranteed data rate for GTX transceivers in XC6VLX75T-L1FFG484C?
The XC6VLX75T-L1FFG484C supports GTX transceivers rated up to 12.8 Gb/s with full compliance to XAUI, SGMII, and CPRI standards. This rate is guaranteed across industrial temperature range (-40°C to +100°C) and voltage tolerance (1.0 V ±3%) when using recommended reference clocks and PCB stack-up guidelines specified in UG371.
Does XC6VLX75T-L1FFG484C include native PCIe Gen2 endpoint functionality?
Yes, XC6VLX75T-L1FFG484C integrates a hard PCIe Gen2 endpoint block supporting x1, x2, and x4 configurations with full link training, ACK/NAK handling, and error reporting. It does not require external PHY or soft-core implementation, reducing latency and resource usage compared to custom solutions.
What configuration modes are supported by XC6VLX75T-L1FFG484C?
XC6VLX75T-L1FFG484C supports Master SelectMAP, Slave SelectMAP, JTAG, and Master Serial (SPI) configuration modes. Configuration can be initiated via PROGRAM_B pin or automatically on power-up when using external SPI flash with proper mode pin settings per UG373.
Is partial reconfiguration supported on XC6VLX75T-L1FFG484C?
Yes, XC6VLX75T-L1FFG484C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading. This allows dynamic replacement of functional modules without resetting the entire device, enabling runtime adaptation in wireless baseband and test equipment applications.
What is the purpose of the VRP/VRN pins on XC6VLX75T-L1FFG484C?
The VRP/VRN pins on XC6VLX75T-L1FFG484C provide reference voltages for differential I/O standards such as SSTL-18 and HSTL-I. They enable precise threshold calibration across process, voltage, and temperature variations, ensuring reliable signal integrity for DDR2/DDR3 memory interfaces and high-speed parallel buses.
XC6VLX75T-L1FFG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5820
- Number of Logic Elements/Cells:
- 74496
- Total RAM Bits:
- 5750784
- Number of I/O:
- 240
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6VLX75T-L1FFG484C FAQ
1.How can I place an order for XC6VLX75T-L1FFG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VLX75T-L1FFG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VLX75T-L1FFG484C reliable?
The price and inventory of XC6VLX75T-L1FFG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VLX75T-L1FFG484C is usually 5 days.
3.What payment methods are accepted for XC6VLX75T-L1FFG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VLX75T-L1FFG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VLX75T-L1FFG484C?
XC6VLX75T-L1FFG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VLX75T-L1FFG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VLX75T-L1FFG484C?
For technical support, including XC6VLX75T-L1FFG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VLX75T-L1FFG484C requirements.
6.How does Aetrix verify that XC6VLX75T-L1FFG484C is sourced from the original manufacturer or authorized distributors?
All XC6VLX75T-L1FFG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VLX75T-L1FFG484C meets industry standards.
7.What is the process for return or replacement of XC6VLX75T-L1FFG484C?
All XC6VLX75T-L1FFG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VLX75T-L1FFG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VLX75T-L1FFG484C part is unused and in its original packaging.
Return procedure for XC6VLX75T-L1FFG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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