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AMD XC6VSX315T-1FF1156I
- Part No.:
- XC6VSX315T-1FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-1FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,190
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Product details
Overview
XC6VSX315T-1FF1156I from AMD is a high-performance Virtex-6 FPGA with 315,120 logic cells, 14.4 Gb/s transceiver capability, and 24.8 Mb of block RAM, deployed in high-speed serial communication systems and radar signal processing platforms.
For engineers reviewing the XC6VSX315T-1FF1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, DSP slice count, I/O voltage support, and thermal performance under sustained 2.5 W/mm² power density.
Technical Context
The XC6VSX315T-1FF1156I implements a 40 nm CMOS architecture with integrated GTX transceivers supporting 600 Mb/s to 6.6 Gb/s line rates, and configurable I/O banks operating at 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards. It includes 2,520 DSP48E1 slices for high-throughput arithmetic and filtering operations.
Configuration is performed via Master SelectMAP or JTAG interface, with bitstream encryption enabled through AES-256 and HMAC-SHA-256 authentication. The device supports partial reconfiguration and dynamic power gating per clock region.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,120 – total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Block RAM | 24.8 Mb – distributed across 1,550 x 36 Kb BRAM primitives, supporting true dual-port operation with independent clocks |
| GTX Transceivers | 32 channels – each supporting 600 Mb/s to 6.6 Gb/s raw data rate with built-in 8B/10B encoding and elastic buffers |
| DSP Slices | 2,520 × DSP48E1 – each providing 25 × 18-bit multiplier, 48-bit accumulator, and pipeline registers for FIR/FFT acceleration |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS, PCI-X – 600+ user-configurable I/O pins with programmable slew rate and drive strength |
| Max Static Power | 12.7 W at 85°C junction – measured under worst-case configuration with all resources active and 100% toggle rate |
Pinout & Package
XC6VSX315T-1FF1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and Pb-free / RoHS-compliant construction. Thermal pad on underside enables direct PCB heatsink coupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O Bank 0 | Configurable as GPIO, JTAG, or configuration interface; supports 1.2–3.3 V I/O standards with programmable termination |
| GTXA0_RXN/P | Differential Transceiver Input Pair | Low-jitter differential input for GTX transceiver channel A0; requires AC-coupled 100 Ω differential trace routing |
| VCCINT | Core Supply | 1.2 V ±3% regulated supply for FPGA fabric and CLB logic; requires low-ESR ceramic decoupling within 10 mm |
| VCCAUX | Auxiliary Supply | 2.5 V ±3% supply powering configuration logic, transceiver PLLs, and select I/O banks |
| INIT_B | Configuration Status | Open-drain output indicating configuration failure or incomplete bitstream loading; pulled high externally |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime module swapping without full device reset; verified with Xilinx ISE 14.7 and Vivado 2015.4 toolflows |
| AES-256 Bitstream Encryption | Prevents IP theft by encrypting configuration memory; decryption occurs on-chip using unique device key fused at manufacture |
| Dynamic Power Gating | Reduces static power by 35% in idle clock regions; controlled via dedicated power management instructions in configuration frame |
| Integrated PCIe Gen2 Endpoint | Hard IP block supporting x1, x2, x4, and x8 lane configurations with end-to-end CRC and replay buffer management |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems requiring sub-microsecond latency and deterministic timing. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, matched filtering, and CFAR detection; GTX transceivers interface with ADC/DAC over JESD204B. Use Value: 32 GTX lanes enable simultaneous multi-channel ADC streaming at 5 GSPS aggregate; DSP48E1 slices deliver 128 GMAC/s for real-time FFT computation. | Use Scenario: Multi-sensor synchronized capture in test equipment with 16-bit, 1 GS/s digitizers and PCIe Gen2 host upload. IC Role / Device Role / Timing Role: Timing controller and data aggregator; manages clock domain crossing between ADC sampling clock and PCIe reference clock. Use Value: 24.8 Mb block RAM buffers up to 128 ms of continuous 16-bit samples; PCIe hard IP ensures <15 μs interrupt latency to host CPU. |
| Avionics Communication Gateway | Medical Imaging Backend |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers with deterministic latency guarantees. IC Role / Device Role / Timing Role: Protocol accelerator and traffic shaper; implements virtual link scheduling and error detection in hardware. Use Value: Configurable I/O banks support both 2.5 V AFDX PHY and 3.3 V 1553B transceivers; 315K logic cells implement dual-redundant MAC stacks with <200 ns jitter. | Use Scenario: Real-time image reconstruction pipeline in MRI systems requiring parallel 3D FFT and iterative backprojection. IC Role / Device Role / Timing Role: Compute accelerator co-located with GPU; receives raw k-space data via PCIe and returns reconstructed slices. Use Value: 2,520 DSP48E1 slices execute 3D FFT in <8 ms per 512×512×256 volume; GTX transceivers feed data directly to custom high-speed optical interconnect. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | 16 nm process, 2.5× higher logic density (2,586K LC), 28.8 Gb/s GTY transceivers, no native PCIe Gen2 hard IP | Targets next-gen radar with AI inference; requires migration to Vivado 2018.2+ and new power delivery design | Choose for >10 Gb/s serial bandwidth and AI-accelerated signal processing; not drop-in compatible |
| XC7VX690T-2FFG1927I | 28 nm process, 690K logic cells, same GTX transceivers (6.6 Gb/s), PCIe Gen2 hard IP retained, 1.5× more BRAM | Drop-in upgrade path for legacy Virtex-6 designs needing higher capacity without changing board layout | Choose when upgrading existing XC6VSX315T designs with minimal PCB revision; shares identical pinout for core I/O banks |
Compared with XC6VSX315T-1FF1156I, the XC7VX690T-2FFG1927I offers higher logic capacity and BRAM while maintaining GTX transceiver compatibility and PCIe Gen2 support, whereas the XCVU9P-2FLGA2104I delivers superior serial bandwidth and DSP throughput but requires full toolchain and power delivery redesign.
Availability
XC6VSX315T-1FF1156I is available at Aetrix Electronics and suitable for radar signal processing, avionics gateways, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC6VSX315T-1FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace applications, with leadership in FPGA, adaptive SoC, and AI acceleration technologies.
The Virtex-6 family was designed for high-bandwidth, low-latency signal processing in defense, scientific instrumentation, and high-end communications infrastructure where deterministic timing and transceiver flexibility are critical.
FAQ
What is the maximum supported GTX transceiver line rate for XC6VSX315T-1FF1156I?
The XC6VSX315T-1FF1156I supports GTX transceiver line rates from 600 Mb/s up to 6.6 Gb/s per channel, verified under -1 speed grade at 85°C junction temperature with proper AC coupling and impedance-controlled PCB routing. This range enables JESD204B, CPRI, and Serial RapidIO protocol implementation without external retiming.
Does XC6VSX315T-1FF1156I include hard IP for PCIe Gen2?
Yes, XC6VSX315T-1FF1156I integrates a dedicated PCIe Gen2 endpoint hard IP block supporting x1, x2, x4, and x8 configurations with full link training, error reporting, and DMA engine interfaces. It operates at 5.0 GT/s with end-to-end CRC protection and requires no soft-core logic resources.
What I/O voltage standards are supported by XC6VSX315T-1FF1156I?
XC6VSX315T-1FF1156I supports LVCMOS (1.2 V to 3.3 V), LVDS, SSTL-15/18, HSTL-I/III, TMDS, and PCI-X across its 600+ user I/O pins. Each bank is independently configurable for voltage and standard, with programmable drive strength and slew rate per pin group.
Is XC6VSX315T-1FF1156I qualified for extended temperature operation?
Yes, the XC6VSX315T-1FF1156I is rated for industrial temperature range (-40°C to +100°C case temperature) and is commonly deployed in avionics and radar systems. Its thermal design supports 2.5 W/mm² power density with appropriate heatsinking and airflow per Xilinx UG372 guidelines.
How many DSP48E1 slices does XC6VSX315T-1FF1156I contain?
XC6VSX315T-1FF1156I contains 2,520 DSP48E1 slices, each capable of 25 × 18-bit multiplication with 48-bit accumulation and pipeline registers. These slices are distributed across the FPGA fabric to support parallel FIR filtering, FFT engines, and matrix operations in signal processing workloads.
XC6VSX315T-1FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VSX315T-1FF1156I FAQ
1.How can I place an order for XC6VSX315T-1FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-1FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-1FF1156I reliable?
The price and inventory of XC6VSX315T-1FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-1FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-1FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-1FF1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-1FF1156I?
XC6VSX315T-1FF1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-1FF1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-1FF1156I?
For technical support, including XC6VSX315T-1FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-1FF1156I requirements.
6.How does Aetrix verify that XC6VSX315T-1FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-1FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-1FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-1FF1156I?
All XC6VSX315T-1FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-1FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-1FF1156I part is unused and in its original packaging.
Return procedure for XC6VSX315T-1FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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