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AMD XC6VSX315T-1FF1759I
- Part No.:
- XC6VSX315T-1FF1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-1FF1759I.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,940
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Product details
Overview
XC6VSX315T-1FF1759I from AMD is a high-performance Virtex-6 FPGA featuring 315,900 logic cells, 14,336 Kbits of block RAM, and 640 DSP48E1 slices, operating at -1 speed grade with I-grade temperature rating (–40°C to +100°C). It is used in high-bandwidth wired communications infrastructure and radar signal processing systems requiring deterministic low-latency data path implementation.
For engineers reviewing the XC6VSX315T-1FF1759I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720 user I/Os), transceiver line rate (up to 6.6 Gb/s), thermal performance under sustained 2.5W dynamic power, and compatibility with Xilinx ISE Design Suite v14.7.
Technical Context
The XC6VSX315T-1FF1759I implements a column-based architecture with dedicated routing for high-speed serial interfaces and deterministic clock distribution. It integrates 32 GTX transceivers supporting protocols including PCIe Gen2, SATA, and SRIO, each with programmable pre-emphasis and receiver equalization.
Its CLB structure includes dual 6-input LUTs with independent carry logic and distributed RAM, enabling efficient arithmetic and state-machine implementation. Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption and HMAC authentication support for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,900 - determines maximum combinational/sequential logic capacity for complex control and datapath functions |
| Block RAM | 14,336 Kbits - supports large on-chip buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 640 DSP48E1 - enables parallel multiply-accumulate operations for filtering and FFT acceleration |
| User I/O Pins | 720 - provides high-density interface capability for multi-protocol parallel bus and high-speed SERDES connectivity |
| Transceiver Speed | 6.6 Gb/s - meets line-rate requirements for 10G Ethernet KR, PCIe Gen2 x8, and CPRI Option 3 links |
| Operating Temp | –40°C to +100°C - qualified for industrial and aerospace environments with extended thermal cycling tolerance |
| Speed Grade | -1 - specifies worst-case timing closure margin for critical paths at maximum frequency |
Pinout & Package
XC6VSX315T-1FF1759I is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. The package supports thermal dissipation up to 2.5W under forced-air cooling and includes dedicated VCCINT/VCCAUX/VCCO banks per I/O column.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | Core supply (1.0V) for logic and CLB operation; requires low-noise regulation and local decoupling |
| K2 | VCCAUX | Auxiliary supply (2.5V) for configuration, clocking, and transceiver reference circuitry |
| T3 | VCCO_0 | I/O bank supply (1.2–3.3V) for Bank 0; sets voltage level and drive strength for associated pins |
| Y12 | CLK_IN1_P | Differential input for primary global clock network; routed to MMCM for jitter reduction and frequency synthesis |
| AB14 | GTXP0 | Transmitter positive output for GTX0 channel; supports AC-coupled differential signaling up to 6.6 Gb/s |
| AC15 | GTXN0 | Transmitter negative output for GTX0 channel; paired with GTXP0 for common-mode noise rejection |
| U1 | PROGRAM_B | Active-low asynchronous reset for configuration logic; initiates reconfiguration when asserted |
| R2 | INIT_B | Open-drain status indicator showing configuration progress; goes high after bitstream loading completes |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Supports DDR2/DDR3 SDRAM up to 800 MHz with 64-bit data width and hardware calibration for timing closure |
| PCIe Endpoint Logic | Hard IP block implementing Gen2 x1/x2/x4/x8 root port functionality with integrated TLP parsing and error reporting |
| Secure Configuration | 256-bit AES encryption and 256-bit HMAC authentication prevent unauthorized bitstream loading and cloning |
| Partial Reconfiguration | Enables dynamic module swapping without system reset, reducing downtime in mission-critical communication gateways |
| Low-Power Mode | Power-down states reduce static current by >70% during idle periods while preserving configuration context |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time modulation/demodulation and MIMO signal conditioning in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable datapath accelerator handling symbol-level processing, channel estimation, and precoding. Use Value: 640 DSP48E1 slices enable concurrent execution of 128 complex multiply-accumulate operations per clock cycle at 320 MHz. | Use Scenario: High-precision waveform generation and analysis in automated test systems for semiconductor validation. IC Role / Device Role / Timing Role: Timing controller and pattern generator synchronizing multi-channel DAC/ADC sampling with sub-nanosecond jitter. Use Value: GTX transceivers deliver deterministic 6.6 Gb/s serial links to instrument backplanes, eliminating inter-board skew. |
| Radar Signal Processing | Industrial Imaging Systems |
Use Scenario: Pulse-Doppler processing and beamforming in phased-array radar subsystems for defense applications. IC Role / Device Role / Timing Role: Real-time correlator and FFT engine interfacing directly with ADC front-end and RF DAC outputs. Use Value: 14,336 Kbits of block RAM buffers 16K-point complex FFT data with zero wait-state access latency. | Use Scenario: Multi-spectral image stitching and real-time defect detection in high-resolution machine vision inspection platforms. IC Role / Device Role / Timing Role: Pixel pipeline processor managing sensor interface, color correction, and compression before storage or display. Use Value: 720 user I/Os support simultaneous connection to four CMOS image sensors and two LVDS display interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture with higher logic density (2,586K LC), 58.5 Gb/s GTY transceivers, and 1.2V core voltage | Targets next-gen 400G Ethernet and AI inference acceleration where XC6VSX315T-1FF1759I lacks sufficient bandwidth | Select XCVU9P-2FLGA2104I when migrating to higher throughput or requiring PCI Express Gen3/Gen4 support |
| XC6VLX240T-1FF1156I | Same Virtex-6 family but lower logic count (240,000 LC), fewer DSP slices (400), and 576 user I/Os in smaller 1156-pin FFG package | Suitable for cost-optimized radar front-ends or legacy protocol gateways where XC6VSX315T-1FF1759I over-specifies resources | Choose XC6VLX240T-1FF1156I for reduced BOM cost and thermal footprint in non-SX-class workloads |
Compared with XC6VSX315T-1FF1759I, XCVU9P-2FLGA2104I delivers 8× more logic and 9× higher serial bandwidth but requires new PCB layout and toolchain migration, while XC6VLX240T-1FF1156I retains pin-compatible toolflow and design reuse but sacrifices 24% logic capacity and 38% DSP throughput.
Availability
XC6VSX315T-1FF1759I is available at Aetrix Electronics and suitable for wireless infrastructure, defense radar, and high-speed test equipment requiring stable component supply across long production lifecycles.
Supply support for XC6VSX315T-1FF1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Virtex-6 family was designed for high-performance logic and signal processing applications demanding deterministic timing, high I/O bandwidth, and robust configuration security in mission-critical systems.
FAQ
What is the maximum supported transceiver line rate for XC6VSX315T-1FF1759I?
The XC6VSX315T-1FF1759I supports a maximum transceiver line rate of 6.6 Gb/s using its GTX serial transceivers. This enables compliance with 10G Ethernet KR, PCIe Gen2, and CPRI Option 3 standards. The actual achievable rate depends on board layout quality, reference clock stability, and signal integrity margins verified during hardware validation.
Does XC6VSX315T-1FF1759I support partial reconfiguration?
Yes, XC6VSX315T-1FF1759I supports partial reconfiguration through Xilinx ISE Design Suite v14.7 tools. This allows dynamic replacement of functional modules-such as protocol engines or filter coefficients-without resetting the entire device. The feature is used in radar systems to adapt waveform processing on-the-fly while maintaining continuous tracking.
What configuration modes are supported by XC6VSX315T-1FF1759I?
XC6VSX315T-1FF1759I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Master SelectMAP enables autonomous boot from external SPI flash, while JTAG is used for debugging and programming during development. All modes support AES-256 encrypted bitstreams and HMAC authentication for secure deployment.
How many DSP48E1 slices does XC6VSX315T-1FF1759I contain?
XC6VSX315T-1FF1759I contains 640 DSP48E1 slices. Each slice performs 25×18-bit signed multiplication with optional 48-bit accumulator and pipeline registers. These are used in XC6VSX315T-1FF1759I-based designs for FIR filtering, FFT butterfly computation, and matrix multiplication in radar and communications applications.
What is the operating temperature range for XC6VSX315T-1FF1759I?
XC6VSX315T-1FF1759I is rated for industrial temperature operation from –40°C to +100°C (I-grade). This qualification ensures reliable functionality in harsh environments such as outdoor wireless base stations and airborne radar systems where thermal cycling and extended ambient ranges are specified.
XC6VSX315T-1FF1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX315T-1FF1759I FAQ
1.How can I place an order for XC6VSX315T-1FF1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-1FF1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-1FF1759I reliable?
The price and inventory of XC6VSX315T-1FF1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-1FF1759I is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-1FF1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-1FF1759I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-1FF1759I?
XC6VSX315T-1FF1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-1FF1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-1FF1759I?
For technical support, including XC6VSX315T-1FF1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-1FF1759I requirements.
6.How does Aetrix verify that XC6VSX315T-1FF1759I is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-1FF1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-1FF1759I meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-1FF1759I?
All XC6VSX315T-1FF1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-1FF1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-1FF1759I part is unused and in its original packaging.
Return procedure for XC6VSX315T-1FF1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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