My Inquiry
My Account
AMD XC6VSX315T-1FFG1156C
- Part No.:
- XC6VSX315T-1FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-1FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,651
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6VSX315T-1FFG1156C from AMD is a high-performance Virtex-6 FPGA featuring 315,936 logic cells, 14,336 Kbits of block RAM, and 640 DSP48E1 slices. It supports 1.25 Gbps LVDS I/O, operates at -1 speed grade, and is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-density routing in telecom infrastructure equipment.
For engineers reviewing the XC6VSX315T-1FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, transceiver count, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and thermal performance in multi-GHz serial interface designs.
Technical Context
The XC6VSX315T-1FFG1156C implements a 40 nm CMOS process architecture with integrated PCIe Gen2 x8 endpoint capability and dual 6.6 Gbps GTX transceivers. It includes dedicated clock management tiles (CMT) with DCM and PLL blocks supporting jitter < 15 ps RMS.
This device belongs to the Virtex-6 SX family optimized for serial connectivity and signal processing. Its configuration interface supports Master SelectMAP, Slave SelectMAP, and JTAG modes, with bitstream encryption enabled via AES-256 key storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,936 - provides gate count equivalent to ~1.2M ASIC gates for complex RTL implementation |
| Block RAM | 14,336 Kbits - supports up to 288 independent 36-Kbit RAMB18E1 blocks for data buffering |
| DSP Slices | 640 DSP48E1 - enables parallel multiply-accumulate operations at 400+ MHz for FIR filtering |
| GTX Transceivers | 24 × 6.6 Gbps - delivers full-duplex serial links compliant with SRIO Gen2, CPRI, and XAUI protocols |
| I/O Standards | Supports 1.2 V to 3.3 V - allows direct interfacing with DDR3, QDR-II+, and legacy parallel buses |
| Speed Grade | -1 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
Pinout & Package
XC6VSX315T-1FFG1156C is packaged in a 1156-pin Flip-Chip Fine-Pitch BGA (FFG) with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for logic fabric and CLB operation |
| VCCAUX | Auxiliary power supply | 2.5 V ±5% powers configuration circuitry, transceivers, and clock management |
| VCCO | I/O bank power | Configurable per-bank (1.2–3.3 V) to match connected peripheral voltage levels |
| MRCC/MRCC_N | Multi-Gigabit transceiver reference clock input | Differential pair accepting 100–700 MHz clocks for GTX PLL lock |
| PROGRAM_B | Configuration reset control | Active-low signal initiating full reconfiguration from external PROM or processor |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP enabling plug-and-play host communication without soft-core overhead |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized configuration cloning in deployed systems |
| Partial Reconfiguration Support | Allows dynamic logic module swapping during runtime for adaptive signal processing workloads |
| UltraScale-compatible Configuration Interface | Enables migration path to newer AMD FPGA families using same PROM programming flow |
| Thermal Monitoring Diode | On-die sensor outputting analog voltage proportional to junction temperature for real-time thermal throttling |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital predistortion (DPD) and MIMO signal conditioning in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Primary signal processing engine implementing channel estimation, FFT/IFFT, and adaptive filtering pipelines. Use Value: 640 DSP48E1 slices enable concurrent execution of 16× 1024-point FFTs at 200 MHz, meeting 3GPP sub-6 GHz latency requirements. | Use Scenario: Multi-channel arbitrary waveform generation and high-fidelity signal capture in automated test systems. IC Role / Device Role / Timing Role: Timing-critical pattern generator and acquisition controller synchronizing DAC/ADC sampling at 1.25 GSPS. Use Value: 24 GTX transceivers provide deterministic low-jitter clock distribution across 32-channel analog front-end modules. |
| Avionics Data Concentrators | Medical Imaging Back-End Processors |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control data networks. IC Role / Device Role / Timing Role: Deterministic packet switching and time-triggered scheduling unit with hardware timestamping. Use Value: -1 speed grade ensures worst-case propagation delay ≤ 2.1 ns across 1156-ball FFG package for DO-254 Level A compliance. | Use Scenario: Real-time image reconstruction from raw CT or MRI sensor streams before GPU offload. IC Role / Device Role / Timing Role: Pipeline accelerator handling back-projection, interpolation, and noise reduction kernels. Use Value: 14,336 Kbits of block RAM supports dual-frame buffering at 12-bit depth for 2048×2048 pixel volumes at 30 fps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | 100G Ethernet MAC hard IP, higher logic density (2,586K LC), 16 nm process | Better suited for 100G/400G optical transport and AI inference acceleration | Select when migrating to UltraScale+ architecture with need for hardened 100G interfaces |
| XC7VX690T-2FFG1930I | Virtex-7 architecture, 690K logic cells, 28 nm process, no GTX transceivers (uses GTH) | Preferred for legacy radar beamforming where GTH jitter specs dominate over GTX lane count | Choose for backward-compatible upgrades requiring identical I/O banking but higher DSP throughput |
Compared with XC6VSX315T-1FFG1156C, the XCVU9P-2FLGA2104I offers superior bandwidth and lower power per logic cell but requires PCB redesign due to FLGA2104 package; the XC7VX690T-2FFG1930I retains similar thermal profile and I/O flexibility while delivering 2.2× more DSP resources for compute-heavy radar algorithms.
Availability
XC6VSX315T-1FFG1156C is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6VSX315T-1FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and embedded processing solutions with leadership in FPGA and SoC technologies.
The Virtex-6 family was designed for high-bandwidth serial connectivity and compute-intensive signal processing in aerospace, defense, and wired/wireless communications systems.
FAQ
What is the maximum supported GTX transceiver data rate for XC6VSX315T-1FFG1156C?
The XC6VSX315T-1FFG1156C supports GTX transceivers up to 6.6 Gbps per lane. This rate is guaranteed across industrial temperature range (-40°C to +100°C) and meets jitter specifications for CPRI v6.1 and SRIO Gen2 compliance. The XC6VSX315T-1FFG1156C achieves this using dedicated PLLs with sub-15 ps RMS jitter performance.
Does XC6VSX315T-1FFG1156C support partial reconfiguration?
Yes, XC6VSX315T-1FFG1156C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This capability allows dynamic replacement of logic modules without disrupting active functions such as PCIe link maintenance or transceiver lock. The XC6VSX315T-1FFG1156C implements this using dedicated configuration access ports and hierarchical design partitioning tools in Vivado.
What I/O standards are supported by XC6VSX315T-1FFG1156C?
XC6VSX315T-1FFG1156C supports LVCMOS, LVTTL, SSTL, HSTL, differential LVDS, BLVDS, RSDS, and TMDS I/O standards. Each I/O bank is independently configurable for voltages from 1.2 V to 3.3 V. The XC6VSX315T-1FFG1156C also supports on-die termination (ODT) and programmable slew rate control per bank.
Is XC6VSX315T-1FFG1156C qualified for automotive applications?
No, XC6VSX315T-1FFG1156C is not AEC-Q100 qualified and is rated for industrial temperature range only (-40°C to +100°C). It lacks automotive-specific reliability testing, fault injection coverage, and safety documentation required for ISO 26262 ASIL-B/C systems. For automotive use, consider AMD's Zynq-7000 or Versal ACAP families instead of XC6VSX315T-1FFG1156C.
What configuration modes does XC6VSX315T-1FFG1156C support?
XC6VSX315T-1FFG1156C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. It also enables fallback configuration from dual SPI flash devices. The XC6VSX315T-1FFG1156C uses internal startup sequence controllers to manage INIT_B, DONE, and CCLK timing automatically during power-up.
XC6VSX315T-1FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VSX315T-1FFG1156C FAQ
1.How can I place an order for XC6VSX315T-1FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-1FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-1FFG1156C reliable?
The price and inventory of XC6VSX315T-1FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-1FFG1156C is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-1FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-1FFG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-1FFG1156C?
XC6VSX315T-1FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-1FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-1FFG1156C?
For technical support, including XC6VSX315T-1FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-1FFG1156C requirements.
6.How does Aetrix verify that XC6VSX315T-1FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-1FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-1FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-1FFG1156C?
All XC6VSX315T-1FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-1FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-1FFG1156C part is unused and in its original packaging.
Return procedure for XC6VSX315T-1FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6VSX315T-1FFG1156C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
