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AMD XC6VSX315T-1FFG1759C
- Part No.:
- XC6VSX315T-1FFG1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-1FFG1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,020
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Product details
Overview
XC6VSX315T-1FFG1759C from AMD is a high-performance Virtex-6 FPGA featuring 315,900 logic cells, 14,325 CLBs, 24 DSP48E1 slices, 16.8 Mb of block RAM, and support for 13.1 Gb/s transceivers. It is used in high-speed serial communication systems including 10G Ethernet and CPRI-based wireless infrastructure.
For engineers reviewing the XC6VSX315T-1FFG1759C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, block RAM depth, CLB count, I/O voltage flexibility (1.2 V to 3.3 V), and thermal performance in air-cooled 1759-pin FCBGA packaging.
Technical Context
The XC6VSX315T-1FFG1759C implements a 40 nm bulk CMOS process with dual-register LUT6 logic, integrated PCIe Gen2 x8 endpoint/switch capability, and configurable I/O banks supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. Its clocking architecture includes 32 MMCMs and 16 PLLs for low-jitter frequency synthesis and phase alignment.
It supports partial reconfiguration via ICAP and JTAG, includes built-in system monitoring (on-die temperature and supply sensors), and delivers deterministic timing closure across speed grade -1 with guaranteed setup/hold margins for 600 MHz DDR3 interfaces and 10.3125 Gb/s serial lanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,900 - determines maximum combinational and sequential logic capacity for complex control and datapath functions |
| CLBs | 14,325 - provides configurable logic blocks with dual 6-input LUTs and 8 flip-flops per CLB for high-density logic implementation |
| DSP Slices | 24 DSP48E1 - enables fixed-point arithmetic, filtering, FFT, and multiply-accumulate operations at up to 550 MHz |
| Block RAM | 16.8 Mb - supports large on-chip data buffering, FIFOs, and memory-mapped peripherals without external SRAM |
| Transceiver Speed | 13.1 Gb/s - meets line-rate requirements for 10GBASE-R, OTU2, and CPRI Option 7 applications |
| I/O Standards | SSTL-18/15, HSTL-I/II, LVCMOS, LVDS, TMDS - allows direct interface to DDR3, QDR SRAM, video PHYs, and high-speed ADC/DACs |
| Speed Grade | -1 - guarantees timing performance at junction temperature ≤ 100°C and VCCINT = 1.0 V ±3% |
Pinout & Package
This device is packaged in a 1759-pin Flip-Chip Ball Grid Array (FCBGA) with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, SelectIO, and clock management circuitry |
| VCCO | I/O bank power | Configurable 1.2–3.3 V per I/O bank to match interfaced peripheral voltage levels |
| MR | Master reset | Active-low asynchronous reset that clears configuration registers and halts user logic |
| CCLK | Configuration clock | Driven by external source during master serial or slave parallel configuration modes |
| GTX_CLK | Transceiver reference clock | Differential input for GTX transceiver banks; supports 100–650 MHz frequencies |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP supporting full-duplex 5 GT/s operation with AXI4 streaming interface |
| Partial Reconfiguration | Enables dynamic logic swapping via ICAP without disrupting active system functions |
| System Monitor | On-die temperature sensor (±5°C accuracy) and supply voltage monitors for real-time health tracking |
| MMCM/PLL Count | 32 MMCMs + 16 PLLs provide independent clock domain generation with sub-100 fs jitter for multi-clock systems |
| DDR3 Interface Support | Guaranteed timing closure for 600 MHz (1200 Mbps) DDR3 SDRAM with DQS gating and write leveling |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time digital predistortion (DPD) and MIMO signal processing in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable datapath accelerator implementing adaptive filtering, FFT/IFFT, and channel estimation with deterministic latency. Use Value: Enables 100% hardware-accelerated DPD loop with <1 μs latency and support for 4×4 MIMO using 24 DSP48E1 slices and 16.8 Mb block RAM. | Use Scenario: High-bandwidth pattern generation and analysis in automated test equipment for SerDes validation. IC Role / Device Role / Timing Role: Programmable protocol-aware generator/analyzer with embedded 13.1 Gb/s GTX transceivers and deep memory capture buffers. Use Value: Delivers single-chip 10.3125 Gb/s CPRI and 10GBASE-R compliance testing without external serializer/deserializer chips. |
| Avionics Data Concentrators | Medical Imaging Back-End Processing |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B network bridging in flight control systems with deterministic latency. IC Role / Device Role / Timing Role: Time-triggered switch fabric with hardware-scheduled packet routing and end-to-end latency guarantees. Use Value: Meets DO-254 DAL A timing constraints using 32 MMCMs for precise clock domain crossing and 14,325 CLBs for safety-critical packet classification logic. | Use Scenario: Real-time image reconstruction pipeline for CT and MRI scanners requiring low-latency pixel stream processing. IC Role / Device Role / Timing Role: Pipeline accelerator for back-projection, filtering, and DICOM compression with synchronized multi-channel DMA engines. Use Value: Achieves 250 MP/s throughput using 24 DSP48E1 slices for convolution kernels and 16.8 Mb block RAM for frame buffering without DRAM latency penalties. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, higher transceiver density (64 GTY @ 32.75 Gb/s), but larger package and higher power | Better suited for 400G Ethernet and AI inference acceleration; less optimal for cost-sensitive 10G CPRI deployments | Select when migrating to 28 nm or newer process nodes and requiring >20 Gb/s serial bandwidth |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 485,760 logic cells, same 1761-pin FCBGA footprint, but no native PCIe Gen2 hard IP | Offers higher logic density and improved DSP efficiency, yet requires soft PCIe core for endpoint functionality | Choose for legacy-compatible board upgrades where pin compatibility matters more than transceiver speed or PCIe integration |
Compared with XC6VSX315T-1FFG1759C, XCVU9P-2FLGA2104I delivers higher bandwidth and scalability at increased power and cost, while XC7VX485T-2FFG1761I offers greater logic capacity in a mechanically compatible package but lacks hardened PCIe Gen2 support-making XC6VSX315T-1FFG1759C optimal for balanced 10G serial + PCIe Gen2 designs.
Availability
XC6VSX315T-1FFG1759C is available at Aetrix Electronics and suitable for wireless infrastructure, high-speed test instrumentation, and avionics systems requiring stable component supply over extended production lifecycles.
Supply support for XC6VSX315T-1FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Virtex-6 family was designed for high-bandwidth, low-latency programmable logic applications in wired/wireless communications, defense electronics, and scientific instrumentation.
FAQ
What is the maximum guaranteed transceiver line rate for XC6VSX315T-1FFG1759C?
The XC6VSX315T-1FFG1759C supports a maximum guaranteed transceiver line rate of 13.1 Gb/s across all GTX transceiver quads. This rating is validated under speed grade -1 conditions (junction temperature ≤ 100°C, VCCINT = 1.0 V ±3%) and applies to protocols including 10GBASE-R, OTU2, and CPRI Option 7. The XC6VSX315T-1FFG1759C does not support rates beyond 13.1 Gb/s in production operation.
Does XC6VSX315T-1FFG1759C include hardened PCIe Gen2 endpoint logic?
Yes, the XC6VSX315T-1FFG1759C integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. It supports both root complex and endpoint roles, provides AXI4 streaming interfaces, and delivers full-duplex 5 GT/s operation with integrated TLP parsing and credit management. This feature is implemented in dedicated silicon within the XC6VSX315T-1FFG1759C and requires no soft-core licensing.
What I/O standards are supported by XC6VSX315T-1FFG1759C?
The XC6VSX315T-1FFG1759C supports SSTL-18, SSTL-15, HSTL-I, HSTL-II, LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, Differential SSTL, and TMDS across its 600+ user I/O pins. Each I/O bank is independently configurable for voltage and standard, enabling mixed-voltage interfaces such as DDR3 memory (SSTL-15) alongside video PHYs (TMDS) on the same XC6VSX315T-1FFG1759C device.
Is partial reconfiguration supported on XC6VSX315T-1FFG1759C?
Yes, the XC6VSX315T-1FFG1759C supports partial reconfiguration through its Internal Configuration Access Port (ICAP) and JTAG interface. This allows dynamic swapping of logic modules-such as filter coefficients or protocol engines-without resetting the entire device or interrupting active I/O or transceiver links. Partial reconfiguration is fully documented in UG380 and verified for use in field-deployed XC6VSX315T-1FFG1759C systems.
What thermal management guidance applies to XC6VSX315T-1FFG1759C?
The XC6VSX315T-1FFG1759C requires active airflow or heatsink mounting due to its 17W typical power dissipation in high-utilization configurations. AMD specifies a maximum junction temperature of 100°C for speed grade -1 operation, and recommends a thermal solution achieving ≤ 1.8°C/W junction-to-ambient resistance. The XC6VSX315T-1FFG1759C package includes a thermal lid compatible with standard clip-on heatsinks for FCBGA sockets.
XC6VSX315T-1FFG1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX315T-1FFG1759C FAQ
1.How can I place an order for XC6VSX315T-1FFG1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-1FFG1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-1FFG1759C reliable?
The price and inventory of XC6VSX315T-1FFG1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-1FFG1759C is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-1FFG1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-1FFG1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-1FFG1759C?
XC6VSX315T-1FFG1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-1FFG1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-1FFG1759C?
For technical support, including XC6VSX315T-1FFG1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-1FFG1759C requirements.
6.How does Aetrix verify that XC6VSX315T-1FFG1759C is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-1FFG1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-1FFG1759C meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-1FFG1759C?
All XC6VSX315T-1FFG1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-1FFG1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-1FFG1759C part is unused and in its original packaging.
Return procedure for XC6VSX315T-1FFG1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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