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AMD XC6VSX315T-1FFG1759I
- Part No.:
- XC6VSX315T-1FFG1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-1FFG1759I.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,487
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Product details
Overview
XC6VSX315T-1FFG1759I from AMD is a high-performance Virtex-6 FPGA featuring 315,900 logic cells, 14,336 Kbits of block RAM, and 640 DSP48E1 slices, operating at -1 speed grade with I-grade temperature rating (–40°C to +100°C). It targets high-bandwidth wired infrastructure and radar signal processing systems requiring deterministic low-latency data path control.
For engineers reviewing the XC6VSX315T-1FFG1759I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (720 user I/Os), transceiver line rate (up to 6.6 Gb/s), thermal performance in FFG1759 package, and support for PCIe Gen2 x8 endpoint functionality.
Technical Context
The XC6VSX315T-1FFG1759I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices, and integrated multi-gigabit transceivers (MGTs) supporting protocols including PCIe Gen2, SATA, and SRIO. It includes clock management tiles (CMTs) with DCMs and PLLs for precise timing control across multiple domains.
This device supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gb/s per pin. Its configuration interface supports Master SPI, Slave Serial, and JTAG modes, with bitstream encryption enabled via AES-256 and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,900 - determines maximum combinational/sequential logic capacity for complex state machines or packet processing pipelines |
| Block RAM | 14,336 Kbits - enables on-chip buffering for video frame stores, FIFOs, or protocol stack memory |
| DSP Slices | 640 DSP48E1 - supports parallel multiply-accumulate operations at up to 400 MHz for radar FFT or filter acceleration |
| User I/O Pins | 720 - provides high-density interface routing for multi-lane SerDes, memory controllers, or sensor arrays |
| Transceiver Line Rate | 6.6 Gb/s - meets minimum requirement for PCIe Gen2 x8 endpoint physical layer compliance |
| Speed Grade | -1 - specifies worst-case propagation delay and maximum operating frequency under I-grade thermal conditions |
| Operating Temp | –40°C to +100°C - qualifies for industrial and avionics environments without forced cooling |
Pinout & Package
The XC6VSX315T-1FFG1759I is housed in a 1759-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG1759) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free RoHS-compliant construction. Thermal design requires exposed thermal pad soldering to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, clock management, and transceiver reference circuits |
| VCCO | I/O bank power | Programmable per-bank voltage (1.2 V to 3.3 V) enabling mixed-voltage interface support |
| MGTAVCC | Transceiver analog supply | 1.0 V analog supply for MGT PLLs and serializers; sensitive to ripple and noise |
| CLK_IN | Dedicated clock input | Single-ended or differential input feeding CMT for system-wide clock domain generation |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or configuration error condition |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint Support | Integrated hard IP enables compliant x1/x2/x4/x8 endpoint operation without external bridge logic |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning or reverse engineering of configured logic functionality |
| Multi-Gigabit Transceivers | 24 MGT lanes with programmable equalization and pre-emphasis for channel loss compensation |
| Partial Reconfiguration | Allows dynamic module swapping during runtime-critical for adaptive radar waveform updates |
| System Monitor | On-die temperature and supply voltage sensors enable real-time thermal throttling and health monitoring |
Applications
| Radar Signal Processing | High-Speed Wired Infrastructure |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and track-before-detect algorithms with sub-microsecond latency. Use Value: 640 DSP48E1 slices deliver >2.5 GOPS sustained compute for FFT and FIR filtering at 100 MHz clock domain. | Use Scenario: Line-card processing in 10G Ethernet aggregation switches. IC Role / Device Role / Timing Role: Handles packet classification, deep packet inspection, and traffic shaping using embedded TCAM and BRAM-based lookup tables. Use Value: 720 user I/Os support dual 10G SFP+ interfaces plus DDR3 memory controller and management bus. |
| Avionics Data Concentrators | Medical Imaging Back-End |
Use Scenario: ARINC 664 (AFDX) end-system interface in flight control computers. IC Role / Device Role / Timing Role: Implements deterministic time-triggered communication stacks with hardware timestamping and bandwidth enforcement. Use Value: –40°C to +100°C operating range and ECC-enabled configuration memory meet DO-254 Level A requirements. | Use Scenario: Real-time image reconstruction pipeline in MRI and CT scanner back-ends. IC Role / Device Role / Timing Role: Accelerates inverse Fourier transforms and iterative reconstruction kernels while managing high-throughput ADC data streams. Use Value: 14,336 Kbits block RAM buffers full k-space datasets; transceivers interface directly to ADC ASICs at 5 Gb/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; higher logic density (2,586K LC), 48.8 Gb/s GTY transceivers, but larger 2104-ball package | Targets next-gen 5G baseband and AI inference where XC6VSX315T-1FFG1759I lacks sufficient DSP throughput | Select when migrating beyond 6.6 Gb/s serial bandwidth or requiring >1000 DSP slices |
| XC7VX485T-2FFG1761I | Virtex-7 generation; 485,760 logic cells, same FFG1761 footprint (pin-compatible with FFG1759), 13.1 Gb/s GTX transceivers | Offers drop-in upgrade path with higher I/O drive strength and improved power efficiency per logic cell | Choose for legacy board refresh where PCB layout reuse is mandatory and 13.1 Gb/s line rate is required |
Compared with XC6VSX315T-1FFG1759I, XCVU9P-2FLGA2104I delivers significantly higher serial bandwidth and logic capacity but demands new PCB layout and thermal redesign, while XC7VX485T-2FFG1761I offers a pin-compatible migration with enhanced transceiver performance and lower static power at identical form factor.
Availability
XC6VSX315T-1FFG1759I is available at Aetrix Electronics and suitable for radar signal processing, avionics data concentrators, and medical imaging back-end systems requiring stable component supply across extended product lifecycles.
Supply support for XC6VSX315T-1FFG1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets through acquired Xilinx technology.
The Virtex-6 family was engineered for high-performance wired infrastructure and defense electronics, emphasizing deterministic timing, high-speed serial connectivity, and radiation-tolerant configuration integrity.
FAQ
What is the maximum supported transceiver line rate for XC6VSX315T-1FFG1759I?
The XC6VSX315T-1FFG1759I supports a maximum transceiver line rate of 6.6 Gb/s using its integrated RocketIO GTP transceivers. This enables compliance with PCIe Gen2 x8 endpoint configurations and SATA II interfaces. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margins measured per IBIS-AMI simulation. XC6VSX315T-1FFG1759I does not support protocols requiring >6.6 Gb/s native line rates such as PCIe Gen3 or 10G Ethernet KR.
Does XC6VSX315T-1FFG1759I support partial reconfiguration?
Yes, XC6VSX315T-1FFG1759I supports hardware-accelerated partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This allows dynamic replacement of logic modules without resetting the entire device, enabling adaptive waveform updates in radar systems or protocol stack switching in communications equipment. Implementation requires Vivado Design Suite 2018.3 or later and adherence to Xilinx UG702 guidelines for partitioning and verification of reconfigurable regions.
What is the operating temperature range specified for XC6VSX315T-1FFG1759I?
XC6VSX315T-1FFG1759I is rated for industrial temperature operation from –40°C to +100°C (I-grade). This specification applies to junction temperature under steady-state conditions with proper thermal management, including adequate PCB copper pour and thermal vias beneath the FFG1759 package's exposed thermal pad. The device meets JEDEC JESD22-A104 reliability testing for this temperature range and is qualified for use in avionics and ground vehicle electronics without additional derating.
How many block RAM resources does XC6VSX315T-1FFG1759I provide?
XC6VSX315T-1FFG1759I integrates 14,336 Kbits of total block RAM distributed across 512 BRAM primitives, each configurable as 36 Kb dual-port RAM or two independent 18 Kb RAMs. This capacity supports large on-chip buffers for video frame storage, protocol stack context tables, or radar pulse history buffers. Block RAM access latency is fixed at two clock cycles for synchronous read operations, and all BRAMs support parity or ECC error detection when enabled in configuration mode.
Is XC6VSX315T-1FFG1759I pin-compatible with other Virtex-6 devices in the FFG1759 package?
XC6VSX315T-1FFG1759I shares the FFG1759 package footprint and ball map with other Virtex-6 SX-family devices including XC6VSX475T-1FFG1759I and XC6VSX315T-2FFG1759I, but pin functions differ based on internal resource allocation. Power and configuration pins are consistent, while I/O bank assignments and transceiver lane mapping vary. Board-level compatibility requires verification against the specific device's pinout table in DS152 v2.5 and cannot be assumed across speed grades or density variants.
XC6VSX315T-1FFG1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX315T-1FFG1759I FAQ
1.How can I place an order for XC6VSX315T-1FFG1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-1FFG1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-1FFG1759I reliable?
The price and inventory of XC6VSX315T-1FFG1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-1FFG1759I is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-1FFG1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-1FFG1759I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-1FFG1759I?
XC6VSX315T-1FFG1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-1FFG1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-1FFG1759I?
For technical support, including XC6VSX315T-1FFG1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-1FFG1759I requirements.
6.How does Aetrix verify that XC6VSX315T-1FFG1759I is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-1FFG1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-1FFG1759I meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-1FFG1759I?
All XC6VSX315T-1FFG1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-1FFG1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-1FFG1759I part is unused and in its original packaging.
Return procedure for XC6VSX315T-1FFG1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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