AMD XC6VSX315T-2FF1156I

Overview

XC6VSX315T-2FF1156I from AMD is a high-performance Virtex-6 FPGA with 315,900 logic cells, 14.4 Gb/s transceiver capability, and -2 speed grade in a 1156-pin Flip-Chip Fine-Pitch BGA package. It serves as a reconfigurable system-on-chip for high-bandwidth data processing in radar signal conditioning and 10G Ethernet line cards.

For engineers reviewing the XC6VSX315T-2FF1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, DSP slice density, I/O voltage support (1.2V/1.5V/1.8V/2.5V), and thermal performance in convection-cooled telecom chassis.

Technical Context

The XC6VSX315T-2FF1156I implements a 40 nm CMOS architecture with 1,728 DSP48E1 slices for fixed-point arithmetic acceleration and supports up to 72 GTX transceivers operating at 600 Mb/s–11.18 Gb/s. Its configuration interface includes SelectMAP, JTAG, and SPI boot modes with AES-256 bitstream encryption.

It integrates 24 clock management tiles (CMTs), each containing a PLL and MMCM, enabling precise jitter filtering and multi-phase clock synthesis. The device supports DDR3 memory interfaces up to 800 MHz (1600 MT/s) with hardware calibration and on-die termination control.

Key Specifications

Pinout & Package

XC6VSX315T-2FF1156I uses a 1156-pin Flip-Chip Fine-Pitch BGA (FF1156) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power FPGA applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance reconfigurable logic applications.

Compared with XC6VSX315T-2FF1156I, XCVU9P-2FLGA2104I offers greater scalability for future-proofing but increases thermal design complexity, while XC7VX485T-2FFG1761I delivers higher logic density in a thermally more manageable package at the cost of reduced transceiver lane availability.

Availability

XC6VSX315T-2FF1156I is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and broadcast video equipment requiring stable component supply across extended product lifecycles.

Supply support for XC6VSX315T-2FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.

The Virtex-6 family was engineered for high-bandwidth, low-latency reconfigurable logic in aerospace, defense, and wired communications infrastructure where deterministic timing and radiation-tolerant configuration are critical.

FAQ

What is the maximum supported DDR3 data rate for XC6VSX315T-2FF1156I?

The XC6VSX315T-2FF1156I supports DDR3 memory interfaces up to 800 MHz clock frequency (1600 MT/s data rate) with built-in write-leveling, read-leveling, and on-die termination calibration. This capability is implemented in dedicated memory controller logic within the FPGA fabric and verified across all I/O banks rated for SSTL-15.

Does XC6VSX315T-2FF1156I support partial reconfiguration?

Yes, XC6VSX315T-2FF1156I fully supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This allows runtime swapping of functional modules-such as changing modulation schemes in software-defined radio-without resetting the entire device or disrupting active I/O channels.

What configuration modes are available for XC6VSX315T-2FF1156I?

XC6VSX315T-2FF1156I supports five primary configuration modes: Master SelectMAP, Slave SelectMAP, JTAG, Serial (SPI), and Boundary Scan. Mode selection is controlled by M0–M2 pins at power-up, and all modes support AES-256 encrypted bitstreams loaded from external Flash or host processor.

What is the thermal design power (TDP) of XC6VSX315T-2FF1156I under typical operation?

The XC6VSX315T-2FF1156I has a typical thermal design power of 18 W under representative high-activity conditions (75% logic utilization, 48 GTX lanes active at 10.3125 Gb/s). This value assumes convection cooling with 200 LFM airflow and is validated per Xilinx UG372 and XTP067 characterization reports.

Is XC6VSX315T-2FF1156I qualified for automotive applications?

No, XC6VSX315T-2FF1156I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It is intended for telecom infrastructure, defense electronics, and broadcast equipment-not automotive ECUs or ADAS domains requiring automotive-grade reliability certification.