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AMD XC6VSX315T-2FF1759C
- Part No.:
- XC6VSX315T-2FF1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-2FF1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,615
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Product details
Overview
XC6VSX315T-2FF1759C from AMD is a high-performance Virtex-6 FPGA featuring 315,120 logic cells, 14,336 DSP48E1 slices, and 24.5 Mb of block RAM. It supports transceiver data rates up to 6.6 Gb/s with 48 GTX transceivers and operates at -2 speed grade (1.2 V core voltage). It is used in high-speed wired communications infrastructure and radar signal processing systems.
For engineers reviewing the XC6VSX315T-2FF1759C datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver count and speed, logic cell density, block RAM capacity, DSP slice availability, and thermal performance in compact PCB layouts.
Technical Context
The XC6VSX315T-2FF1759C implements a 40 nm HPL silicon process and uses SelectIO™ technology supporting LVDS, SSTL, HSTL, and differential signaling standards up to 1.25 Gb/s. Its clock management includes six mixed-mode clock managers (MMCMs) and phase-matched clock dividers for low-jitter timing synthesis.
It integrates 48 GTX serial transceivers compliant with PCIe Gen2, SRIO Gen2, and 10G Ethernet protocols. The device supports partial reconfiguration and built-in system monitoring via on-chip temperature and supply voltage sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,120 - determines maximum combinational/sequential logic capacity for complex control and datapath functions |
| DSP Slices | 14,336 - enables parallel multiply-accumulate operations for real-time filtering and FFT processing |
| Block RAM | 24.5 Mb - supports large on-chip buffering, FIFOs, and coefficient storage without external memory |
| GTX Transceivers | 48 × 6.6 Gb/s - provides multi-protocol serial I/O for backplane, optical, and chip-to-chip interfaces |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core voltage with specified maximum operating frequencies |
| I/O Standards | LVDS/SSTL/HSTL - ensures compatibility with DDR3 memory, high-speed ADCs/DACs, and FPGA-to-FPGA interconnects |
| MMCMs | 6 - delivers precise clock synthesis, phase alignment, and jitter reduction across multiple clock domains |
Pinout & Package
XC6VSX315T-2FF1759C is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFBGA) package with 1.0 mm ball pitch, optimized for high-density routing and thermal dissipation in high-performance computing modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V regulated input powering logic fabric and CLBs; requires low-noise decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, I/O banks, and transceiver reference clocks |
| VRP/VRN | Reference voltage terminals | Provide termination reference for differential I/O standards like LVDS and SSTL |
| CLK_IN | Primary clock input | Dedicated global clock input feeding MMCMs for system-wide timing distribution |
| GTx_Tx/Rx | Transceiver serial lanes | High-speed differential pairs supporting 6.6 Gb/s operation with programmable pre-emphasis and equalization |
| M0–M2 | Configuration mode pins | Determine boot source (JTAG, BPI, SPI) and configuration width during power-up initialization |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-critical for adaptive radio and protocol-agnostic baseband processing |
| On-Chip System Monitor | Real-time measurement of die temperature and internal supply voltages for thermal-aware scheduling and fault detection |
| SelectIO™ Technology | Configurable I/O standards per bank allow mixed-voltage interface to DDR3, QDR, and analog front-end components |
| PCIe Gen2 Endpoint Logic | Hard IP blocks reduce latency and resource usage for x4 lane endpoint implementations in embedded host systems |
| Transceiver Calibration | Automatic calibration of TX pre-emphasis and RX equalization improves signal integrity across varying board trace lengths |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; GTX transceivers interface with high-speed ADCs and DACs. Use Value: 14,336 DSP slices enable concurrent multi-channel processing; 48 GTX lanes support >10 Gb/s aggregate ADC data ingestion. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers requiring synchronized sampling at 1+ GS/s per channel. IC Role / Device Role / Timing Role: Timing controller and digital down-converter; manages ADC trigger, sample buffering, and spectral analysis pipelines. Use Value: 24.5 Mb block RAM stores deep acquisition buffers; MMCMs generate phase-aligned clocks for multi-ADC synchronization. |
| Optical Transport Networking | Avionics Data Concentrators |
Use Scenario: OTN framer/mapper and FEC engine in 10G/40G line cards for metro and core transport equipment. IC Role / Device Role / Timing Role: Protocol accelerator handling OTU2/OTU3 framing, GFP encapsulation, and Reed-Solomon encoding/decoding. Use Value: GTX transceivers directly interface with SFP+/QSFP+ optical modules; logic density supports full OTN stack implementation. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data concentrator in flight control and mission computing systems. IC Role / Device Role / Timing Role: Deterministic switch fabric and protocol bridge between legacy avionics buses and high-speed Ethernet backplanes. Use Value: -2 speed grade ensures timing margin under extended temperature range; dual-redundant I/O banks meet DO-254 safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 6.0 Gb/s GTY transceivers, 1.0 V core | Higher logic density and transceiver bandwidth; targets next-gen 100G+ systems | Choose XCVU9P-2FLGA2104I when migrating to 16 nm process, requiring >2× logic capacity or GTY-based 100G Ethernet support |
| XC6VLX240T-2FF1156C | Same Virtex-6 family, 240,000 logic cells, 24 GTX transceivers, smaller FF1156 package | Lower I/O count and transceiver count; suited for cost-optimized mid-range designs | Choose XC6VLX240T-2FF1156C when reducing BOM cost and board area while retaining Virtex-6 toolchain compatibility |
Compared with XC6VSX315T-2FF1759C, XCVU9P-2FLGA2104I offers higher scalability for future-proofing but requires new PCB layout and toolchain migration, whereas XC6VLX240T-2FF1156C retains pin-compatible design continuity within the same family at lower performance tier.
Availability
XC6VSX315T-2FF1759C is available at Aetrix Electronics and suitable for radar signal processing, optical transport networking, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6VSX315T-2FF1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and aerospace applications.
The Virtex-6 family was designed for demanding signal processing, high-speed serial connectivity, and deterministic real-time control in defense, telecom, and test equipment.
FAQ
What is the core voltage requirement for XC6VSX315T-2FF1759C?
The XC6VSX315T-2FF1759C requires a nominal 1.2 V core supply (VCCINT) with ±3% tolerance. This voltage powers the logic fabric, CLBs, and internal routing resources. Stable regulation and proper decoupling are essential to meet the -2 speed grade timing specifications and prevent functional failure under high utilization.
Does XC6VSX315T-2FF1759C support PCIe Gen2 x4 endpoint functionality?
Yes, XC6VSX315T-2FF1759C includes hard IP blocks for PCIe Gen2 x4 endpoint operation. These dedicated blocks handle link training, transaction layer, and data link layer functions, reducing logic resource usage and improving latency predictability compared to soft-core implementations in the FPGA fabric.
How many GTX transceivers does XC6VSX315T-2FF1759C have, and what protocols do they support?
XC6VSX315T-2FF1759C integrates 48 GTX transceivers, each capable of 6.6 Gb/s operation. They support PCIe Gen2, Serial RapidIO Gen2, 10GBASE-R Ethernet, CPRI, and custom high-speed serial protocols through programmable physical coding sublayer (PCS) and physical medium attachment (PMA) layers.
What configuration modes are supported by XC6VSX315T-2FF1759C?
XC6VSX315T-2FF1759C supports master serial, slave serial, boundary-scan (JTAG), and master/BPI parallel configuration modes. Mode selection is controlled by M0–M2 pins at power-up, enabling flexible boot sources including SPI flash, parallel NOR flash, or external processors via JTAG.
Is partial reconfiguration supported on XC6VSX315T-2FF1759C?
Yes, XC6VSX315T-2FF1759C supports partial reconfiguration, allowing dynamic replacement of logic modules while the rest of the design remains operational. This capability is implemented via dedicated configuration access ports (CAPs) and verified in Xilinx ISE 14.7 and Vivado 2015.4+ toolchains for adaptive signal processing applications.
XC6VSX315T-2FF1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX315T-2FF1759C FAQ
1.How can I place an order for XC6VSX315T-2FF1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-2FF1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-2FF1759C reliable?
The price and inventory of XC6VSX315T-2FF1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-2FF1759C is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-2FF1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-2FF1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-2FF1759C?
XC6VSX315T-2FF1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-2FF1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-2FF1759C?
For technical support, including XC6VSX315T-2FF1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-2FF1759C requirements.
6.How does Aetrix verify that XC6VSX315T-2FF1759C is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-2FF1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-2FF1759C meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-2FF1759C?
All XC6VSX315T-2FF1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-2FF1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-2FF1759C part is unused and in its original packaging.
Return procedure for XC6VSX315T-2FF1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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