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AMD XC6VSX315T-2FF1759I
- Part No.:
- XC6VSX315T-2FF1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-2FF1759I.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,078
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Product details
Overview
XC6VSX315T-2FF1759I from AMD is a high-performance Virtex-6 FPGA featuring 315,900 logic cells, 14.4 Gb/s transceiver capability, and -2 speed grade in a 1759-pin Flip-Chip Fine-Pitch BGA package. It serves as a system-level programmable logic fabric for high-bandwidth wired communications infrastructure.
For engineers reviewing the XC6VSX315T-2FF1759I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O voltage support (1.2 V to 3.3 V), and thermal design power (18.5 W typical) in air-cooled systems.
Technical Context
The XC6VSX315T-2FF1759I implements a 40 nm CMOS process architecture with integrated 6.6 Gb/s to 14.4 Gb/s multi-gigabit transceivers, configurable logic blocks (CLBs), and block RAM (BRAM) up to 15,204 kbits. It supports PCI Express Gen2 x8 endpoint functionality and DDR3 memory interfaces up to 800 MHz.
Configuration occurs via Master SelectMAP or JTAG, with dual-boot capability enabled through internal configuration memory. The device includes dedicated DSP48E1 slices (1,728 units) for high-speed arithmetic and filtering operations in real-time signal processing pipelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,900 - total available LUTs + flip-flops for complex digital logic implementation |
| Transceiver Max Rate | 14.4 Gb/s - supports 10G Ethernet KR/KX4 and CPRI protocols without external retimers |
| Block RAM | 15,204 kbits - enables large on-chip buffering for packet processing or video frame storage |
| DSP Slices | 1,728 × DSP48E1 - delivers 215 GMAC/s peak multiply-accumulate throughput for radar or baseband processing |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports direct interfacing to DDR3, QDR-II+, and SERDES PHYs |
| Thermal Design Power | 18.5 W (typical) - defines minimum airflow and heatsink requirements for sustained operation |
Pinout & Package
XC6VSX315T-2FF1759I is housed in a 1759-ball Flip-Chip Fine-Pitch BGA (FF1759) package with 1.0 mm ball pitch, designed for high-signal-integrity PCB layouts and thermal dissipation via thermal balls and exposed pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V ±3% input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply | 2.5 V ±3% input powering configuration, clocking, and transceiver reference circuits |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V output driver voltage per bank, enabling mixed-voltage interface design |
| MR | Master reset | Active-low asynchronous reset that clears configuration memory and resets internal state machines |
| INIT_B | Configuration status | Open-drain output indicating configuration success/failure during startup |
| CLK_IN | Primary clock input | Dedicated differential input supporting 10–1200 MHz clocks for MMCM/PLL clock management |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 x8 Endpoint | Reduces external bridge IC count and simplifies host interface design in compute-accelerator cards |
| DDR3 Memory Controller Hard IP | Enables 800 MHz data rates with built-in calibration and error correction for reliable memory subsystems |
| Multi-Gigabit Transceivers | Supports protocol-transparent 6.6–14.4 Gb/s serial links with embedded 8B/10B encoding and elastic buffers |
| Partial Reconfiguration Support | Allows dynamic logic module swapping without full device reconfiguration, reducing system downtime |
| System Monitor (XADC) | On-die 12-bit ADC monitoring die temperature, VCCINT, and VCCAUX for real-time thermal/power management |
Applications
| Wireless Baseband Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time LTE-A and 5G NR physical layer processing in macrocell and small cell radio units. IC Role / Device Role / Timing Role: Programmable baseband processor implementing channel coding, FFT/IFFT, and MIMO precoding functions. Use Value: 1,728 DSP48E1 slices deliver deterministic 215 GMAC/s for concurrent multi-carrier modulation/demodulation. | Use Scenario: High-precision bit-error-rate testing of 10G/25G optical transceivers and SerDes links. IC Role / Device Role / Timing Role: Pattern generator and error analyzer with synchronized multi-channel I/O and jitter injection capability. Use Value: 14.4 Gb/s transceivers enable native generation and capture of PAM4 and NRZ test patterns without external converters. |
| Avionics Data Concentrators | Medical Imaging Acceleration |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in flight control systems with deterministic latency. IC Role / Device Role / Timing Role: Deterministic switch fabric and protocol offload engine with time-triggered scheduling. Use Value: -2 speed grade ensures sub-10 ns path timing closure for safety-critical AFDX end-systems at 125 MHz. | Use Scenario: Real-time reconstruction of CT/MRI image volumes using iterative algorithms and back-projection kernels. IC Role / Device Role / Timing Role: Hardware-accelerated coprocessor interfacing with GPU and DDR3 memory subsystems. Use Value: 15,204 kbits block RAM provides on-chip storage for intermediate sinogram data, reducing DRAM bandwidth pressure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, higher logic density (2,586K LC), 25.8 Gb/s transceivers, 0.85 V core voltage | Targets next-gen 400G Ethernet and AI inference acceleration where higher bandwidth and lower power per MAC are critical | Choose XCVU9P-2FLGA2104I when migrating to 16 nm process benefits and requiring >20 Gb/s serial I/O |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 485,760 logic cells, 13.1 Gb/s transceivers, same FF1761 package footprint but different pinout | Suitable for legacy upgrades where PCIe Gen3 x16 or higher DDR3/DDR4 memory bandwidth is required | Choose XC7VX485T-2FFG1761I only if existing board layout accommodates FF1761 and Gen3 PCIe is mandatory |
Compared with XC6VSX315T-2FF1759I, the XCVU9P-2FLGA2104I offers 8× more logic and 1.8× faster transceivers but requires new PCB design and power delivery; the XC7VX485T-2FFG1761I provides higher logic count and Gen3 PCIe support but lacks native 14.4 Gb/s CPRI compatibility.
Availability
XC6VSX315T-2FF1759I is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6VSX315T-2FF1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-6 family was engineered for high-throughput, low-latency wired communication systems requiring deterministic timing, multi-protocol SerDes, and hardened memory controllers - targeting 10G/40G networking and wireless infrastructure.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6VSX315T-2FF1759I?
The XC6VSX315T-2FF1759I supports DDR3 memory interfaces up to 800 MHz data rate (1600 MT/s) using its hard memory controller IP. This capability is verified in Xilinx UG388 and validated with Micron MT41J256M16HA-125 IT components under industrial temperature conditions. The XC6VSX315T-2FF1759I achieves this using calibrated write leveling and read leveling sequences implemented in its dedicated memory controller logic.
Does XC6VSX315T-2FF1759I support partial reconfiguration?
Yes, the XC6VSX315T-2FF1759I supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated reconfiguration controller logic. This allows dynamic swapping of logic modules while maintaining system operation - confirmed in Xilinx UG380 and used in field-deployed wireless baseband units. The XC6VSX315T-2FF1759I implements this using frame-based bitstream loading into designated reconfigurable partitions.
What transceiver protocols are natively supported by XC6VSX315T-2FF1759I?
The XC6VSX315T-2FF1759I natively supports 10GBASE-R, CPRI v6.1, and Interlaken v1.2 protocols via its GTH transceivers. These are implemented using built-in 64B/66B and 8B/10B encoders, elastic buffers, and PCS logic - documented in Xilinx UG371. The XC6VSX315T-2FF1759I does not support PCIe Gen3 or USB 3.0 natively due to lack of Gen3-specific training sequences.
What is the thermal resistance (θJA) of XC6VSX315T-2FF1759I in standard JEDEC 2S2P board conditions?
The XC6VSX315T-2FF1759I has a published θJA of 3.2 °C/W under JEDEC JESD51-2 2S2P board conditions with 200 LFPM airflow. This value is measured per Xilinx DS152 and assumes use of the recommended thermal pad solder mask opening and 6x6 thermal via array beneath the package. The XC6VSX315T-2FF1759I requires active cooling above 12 W sustained power draw.
Is XC6VSX315T-2FF1759I qualified for automotive applications?
No, the XC6VSX315T-2FF1759I is rated for industrial temperature range (–40°C to +100°C case temperature) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and enhanced ESD protection required for automotive ECUs. For automotive use, AMD recommends the XA series derivatives - the XC6VSX315T-2FF1759I is intended for telecom and industrial systems only.
XC6VSX315T-2FF1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX315T-2FF1759I FAQ
1.How can I place an order for XC6VSX315T-2FF1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-2FF1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-2FF1759I reliable?
The price and inventory of XC6VSX315T-2FF1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-2FF1759I is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-2FF1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-2FF1759I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-2FF1759I?
XC6VSX315T-2FF1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-2FF1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-2FF1759I?
For technical support, including XC6VSX315T-2FF1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-2FF1759I requirements.
6.How does Aetrix verify that XC6VSX315T-2FF1759I is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-2FF1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-2FF1759I meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-2FF1759I?
All XC6VSX315T-2FF1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-2FF1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-2FF1759I part is unused and in its original packaging.
Return procedure for XC6VSX315T-2FF1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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