AMD XC6VSX315T-2FFG1156C

Overview

XC6VSX315T-2FFG1156C from AMD (formerly Xilinx) is a high-performance Virtex-6 FPGA featuring 315,936 logic cells, 14,744 Kbits of block RAM, and 1,248 DSP48E1 slices. It supports transceiver data rates up to 6.6 Gb/s and operates at -2 speed grade with 1.2 V core voltage. It is used in high-speed serial interface prototyping and radar signal processing systems.

For engineers reviewing the XC6VSX315T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage flexibility, thermal performance in FFG1156 packaging, and support for PCIe Gen2 x8 endpoint configurations.

Technical Context

The XC6VSX315T-2FFG1156C implements a 40 nm CMOS process architecture with integrated multi-gigabit transceivers (MGTs), SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling standards, and configurable logic blocks (CLBs) with six-input LUTs and dual flip-flops per slice. It includes dedicated clock management tiles (CMTs) with DCMs and PLLs for low-jitter clock synthesis.

This device belongs to the Virtex-6 SX family optimized for serial connectivity and signal processing. Its 64 MGT lanes are organized across eight quads, each supporting protocols including PCIe Gen2, SRIO 2.1, and 10G Ethernet MAC layer interfaces without external retimers.

Key Specifications

Pinout & Package

The XC6VSX315T-2FFG1156C is housed in a 1156-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free/NiPdAu surface finish. Thermal pad on underside enables direct PCB thermal via connection to internal ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VSX315T-2FFG1156C, the XCVU9P-2FLGA2104I enables higher serial bandwidth at cost of increased power and toolchain migration, while the XC7VX485T-2FFG1761I extends Virtex-6 design continuity with greater logic capacity but demands mechanical rework and thermal reassessment.

Availability

XC6VSX315T-2FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, avionics communication gateways, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC6VSX315T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, aerospace, and industrial applications.

The Virtex-6 family was originally designed by Xilinx for high-bandwidth, low-latency signal processing and serial connectivity in defense, scientific instrumentation, and wired infrastructure systems.

FAQ

What is the maximum supported transceiver data rate for XC6VSX315T-2FFG1156C?

The XC6VSX315T-2FFG1156C supports transceiver data rates up to 6.6 Gb/s per lane. This specification is validated across all 64 MGT lanes under -2 speed grade conditions at 1.2 V core voltage and junction temperature ≤ 100°C. The XC6VSX315T-2FFG1156C achieves this using adaptive equalization and embedded 8B/10B encoding, enabling reliable PCIe Gen2 and SRIO 2.1 operation without external redrivers.

Does XC6VSX315T-2FFG1156C include hard IP for PCI Express?

Yes, the XC6VSX315T-2FFG1156C integrates a hard PCIe Gen2 endpoint block supporting x1, x2, x4, and x8 link widths. This block handles TLP generation, completion timeout management, and Advanced Error Reporting (AER) without consuming programmable logic resources. The XC6VSX315T-2FFG1156C's PCIe implementation complies with PCI-SIG v3.0 specifications and has been verified in Xilinx reference designs for endpoint applications.

What I/O standards are supported by XC6VSX315T-2FFG1156C?

The XC6VSX315T-2FFG1156C supports 21 SelectIO standards including SSTL18_I, HSTL_I, LVDS_25, TMDS, and MIPI D-PHY compliant signaling. Each of its 24 I/O banks allows independent VCCO and VREF configuration, enabling concurrent operation of multiple voltage domains. The XC6VSX315T-2FFG1156C's I/O architecture permits direct interfacing to DDR3 memory, analog front-end ADCs, and display controllers without level-shifting components.

Is partial reconfiguration supported on XC6VSX315T-2FFG1156C?

Yes, the XC6VSX315T-2FFG1156C supports partial reconfiguration through dedicated configuration logic and frame-based bitstream loading. This capability allows dynamic swapping of functional modules-such as filter coefficients or protocol stacks-without resetting the entire device or disrupting active I/O channels. The XC6VSX315T-2FFG1156C implements this using Xilinx's PlanAhead and Vivado tools with certified PR flows for DO-254 and IEC 61508 applications.

What is the thermal design power (TDP) range for XC6VSX315T-2FFG1156C?

The XC6VSX315T-2FFG1156C exhibits a typical thermal design power between 12.5 W and 24.8 W depending on resource utilization, clock frequency, and I/O activity. At 100% logic utilization with all 64 transceivers active at 6.6 Gb/s, peak power reaches 24.8 W under worst-case corner conditions. The XC6VSX315T-2FFG1156C's FFG1156 package includes an exposed thermal pad that requires ≥ 12 thermal vias to internal ground planes for effective heat dissipation.