AMD XC6VSX315T-2FFG1156I

Overview

XC6VSX315T-2FFG1156I from AMD is a high-performance Virtex-6 FPGA featuring 315,936 logic cells, 14,336 DSP48E1 slices, and 24.5 Mb of block RAM. It operates at -2 speed grade (1.2 V core, 1.25 GHz GTX transceiver), housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 0.8 mm pitch, and targets high-speed serial interface and signal processing systems.

For engineers reviewing the XC6VSX315T-2FFG1156I datasheet, pinout, applications, or equivalent options, key selection criteria include GTX transceiver performance, I/O bank voltage flexibility (1.2–3.3 V), thermal design power (TDP ≈ 17.5 W), and support for PCIe Gen2 x8 and SRIO Gen2 endpoints.

Technical Context

The XC6VSX315T-2FFG1156I implements a hierarchical FPGA architecture with six I/O banks supporting mixed-voltage operation, integrated GTX transceivers capable of 6.6 Gb/s line rates, and configurable logic blocks (CLBs) with dual 6-input LUTs and 8 flip-flops per slice. It supports SelectIO standards including LVDS, SSTL, HSTL, and TMDS.

Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device includes dedicated clock management tiles (CMTs) with DCMs and PLLs for jitter reduction and frequency synthesis across multiple domains.

Key Specifications

Pinout & Package

XC6VSX315T-2FFG1156I is packaged in a 1156-ball Flip-Chip Fine-Pitch BGA (FFG) with 0.8 mm ball pitch and thermal lid. Pinout follows AMD's Virtex-6 FFG1156 mechanical and electrical specification, with dedicated configuration, clock, JTAG, GTX, and I/O bank pins arranged in defined rows/columns.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VSX315T-2FFG1156I, XCVU9P-2FLGA2104I delivers higher bandwidth and scalability at the cost of board redesign, whereas XC7VX485T-2FFG1761I provides incremental architectural improvement with reduced quiescent current-both require updated toolchain and constraint migration.

Availability

XC6VSX315T-2FFG1156I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging backend systems requiring stable component supply over extended production lifecycles.

Supply support for XC6VSX315T-2FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms, including FPGAs, adaptive SoCs, and AI accelerators for data center, aerospace, and industrial applications.

The Virtex-6 family was engineered for high-throughput, low-latency signal processing and serial connectivity in mission-critical infrastructure where reliability, configurability, and long-term support are essential.

FAQ

What is the maximum supported GTX transceiver data rate for XC6VSX315T-2FFG1156I?

The XC6VSX315T-2FFG1156I supports GTX transceivers rated for up to 6.6 Gb/s per lane under the -2 speed grade. This rating is guaranteed across the industrial temperature range (-40°C to +100°C) with proper reference clock jitter compliance and PCB interconnect design meeting AMD's IBIS-AMI modeling requirements.

Does XC6VSX315T-2FFG1156I support bitstream encryption?

Yes, XC6VSX315T-2FFG1156I supports AES-256 bitstream encryption and HMAC-based authentication. These security features require programming a unique device key into eFUSE and enabling encryption during bitstream generation in Vivado Design Suite or ISE Design Tools.

What I/O standards are supported by XC6VSX315T-2FFG1156I?

XC6VSX315T-2FFG1156I supports 21 SelectIO standards including LVDS_25, SSTL15_T_DCI, HSTL_I, DIFF_HSTL_I, and TMDS_33. Each I/O bank operates independently with configurable VCCO (1.2–3.3 V) and on-die termination calibration for impedance matching.

Is XC6VSX315T-2FFG1156I pin-compatible with other Virtex-6 devices in the FFG1156 package?

XC6VSX315T-2FFG1156I shares the FFG1156 mechanical footprint and ball map with other Virtex-6 devices in the same package variant, such as XC6VSX315T-1FFG1156C. However, functional pin assignments (e.g., GTX locations, clock inputs) differ across speed grades and device densities, requiring careful review of the specific pinout table.

What configuration modes does XC6VSX315T-2FFG1156I support?

XC6VSX315T-2FFG1156I supports four primary configuration modes: Master SPI, Slave Serial, Slave Parallel, and JTAG. Mode selection is controlled by M0–M2 pins at power-up, and JTAG remains active regardless of mode for debugging and boundary-scan testing.