AMD XC6VSX315T-2FFG1759C

Overview

XC6VSX315T-2FFG1759C from AMD is a high-performance Virtex-6 FPGA featuring 315,900 logic cells, 14.4 Gb/s transceiver capability, and 28 nm HKMG process technology; it serves as a system-on-chip fabric for high-speed serial interface bridging in 10G Ethernet line cards.

For engineers reviewing the XC6VSX315T-2FFG1759C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage support, block RAM depth, DSP48E1 slice throughput, and thermal design power budgeting.

Technical Context

The XC6VSX315T-2FFG1759C implements a multi-die architecture with integrated GTX transceivers supporting 600 Mb/s to 6.6 Gb/s line rates, and includes SelectIO technology with programmable termination and differential standards including LVDS, TMDS, and RSDS. It integrates 1,824 Kbits of block RAM and 1,920 DSP48E1 slices optimized for high-throughput filtering and FFT operations.

This device belongs to the Virtex-6 SX family and supports partial reconfiguration, PCIe Gen2 x8 endpoint functionality, and dual-register I/O with source-synchronous timing control - all verified in the Xilinx UG364 and UG372 documentation.

Key Specifications

Pinout & Package

XC6VSX315T-2FFG1759C is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Thermal pad on underside requires solder paste stencil design per Xilinx XTP057.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC6VSX315T-2FFG1759C, the XCVU9P-2FLGA2104I delivers higher serial bandwidth and lower power/GMAC but demands revised power integrity design; the XC7VX485T-2FFG1761I offers more transceivers and logic in identical package size but lacks integrated PCIe Gen2 hard IP, increasing RTL integration effort.

Availability

XC6VSX315T-2FFG1759C is available at Aetrix Electronics and suitable for 10G Ethernet infrastructure, wireless baseband processing, and avionics data concentrators requiring stable component supply over extended production lifecycles.

Supply support for XC6VSX315T-2FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and ACAPs for high-performance computing and signal processing.

The Virtex-6 family was originally designed by Xilinx for high-bandwidth, low-latency system integration in wired/wireless infrastructure and defense electronics, emphasizing transceiver flexibility and deterministic timing.

FAQ

What is the maximum supported transceiver data rate for XC6VSX315T-2FFG1759C?

The XC6VSX315T-2FFG1759C supports GTX transceivers with a maximum data rate of 6.6 Gb/s per lane, validated across temperature and voltage corners per Xilinx DS152. This rate enables compliance with 10GBASE-R, CPRI, and Serial RapidIO Gen2 protocols when configured with appropriate reference clocks and equalization settings.

Does XC6VSX315T-2FFG1759C include hard IP for PCI Express?

Yes, XC6VSX315T-2FFG1759C integrates a PCIe Gen2 x8 endpoint hard IP block compliant with the PCI Express Base Specification 2.0. This eliminates the need for external bridge chips and reduces latency in host-interface applications such as high-speed data acquisition systems using the XC6VSX315T-2FFG1759C.

What I/O standards are supported by XC6VSX315T-2FFG1759C?

XC6VSX315T-2FFG1759C supports LVDS, TMDS, RSDS, SSTL, HSTL, and differential termination through its SelectIO technology. Each of the 720 I/O pins can be independently configured per bank for 1.2 V to 3.3 V operation, enabling mixed-standard interfaces like DDR3 memory controllers alongside LVDS camera links in the same XC6VSX315T-2FFG1759C design.

Is partial reconfiguration supported on XC6VSX315T-2FFG1759C?

Yes, XC6VSX315T-2FFG1759C supports partial reconfiguration as defined in Xilinx UG702. This allows dynamic swapping of logic modules-such as modulator/demodulator blocks in software-defined radios-without resetting the entire device, preserving state in active regions and reducing system-level downtime during field updates of the XC6VSX315T-2FFG1759C.

What is the thermal design power (TDP) of XC6VSX315T-2FFG1759C at full utilization?

The XC6VSX315T-2FFG1759C has a typical thermal design power of 18.2 W under worst-case operating conditions (junction temperature = 100°C, VCCINT = 1.2 V, full transceiver and logic utilization), per Xilinx XTP057. Actual power depends on configuration, clock frequency, and I/O activity, and must be modeled using Xilinx XPE for accurate XC6VSX315T-2FFG1759C thermal management.