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AMD XC6VSX315T-2FFG1759I
- Part No.:
- XC6VSX315T-2FFG1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-2FFG1759I.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,332
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Product details
Overview
XC6VSX315T-2FFG1759I from AMD is a high-performance Virtex-6 FPGA featuring 315,936 logic cells, 14,336 DSP48E1 slices, and 24.5 Mb of block RAM, designed for high-speed serial connectivity in aerospace, defense, and wired infrastructure systems.
For engineers reviewing the XC6VSX315T-2FFG1759I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (720), transceiver line rate (6.6 Gb/s), speed grade (-2), and extended temperature support (-40°C to +100°C).
Technical Context
The XC6VSX315T-2FFG1759I implements a 40 nm copper CMOS process with integrated GTX transceivers supporting PCIe Gen2, SRIO 2.1, and 10G Ethernet protocols. It includes SelectIO technology with support for LVDS, SSTL, HSTL, and differential signaling standards up to 1.25 Gb/s.
Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG interfaces, with bitstream encryption and HMAC authentication enabled for secure configuration. The device supports partial reconfiguration and dynamic power management through multiple VCCINT/VCCAUX voltage domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,936 - total configurable logic resources for complex digital logic implementation |
| DSP Slices | 14,336 × DSP48E1 - fixed-point arithmetic units supporting 25×18 multiply-accumulate at 550 MHz |
| Block RAM | 24.5 Mb - distributed memory capacity usable as FIFOs, buffers, or lookup tables |
| Transceivers | 32 × GTX - serial I/O supporting 600 Mb/s to 6.6 Gb/s with built-in PCS/PMA |
| I/O Pins | 720 - user-configurable pins with programmable drive strength and slew rate |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temp conditions |
| Operating Temp | -40°C to +100°C - qualified for extended temperature environments without derating |
Pinout & Package
XC6VSX315T-2FFG1759I is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. The package supports thermal dissipation up to 25 W and provides signal integrity optimized routing for high-speed serial lanes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.0 V ±3% supply for FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power Supply | 1.8 V ±3% supply for configuration, clocking, and transceiver reference circuits |
| VCCO | I/O Bank Power | Programmable bank voltage (1.2–3.3 V) setting interface voltage level per I/O standard |
| MRCC/MRCC_N | Multi-Gigabit Ref Clock Input | Differential input pair for transceiver reference clocks up to 875 MHz |
| GTX_RXN/GTX_RXP | Transceiver Receive Lane | Differential AC-coupled inputs supporting 600 Mb/s–6.6 Gb/s serial data recovery |
| GTX_TXN/GTX_TXP | Transceiver Transmit Lane | Differential AC-coupled outputs with programmable pre-emphasis and output swing |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime logic updates without system reset, reducing downtime in mission-critical systems |
| Bitstream Encryption | 256-bit AES key protection prevents unauthorized configuration and IP theft |
| Dynamic Power Management | Independent power gating per logic column and I/O bank reduces active power by up to 40% |
| PCIe Gen2 Endpoint | Integrated hard IP supporting x1/x2/x4/x8 lane configurations with full protocol compliance |
| SRIO 2.1 Hard IP | Dedicated switch fabric supporting 1x/2x/4x lane widths and packet-based switching at 5 Gbaud |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and adaptive filtering; GTX transceivers interface with ADC/DAC FMC modules. Use Value: 315K logic cells and 14K DSP slices enable simultaneous multi-channel processing at 100+ MSPS sample rates. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers requiring synchronized sampling across 16+ channels. IC Role / Device Role / Timing Role: Timing controller and data aggregator; GTX links transfer raw samples to host memory over PCIe Gen2 x8. Use Value: 6.6 Gb/s transceivers and 720 I/Os support deterministic latency and sub-nanosecond inter-channel skew alignment. |
| Avionics Data Concentrators | 10G Base-R Ethernet Line Cards |
Use Scenario: ARINC 664 Part 7 (AFDX) end-systems consolidating sensor, actuator, and display traffic on deterministic networks. IC Role / Device Role / Timing Role: Protocol engine and traffic shaper; implements virtual link scheduling and error detection in hardware. Use Value: -40°C to +100°C operation and SEU-hardened configuration memory ensure reliability in flight-critical environments. | Use Scenario: Carrier-grade optical transport equipment aggregating 10G Ethernet streams into OTN or SONET payloads. IC Role / Device Role / Timing Role: MAC-to-PHY bridge and framer; GTX transceivers connect to XFP/SFP+ modules with IEEE 802.3ae compliance. Use Value: Integrated 10GBASE-R PCS with FEC and scrambling eliminates need for external PHY ICs and reduces BOM count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760I | UltraScale architecture, 492K logic cells, higher transceiver count (48 × GTY), 15 Gb/s line rate | Better suited for 25G/100G Ethernet and AI inference acceleration; requires updated PCB stackup and power delivery | Select when migrating to higher bandwidth or needing hardened 25G Ethernet MACs |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 485K logic cells, 36 × GTH transceivers, 13.1 Gb/s line rate, larger package (1761-ball) | Offers greater logic density and higher-speed serial I/O but consumes more power and has longer lead time | Choose for legacy-compatible upgrades where -2 speed grade and extended temp are mandatory |
Compared with XC6VSX315T-2FFG1759I, the XCVU3P-2FFVD1760I delivers higher throughput and newer protocol support but demands revised thermal and signal-integrity design, while the XC7VX485T-2FFG1761I extends Virtex-6 compatibility with increased resources at the cost of higher static power and footprint.
Availability
XC6VSX315T-2FFG1759I is available at Aetrix Electronics and suitable for radar signal processing, avionics data concentrators, and 10G Ethernet line cards requiring stable component supply across long-lifecycle programs.
Supply support for XC6VSX315T-2FFG1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets with emphasis on performance-per-watt and security.
The Virtex-6 family was engineered for high-bandwidth, low-latency signal processing in mission-critical systems where deterministic timing, radiation tolerance, and long-term obsolescence management are essential.
FAQ
What is the maximum supported transceiver line rate for XC6VSX315T-2FFG1759I?
The XC6VSX315T-2FFG1759I supports GTX transceivers with a maximum line rate of 6.6 Gb/s. This enables compliance with PCIe Gen2, SRIO 2.1, and 10GBASE-R Ethernet standards. Each GTX channel includes a built-in physical coding sublayer (PCS) and physical medium attachment (PMA) for protocol-specific encoding and serialization.
Does XC6VSX315T-2FFG1759I support partial reconfiguration?
Yes, XC6VSX315T-2FFG1759I supports partial reconfiguration through dedicated configuration logic and frame-based bitstream loading. This allows dynamic replacement of logic modules without resetting the entire device, which is critical for real-time radar and communications systems where continuous operation is required.
What is the operating temperature range specified for XC6VSX315T-2FFG1759I?
XC6VSX315T-2FFG1759I is rated for operation from -40°C to +100°C, meeting extended industrial temperature requirements. This qualification includes testing across voltage corners and process variations, making it suitable for deployment in avionics, ground radar, and outdoor telecom infrastructure without thermal derating.
How many GTX transceivers does XC6VSX315T-2FFG1759I include?
XC6VSX315T-2FFG1759I integrates 32 GTX transceivers, each capable of independent configuration for protocols including PCIe, SRIO, and 10G Ethernet. These transceivers share common reference clock inputs and support both backplane and chip-to-chip interconnect topologies.
Is bitstream encryption supported on XC6VSX315T-2FFG1759I?
Yes, XC6VSX315T-2FFG1759I supports 256-bit AES encryption for configuration bitstreams using a battery-backed volatile key register or non-volatile eFUSE key storage. This feature protects intellectual property and prevents unauthorized cloning or reverse engineering of deployed designs.
XC6VSX315T-2FFG1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX315T-2FFG1759I FAQ
1.How can I place an order for XC6VSX315T-2FFG1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-2FFG1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-2FFG1759I reliable?
The price and inventory of XC6VSX315T-2FFG1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-2FFG1759I is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-2FFG1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-2FFG1759I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-2FFG1759I?
XC6VSX315T-2FFG1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-2FFG1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-2FFG1759I?
For technical support, including XC6VSX315T-2FFG1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-2FFG1759I requirements.
6.How does Aetrix verify that XC6VSX315T-2FFG1759I is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-2FFG1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-2FFG1759I meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-2FFG1759I?
All XC6VSX315T-2FFG1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-2FFG1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-2FFG1759I part is unused and in its original packaging.
Return procedure for XC6VSX315T-2FFG1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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