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AMD XC6VSX315T-3FFG1156C
- Part No.:
- XC6VSX315T-3FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-3FFG1156C.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,912
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Product details
Overview
XC6VSX315T-3FFG1156C from AMD is a high-performance Virtex-6 FPGA featuring 315,936 logic cells, 14,336 Kbits of block RAM, and 640 DSP48E1 slices, operating at -3 speed grade with 1.2V core voltage for high-throughput signal processing in radar and wired communications infrastructure.
For engineers reviewing the XC6VSX315T-3FFG1156C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600), transceiver line rate (6.6 Gbps), thermal design power (17.5 W), and support for PCIe Gen2 x8 endpoint configuration.
Technical Context
The XC6VSX315T-3FFG1156C implements a fully synchronous, SRAM-based architecture with integrated multi-gigabit transceivers (MGTs) supporting protocols including SATA, SAS, and XAUI. It includes dedicated clock management tiles (CMTs) with DCMs and PLLs for low-jitter clock synthesis and phase alignment across multiple domains.
Configurable logic blocks (CLBs) integrate LUTs, flip-flops, and carry logic optimized for arithmetic and wide-data-path operations. The device supports partial reconfiguration and bitstream encryption via AES-256 for secure field updates in deployed systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,936 - total configurable resources for complex digital logic implementation |
| Block RAM | 14,336 Kbits - on-chip memory for FIFOs, buffers, and data tables without external DRAM |
| DSP Slices | 640 × DSP48E1 - fixed-point multiply-accumulate units enabling real-time filtering and FFT acceleration |
| Transceiver Speed | 6.6 Gbps - supports 10GBASE-R, CPRI, and OBSAI interfaces in wireless baseband units |
| I/O Pins | 600 - LVDS, SSTL, HSTL, and differential signaling compatible for mixed-signal interface bridging |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and thermal dissipation profile |
| TDP | 17.5 W - maximum steady-state power consumption under worst-case switching activity |
Pinout & Package
XC6VSX315T-3FFG1156C is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 array, 1.0 mm pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for CLBs, block RAM, and interconnect routing |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, SelectIO, and clock management |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank to support mixed-voltage interface standards |
| MR | Master reset | Asynchronous global reset input for full device initialization |
| CCLK | Configuration clock | Driven by external source during slave serial or JTAG configuration |
| GTXREFCLK | Transceiver reference clock | Low-jitter differential input for MGT PLL lock and data recovery |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reboot-critical for adaptive radio and protocol-agnostic gateways |
| AES-256 Bitstream Encryption | Prevents IP theft and unauthorized firmware modification in field-deployed telecom equipment |
| Dual-Register I/O Logic | Allows pipelined input capture and output staging to meet tight timing closure in high-speed SerDes links |
| Integrated PCIe Gen2 Endpoint | Reduces BOM count and latency by eliminating external bridge ICs in host-attached accelerator designs |
| Multi-Standard Transceivers | Single MGT lane configurable for SATA, XAUI, or CPRI-simplifies board reuse across product variants |
Applications
| Radar Signal Processing | Wireless Baseband Unit |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; transceivers interface with ADC/DAC FMC modules. Use Value: 640 DSP48E1 slices deliver >2.1 TMAC/s throughput, enabling sub-millisecond latency response to target motion. | Use Scenario: Layer-1 PHY processing in LTE-A and 5G NR macrocell base stations. IC Role / Device Role / Timing Role: Configurable logic implements channel coding (LDPC/Polar), OFDM modulation, and MIMO precoding. Use Value: 6.6 Gbps transceivers support dual 4×4 MIMO RF front-end links over CPRI v6.1 with deterministic jitter <0.3 ps RMS. |
| High-Speed Test Equipment | Optical Transport Network Line Card |
Use Scenario: Protocol-aware pattern generation and error injection in 10G/25G Ethernet compliance testers. IC Role / Device Role / Timing Role: FPGA acts as deterministic traffic engine and real-time BER analyzer with precise timestamping. Use Value: 600 I/O pins enable simultaneous multi-port 10GBASE-KR and SFP+ electrical interface testing without multiplexing. | Use Scenario: OTU2/OTU3 framing, FEC, and overhead processing in DWDM line cards. IC Role / Device Role / Timing Role: Implements G.709-compliant forward error correction and OPUk mapping logic. Use Value: Block RAM capacity supports full OTU3 frame buffering (4,080 bytes × 8K depth) for seamless payload alignment and delay compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | UltraScale architecture, higher logic density (522K LUTs), 16.3 Gbps transceivers, 0.85 V core | Targets next-gen 400G Ethernet and AI inference acceleration where bandwidth exceeds Virtex-6 capability | Select when migrating to higher-speed serial protocols or requiring >100 Gbps aggregate I/O bandwidth |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 485K logic cells, 13.1 Gbps transceivers, -2 speed grade, industrial temp range | Better suited for extended temperature deployments in aerospace avionics and ruggedized test systems | Choose for new designs needing improved power efficiency and extended temperature operation (-40°C to +100°C) |
Compared with XC6VSX315T-3FFG1156C, the XCVU3P-2FFVD1760E offers 2.5× higher transceiver speed but requires PCB redesign due to different package and voltage rails; the XC7VX485T-2FFG1761I provides broader temperature tolerance and lower static power while maintaining pin-compatible I/O banks for legacy board reuse.
Availability
XC6VSX315T-3FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, wireless baseband units, and optical transport network line cards requiring stable component supply across long-lifecycle programs.
Supply support for XC6VSX315T-3FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, communications, and embedded markets.
The Virtex-6 family was designed for high-bandwidth, low-latency programmable logic in wired/wireless infrastructure, defense radar, and scientific instrumentation where deterministic timing and multi-protocol SerDes are essential.
FAQ
What is the maximum supported transceiver line rate for XC6VSX315T-3FFG1156C?
The XC6VSX315T-3FFG1156C supports a maximum transceiver line rate of 6.6 Gbps per lane. This enables compliance with CPRI v6.1, XAUI, and 10GBASE-R protocols. The transceivers are implemented as GTX quad-channel blocks with shared reference clock inputs and independent TX/RX calibration paths.
Does XC6VSX315T-3FFG1156C support PCIe Gen2 x8 endpoint functionality?
Yes, XC6VSX315T-3FFG1156C includes integrated PCIe Gen2 endpoint logic compliant with PCI Express Base Specification v2.0. It supports x1, x2, x4, and x8 link widths with automatic equalization and hot-plug detection. The XC6VSX315T-3FFG1156C does not require external bridge chips for endpoint configurations.
What is the I/O standard compatibility of XC6VSX315T-3FFG1156C?
XC6VSX315T-3FFG1156C supports 21 I/O standards including LVDS, Mini-LVDS, RSDS, BLVDS, SSTL-18/25, HSTL-I/II, and differential signaling modes. Each of its 34 I/O banks can be independently powered from 1.2 V to 3.3 V, enabling mixed-voltage interface coexistence on a single PCB.
Is partial reconfiguration supported on XC6VSX315T-3FFG1156C?
Yes, XC6VSX315T-3FFG1156C supports dynamic partial reconfiguration using Xilinx ISE Design Suite 14.7 or later. Reconfigurable partitions must be constrained within column-aligned CLB columns and exclude clock management tiles. The XC6VSX315T-3FFG1156C requires bitstream authentication before loading partial images.
What thermal management considerations apply to XC6VSX315T-3FFG1156C?
XC6VSX315T-3FFG1156C has a maximum junction temperature of 100°C and requires a thermal solution rated for 17.5 W TDP. The FFG1156 package includes a copper thermal lid; recommended PCB layout uses ≥6 thermal vias per power ball and 2 oz copper planes on inner layers. Thermal simulation should assume 2.5°C/W junction-to-board resistance under forced convection.
XC6VSX315T-3FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VSX315T-3FFG1156C FAQ
1.How can I place an order for XC6VSX315T-3FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-3FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-3FFG1156C reliable?
The price and inventory of XC6VSX315T-3FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-3FFG1156C is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-3FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-3FFG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-3FFG1156C?
XC6VSX315T-3FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-3FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-3FFG1156C?
For technical support, including XC6VSX315T-3FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-3FFG1156C requirements.
6.How does Aetrix verify that XC6VSX315T-3FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-3FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-3FFG1156C meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-3FFG1156C?
All XC6VSX315T-3FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-3FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-3FFG1156C part is unused and in its original packaging.
Return procedure for XC6VSX315T-3FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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