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AMD XC6VSX315T-3FFG1759C
- Part No.:
- XC6VSX315T-3FFG1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-3FFG1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,760
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Product details
Overview
XC6VSX315T-3FFG1759C from AMD is a high-performance Virtex-6 FPGA with 315,900 logic cells, 14,336 Kbits of block RAM, and 1,200 DSP48E1 slices, operating at -3 speed grade (1.2V core, 1.25GHz transceiver). It targets high-bandwidth wired communications infrastructure such as 10G/40G line cards and packet processing engines.
For engineers reviewing the XC6VSX315T-3FFG1759C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (32 GTX), I/O bank voltage support (1.2V–3.3V), and thermal design power (21.5W typical at full utilization).
Technical Context
The XC6VSX315T-3FFG1759C implements a 40nm CMOS architecture with integrated GTX transceivers supporting 600 Mbps–6.6 Gbps line rates, and features SelectIO technology with programmable I/O standards including LVDS, SSTL, HSTL, and TMDS. It includes dual-register flip-flops per LUT and built-in PCIe Gen2 x8 endpoint support.
This device belongs to the Virtex-6 SX family optimized for serial connectivity and signal processing, with dedicated routing for deterministic latency in packet forwarding and real-time baseband processing. Its configuration interface supports Master SelectMAP, Slave SelectMAP, and JTAG modes with AES bitstream encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,900 - provides scalable fabric for complex protocol stacks and multi-channel data path logic |
| Block RAM | 14,336 Kbits - enables large on-chip buffering for packet reordering and frame storage |
| DSP Slices | 1,200 DSP48E1 - supports parallel FIR filtering, FFT computation, and digital modulation up to 400 MHz |
| GTX Transceivers | 32 lanes, 600 Mbps–6.6 Gbps - delivers native 10GBASE-R, OTU2, and CPRI v6.1 physical layer support |
| I/O Pins | 720 user I/Os across 32 banks - allows mixed-voltage interface to PHYs, memory, and control buses |
| Speed Grade | -3 - guarantees timing closure at 1.25 GHz transceiver operation and 500 MHz system clock domains |
| TDP | 21.5 W typical - defines heatsink sizing and airflow requirements for 1U line card deployment |
Pinout & Package
XC6VSX315T-3FFG1759C is housed in a 1759-ball Fine-Pitch Flip-Chip BGA (FFG) package with 1.0 mm ball pitch, 35 mm × 35 mm body size, and RoHS-compliant lead-free finish. Thermal pad on underside requires solder paste stencil aperture and ground plane connection for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply | 2.5V ±5% for configuration, JTAG, and transceiver reference circuitry |
| VCCO_0 | I/O bank supply | Programmable 1.2V–3.3V output driver voltage per bank, enabling mixed-standard interfaces |
| MR | Master reset | Active-low asynchronous reset that clears configuration registers and halts state machines |
| CCLK | Configuration clock | Input clock for Master SelectMAP mode; frequency determines bitstream load rate (up to 100 MHz) |
| GTXRXN/GTXRXP | Differential RX pair | AC-coupled negative/positive inputs for GTX transceiver lanes; require 100Ω differential termination |
| GTXTXN/GTXTXP | Differential TX pair | AC-coupled negative/positive outputs driving serial data; support pre-emphasis and de-emphasis calibration |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP block eliminates external bridge IC and reduces latency by >200 ns vs soft-core implementation |
| AES Bitstream Encryption | On-chip decryption engine protects intellectual property during configuration without external crypto controller |
| SelectIO Technology | Per-bank I/O voltage and standard selection enables concurrent DDR3, QSPI, and LVDS interfaces on single device |
| Dual-Register LUTs | Each 6-input LUT includes two independent registers, improving pipelining efficiency for high-frequency datapaths |
| Transceiver Calibration | Automatic offset and gain calibration ensures consistent eye opening across temperature and voltage corners |
Applications
| 10G Ethernet Line Cards | Wireless Baseband Processing |
|---|---|
Use Scenario: Aggregating and switching 10GbE traffic in carrier-grade edge routers with hardware-accelerated ACL and QoS. IC Role / Device Role / Timing Role: Primary packet processing engine implementing MAC, classifier, scheduler, and statistics collection in single chip. Use Value: 32 GTX lanes enable eight 10GBASE-R ports; 1,200 DSP slices accelerate deep packet inspection at line rate. | Use Scenario: Real-time LTE-Advanced baseband processing in macrocell remote radio heads with MIMO-4x4 support. IC Role / Device Role / Timing Role: Configurable digital front-end handling channel estimation, equalization, and OFDM symbol generation. Use Value: Deterministic routing and dual-register LUTs ensure sub-100ns latency for feedback loops; block RAM supports 128-tap adaptive filters. |
| CPRI-Based Fronthaul | High-Performance Test Equipment |
Use Scenario: Converting between eCPRI and legacy CPRI protocols in 5G fronthaul gateways with jitter tolerance < 100 ps RMS. IC Role / Device Role / Timing Role: Protocol converter and serializer/deserializer with precise clock domain crossing and elastic buffer management. Use Value: GTX transceivers locked to 2.4576 GHz CPRI reference deliver < 0.1 UI jitter; AES encryption secures firmware updates over OAM channel. | Use Scenario: Generating and analyzing multi-gigabit serial waveforms in automated test systems for SerDes compliance validation. IC Role / Device Role / Timing Role: Reconfigurable pattern generator and error detector with real-time BER calculation and eye diagram sampling. Use Value: 6.6 Gbps GTX operation supports PCIe Gen3, USB 3.0, and DisplayPort 1.2 physical layer testing; 720 I/Os enable parallel DUT stimulus/control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed serial connectivity and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 64 GTY transceivers (up to 32.75 Gbps), higher static power | Targets 100G+ coherent optics and AI inference acceleration where bandwidth exceeds Virtex-6 capability | Choose when migrating to 28nm process benefits and requiring >10 Gbps per lane; not pin-compatible |
| XC6VLX240T-3FFG1156C | Same Virtex-6 family, lower density (240K LC), 24 GTX lanes, smaller 1156-ball FFG package | Suitable for cost-sensitive 10G switch fabrics with reduced packet buffer depth and fewer parallel channels | Choose for footprint-constrained designs needing same toolchain and IP reuse but lower I/O and transceiver count |
Compared with XCVU9P-2FLGA2104I, the XC6VSX315T-3FFG1759C offers mature 40nm tooling and lower power for 6.6 Gbps applications, while XC6VLX240T-3FFG1156C shares identical architecture and design flow but scales down resources for mid-tier line cards.
Availability
XC6VSX315T-3FFG1759C is available at Aetrix Electronics and suitable for 10G/40G networking equipment, wireless infrastructure baseband units, and high-speed test instrumentation requiring stable component supply across extended product lifecycles.
Supply support for XC6VSX315T-3FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and high-performance computing.
The Virtex-6 family was developed for high-bandwidth serial connectivity and deterministic signal processing in telecom infrastructure, military radar, and scientific instrumentation.
FAQ
What is the maximum supported transceiver data rate for XC6VSX315T-3FFG1759C?
The XC6VSX315T-3FFG1759C supports GTX transceivers with a maximum data rate of 6.6 Gbps per lane. This is validated across industrial temperature range (0°C to 85°C) and specified in the Virtex-6 DC and Switching Characteristics datasheet (DS152). The XC6VSX315T-3FFG1759C achieves this rate using internal PLLs and adaptive equalization, with eye opening maintained above 0.35 UI under worst-case voltage and temperature conditions.
Does XC6VSX315T-3FFG1759C support PCIe Gen2 x8 endpoint functionality?
Yes, the XC6VSX315T-3FFG1759C includes a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.0. This feature is implemented in silicon and does not require additional licensing. The XC6VSX315T-3FFG1759C uses dedicated routing and clocking resources to meet Gen2 timing requirements, including 2.5 GT/s encoding and ACK/NAK timeout handling.
What configuration modes are supported by XC6VSX315T-3FFG1759C?
The XC6VSX315T-3FFG1759C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial configuration modes. Master SelectMAP uses an internal oscillator and CCLK to load bitstream from external SPI flash; Slave SelectMAP relies on external controller for clock and data. The XC6VSX315T-3FFG1759C also supports fallback and multi-boot via address pins, enabling field-upgradable firmware images.
Is XC6VSX315T-3FFG1759C compatible with Vivado Design Suite?
No, the XC6VSX315T-3FFG1759C is supported exclusively by Xilinx ISE Design Suite v14.7 and earlier versions. Vivado does not support Virtex-6 devices. Users must use ISE for synthesis, place-and-route, and bitstream generation. The XC6VSX315T-3FFG1759C requires ISE 14.7 service pack 4 or later for full GTX transceiver parameterization and PCIe core integration.
What thermal management guidance applies to XC6VSX315T-3FFG1759C?
The XC6VSX315T-3FFG1759C requires a 6-layer PCB with internal ground and power planes, thermal vias under the package center, and a 25 mm² copper thermal pad connected to chassis ground. AMD recommends a 25.4 mm × 25.4 mm heat sink with ≥2.5 W/°C thermal resistance for continuous operation at 85°C ambient. The XC6VSX315T-3FFG1759C thermal profile is defined in Xilinx UG373 and must be verified using thermal simulation tools before board release.
XC6VSX315T-3FFG1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX315T-3FFG1759C FAQ
1.How can I place an order for XC6VSX315T-3FFG1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-3FFG1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-3FFG1759C reliable?
The price and inventory of XC6VSX315T-3FFG1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-3FFG1759C is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-3FFG1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-3FFG1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-3FFG1759C?
XC6VSX315T-3FFG1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-3FFG1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-3FFG1759C?
For technical support, including XC6VSX315T-3FFG1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-3FFG1759C requirements.
6.How does Aetrix verify that XC6VSX315T-3FFG1759C is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-3FFG1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-3FFG1759C meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-3FFG1759C?
All XC6VSX315T-3FFG1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-3FFG1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-3FFG1759C part is unused and in its original packaging.
Return procedure for XC6VSX315T-3FFG1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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