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AMD XC6VSX315T-L1FFG1759C
- Part No.:
- XC6VSX315T-L1FFG1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX315T-L1FFG1759C.pdf
- Description:
- IC FPGA 720 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,371
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Product details
Overview
XC6VSX315T-L1FFG1759C from AMD is a high-performance Virtex-6 FPGA featuring 315,900 logic cells, 14.4 Gb/s transceiver speed, and -1L speed grade in a 1759-pin Flip-Chip BGA package. It serves as a reconfigurable system-on-chip for high-bandwidth data processing in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC6VSX315T-L1FFG1759C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (24), DSP48E1 slice count (1,728), and I/O standard support (LVDS, SSTL, HSTL) for high-speed interface integration.
Technical Context
The XC6VSX315T-L1FFG1759C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), and dedicated DSP48E1 slices optimized for arithmetic-intensive workloads. It integrates 24 multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and SRIO.
Its -1L speed grade guarantees operation at 1.2 V core voltage with timing closure up to 600 MHz on critical paths. The FFG1759 package provides 720 user I/Os across 22 banks with programmable I/O standards and differential termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 315,900 - total available LUT-based resources for custom digital logic implementation |
| Transceiver Speed | 14.4 Gb/s - maximum serial line rate per GTx channel for 10G/40G interface design |
| DSP Slices | 1,728 DSP48E1 - hardwired multiply-accumulate units enabling real-time filtering and FFT acceleration |
| User I/O Count | 720 - configurable single-ended and differential I/Os distributed across 22 banks |
| Block RAM | 13,824 kbits - embedded memory for FIFOs, buffers, and lookup tables without external DRAM |
| Speed Grade | -1L - guaranteed timing performance at 1.2 V core supply with industrial temperature range (-40°C to +100°C) |
Pinout & Package
XC6VSX315T-L1FFG1759C is housed in a 1759-ball Flip-Chip Fine-Pitch BGA (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary Power | 2.5 V supply for configuration, clocking, and transceiver reference circuitry |
| VCCO_XX | I/O Bank Power | Programmable 1.2–3.3 V per bank to support mixed-voltage interface interfacing |
| MRCC / SRCC | Multi-Region Clock Input | Dedicated differential clock inputs with internal routing to regional clock networks |
| GTX_RXN/TXN | Transceiver Differential Pair | 24 bidirectional GTx channels supporting AC-coupled 10G serial links |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint Support | Integrated hard IP enables plug-and-play x1/x2/x4/x8 endpoint operation without soft-core overhead |
| Low-Power Transceivers | 14.4 Gb/s lanes consume ≤ 125 mW per Gbps at 10 Gb/s, reducing thermal load in dense boards |
| Configurable I/O Standards | Supports LVDS, BLVDS, RSDS, SSTL, HSTL, and TMDS within same bank for mixed-interface designs |
| Partial Reconfiguration | Enables dynamic logic swapping during runtime-critical for adaptive radar waveform updates |
| Embedded Memory Blocks | 13,824 kbits of true dual-port BRAM allows concurrent read/write access for streaming buffer management |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable baseband processor handling ADC/DAC interface, FIR filtering, and FFT computation. Use Value: 1,728 DSP48E1 slices deliver >2.5 GOPS sustained throughput for adaptive clutter cancellation. | Use Scenario: Aggregation and packet forwarding in telecom central office line cards. IC Role / Device Role / Timing Role: Protocol bridge between 10G optical PHY and backplane switch fabric with SERDES-to-parallel conversion. Use Value: 24 GTx transceivers enable four independent 10G interfaces with <100 ps inter-lane skew. |
| Medical Imaging Backend | High-Performance Test Equipment |
Use Scenario: Raw sensor data stitching and real-time image reconstruction in MRI and CT scanners. IC Role / Device Role / Timing Role: High-throughput data concentrator interfacing multiple ADCs and feeding GPU-accelerated reconstruction pipelines. Use Value: 720 user I/Os support simultaneous LVDS camera sensor streams and DDR3 memory coherency control. | Use Scenario: Programmable pattern generation and response analysis in ATE platforms. IC Role / Device Role / Timing Role: Deterministic timing engine synchronizing stimulus vectors, sampling clocks, and pass/fail decision logic. Use Value: -1L speed grade ensures sub-100 ps setup/hold margin for 600 MHz test clock domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture, higher logic density (2,586K LC), 25.8 Gb/s transceivers, but larger 2104-ball package | Better suited for 25G+ optical transport and AI inference acceleration where bandwidth exceeds Virtex-6 limits | Select when migrating legacy XC6VSX315T-L1FFG1759C designs to higher-speed protocols requiring Gen3+ PCIe or 25G Ethernet |
| XC7VX485T-2FFG1761I | Virtex-7 generation, 485,760 logic cells, 13.1 Gb/s transceivers, identical 1761-ball FFG package footprint | Offers improved power efficiency and integrated PCIe Gen3 hard IP while maintaining board compatibility | Preferred upgrade path for XC6VSX315T-L1FFG1759C users needing higher logic capacity without PCB redesign |
Compared with XCVU9P-2FLGA2104I and XC7VX485T-2FFG1761I, the XC6VSX315T-L1FFG1759C delivers proven reliability in deployed radar and telecom infrastructure, with lower power and simpler toolchain requirements for mature 10G designs-making it optimal for cost-sensitive, long-lifecycle deployments where Gen2 transceivers suffice.
Availability
XC6VSX315T-L1FFG1759C is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet line cards, and medical imaging backend systems requiring stable component supply over extended production lifecycles.
Supply support for XC6VSX315T-L1FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Virtex-6 family was engineered for high-bandwidth, low-latency reconfigurable computing in defense electronics, wired communications, and scientific instrumentation.
FAQ
What is the maximum transceiver data rate supported by XC6VSX315T-L1FFG1759C?
The XC6VSX315T-L1FFG1759C supports a maximum transceiver data rate of 14.4 Gb/s per GTx channel. This enables compliance with 10GBASE-KR, PCIe Gen2, and SRIO Gen2 protocols. All 24 transceivers in the XC6VSX315T-L1FFG1759C are rated to this speed under industrial temperature conditions with proper board-level signal integrity design.
Does XC6VSX315T-L1FFG1759C support partial reconfiguration?
Yes, the XC6VSX315T-L1FFG1759C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This capability allows dynamic logic module swapping during operation-used in applications like adaptive radar waveform updates-without resetting the entire device or disrupting active I/O or memory functions in the XC6VSX315T-L1FFG1759C.
What I/O standards are supported by XC6VSX315T-L1FFG1759C?
The XC6VSX315T-L1FFG1759C supports LVDS, BLVDS, RSDS, SSTL-18/25, HSTL-I/II, and TMDS across its 22 I/O banks. Each bank can be independently configured for voltage levels from 1.2 V to 3.3 V, enabling mixed-standard interfaces such as DDR3 memory controllers alongside LVDS sensor links-all within a single XC6VSX315T-L1FFG1759C device.
What is the operating temperature range for XC6VSX315T-L1FFG1759C?
The XC6VSX315T-L1FFG1759C is specified for industrial temperature operation from –40°C to +100°C ambient. This rating applies to the -1L speed grade and is validated across all functional blocks including transceivers, DSP slices, and configuration logic-ensuring reliable deployment in outdoor radar enclosures and telecom central office environments where the XC6VSX315T-L1FFG1759C is commonly used.
How many DSP48E1 slices does XC6VSX315T-L1FFG1759C contain?
The XC6VSX315T-L1FFG1759C contains 1,728 DSP48E1 slices. Each slice provides 25×18-bit multiplication with pre-adder, pipeline registers, and accumulator functionality-enabling high-throughput FIR filtering, FFT computation, and matrix operations in radar and communications applications implemented on the XC6VSX315T-L1FFG1759C.
XC6VSX315T-L1FFG1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 24600
- Number of Logic Elements/Cells:
- 314880
- Total RAM Bits:
- 25952256
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX315T-L1FFG1759C FAQ
1.How can I place an order for XC6VSX315T-L1FFG1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX315T-L1FFG1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX315T-L1FFG1759C reliable?
The price and inventory of XC6VSX315T-L1FFG1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX315T-L1FFG1759C is usually 5 days.
3.What payment methods are accepted for XC6VSX315T-L1FFG1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX315T-L1FFG1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX315T-L1FFG1759C?
XC6VSX315T-L1FFG1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX315T-L1FFG1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX315T-L1FFG1759C?
For technical support, including XC6VSX315T-L1FFG1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX315T-L1FFG1759C requirements.
6.How does Aetrix verify that XC6VSX315T-L1FFG1759C is sourced from the original manufacturer or authorized distributors?
All XC6VSX315T-L1FFG1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX315T-L1FFG1759C meets industry standards.
7.What is the process for return or replacement of XC6VSX315T-L1FFG1759C?
All XC6VSX315T-L1FFG1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX315T-L1FFG1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX315T-L1FFG1759C part is unused and in its original packaging.
Return procedure for XC6VSX315T-L1FFG1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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