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AMD XC6VSX475T-1FF1156I
- Part No.:
- XC6VSX475T-1FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VSX475T-1FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,969
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Product details
Overview
XC6VSX475T-1FF1156I from AMD is a high-performance Virtex-6 FPGA with 475,800 logic cells, 28.8 Gb/s transceiver bandwidth, and -1 speed grade operating at junction temperatures up to 100°C. It integrates 36 DSP48E1 slices, 2,520 Block RAMs (each 36 Kb), and supports PCIe Gen2 x8 endpoint functionality in industrial control systems.
For engineers reviewing the XC6VSX475T-1FF1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (ANSI TIA/EIA-644-A), I/O voltage support (1.2 V to 3.3 V), configuration interface (Master SelectMAP), and thermal design margin for convection-cooled enclosures.
Technical Context
The XC6VSX475T-1FF1156I implements a column-based architecture with dedicated clock routing, hierarchical clock enables, and configurable I/O banks supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. Its transceivers operate at 600 Mb/s to 6.6 Gb/s with built-in 8B/10B encoding and elastic buffers.
Configuration is performed via Master SelectMAP mode using parallel NOR flash or serial SPI flash, with dual-boot capability and CRC-based bitstream integrity checking. The device supports partial reconfiguration through ICAP and JTAG boundary-scan testing per IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 475,800 - total available LUTs + flip-flops for combinational and sequential logic implementation |
| Block RAM | 2,520 × 36 Kb - supports true dual-port operation and byte-write enable for buffer and FIFO designs |
| DSP Slices | 36 × DSP48E1 - each performs 25 × 18 signed multiplication with 48-bit accumulator and pipeline register |
| Transceiver Speed | 600 Mb/s to 6.6 Gb/s - supports PCIe Gen2, SATA, and Serial RapidIO protocols without external retiming |
| I/O Standards | SSTL-18/15, HSTL-I/II, LVCMOS, LVDS, TMDS - enables direct interfacing with DDR3 memory and video PHYs |
| Speed Grade | -1 - guarantees timing closure at maximum specified frequencies under worst-case industrial temperature and voltage conditions |
| Junction Temp | –40°C to +100°C - validated for continuous operation in sealed industrial enclosures without forced airflow |
Pinout & Package
XC6VSX475T-1FF1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1156) package with 32 × 32 ball array, 1.0 mm pitch, and thermal lid. Package dimensions are 35 mm × 35 mm with 2.1 mm height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V ±5% supply for configuration logic, clock management, and transceiver reference circuits |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3 V supply per I/O bank; sets voltage threshold for all pins in Bank 0 |
| MR | Master reset input | Active-low asynchronous reset that clears configuration logic and forces reinitialization on next CCLK edge |
| CCLK | Configuration clock | Input clock for Master SelectMAP configuration; frequency ≤ 50 MHz; drives internal configuration state machine |
| DONE | Configuration status output | Open-drain output asserted high when configuration completes successfully and I/Os are released from high-Z |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping in runtime-critical systems without full FPGA reset or system interruption |
| Dedicated Clock Routing | Low-skew global and regional clock networks reduce timing uncertainty for multi-domain synchronous designs |
| PCIe Gen2 Endpoint Logic | Hard IP block compliant with PCI Express Base Specification v2.0; supports x1, x2, x4, and x8 link widths |
| Transceiver Elastic Buffers | Compensates for PVT-induced skew between parallel data lanes, enabling reliable 6.6 Gb/s serial links |
| ICAP Interface | Allows in-system readback and modification of configuration frames for field-upgradable logic functions |
Applications
| Radar Signal Processing | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar subsystems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and interpolation algorithms; transceivers interface with ADC/DAC FMC modules. Use Value: 475K logic cells and 36 DSP slices enable concurrent multi-channel processing at 100+ MSPS sample rates. | Use Scenario: High-speed inspection of PCB assemblies using line-scan cameras and real-time defect classification. IC Role / Device Role / Timing Role: Configurable I/O banks drive Camera Link or CoaXPress physical layers; Block RAMs buffer frame data before GPU offload. Use Value: 2,520 × 36 Kb Block RAMs provide >90 Mb on-chip buffering for 12-bit 100 kHz line-scan streams. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Digital backend for ultrasound beamformers requiring channel count scaling and real-time image reconstruction. IC Role / Device Role / Timing Role: Transceivers receive digitized RF echo data from 128-channel ADC arrays; logic fabric applies dynamic focusing and harmonic filtering. Use Value: 6.6 Gb/s transceiver lanes sustain aggregate throughput >50 Gb/s across 8 lanes for raw RF data ingestion. | Use Scenario: Modular PXI Express instruments performing jitter analysis and protocol validation on high-speed serial links. IC Role / Device Role / Timing Role: PCIe Gen2 x8 endpoint connects to host controller; logic fabric implements PRBS pattern generation and error counting logic. Use Value: -1 speed grade ensures deterministic timing closure for sub-100 ps setup/hold margins in 6.6 Gb/s eye-diagram measurement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; 2.5× higher logic density (1,182K LC); supports PCIe Gen3 x16; no native SATA PHY | Targeted at AI-accelerated test equipment and 5G baseband prototyping where Gen3 bandwidth and larger memory footprint are required | Select XCVU9P-2FLGA2104I only if PCIe Gen3, higher DSP count (684), or integrated 100G Ethernet MAC are mandatory |
| XC7VX690T-2FFG1927I | Virtex-7 architecture; 690K logic cells; 13.1 Gb/s transceivers; -2 speed grade; larger 1927-pin FFG package | Used in legacy radar EW systems where backward compatibility with VHDL-based IP cores and existing PCB layouts is critical | Choose XC7VX690T-2FFG1927I when migrating from Virtex-5/Virtex-6 platforms with minimal RTL changes and existing thermal/mechanical constraints |
Compared with XC6VSX475T-1FF1156I, the XCVU9P-2FLGA2104I delivers higher bandwidth but requires new PCB layout and power delivery redesign, while the XC7VX690T-2FFG1927I offers incremental performance uplift with proven board-level compatibility for phased upgrades.
Availability
XC6VSX475T-1FF1156I is available at Aetrix Electronics and suitable for radar signal processing, industrial machine vision, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC6VSX475T-1FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, graphics, and AI acceleration technologies.
The Virtex-6 family was designed for high-throughput, low-latency digital signal processing in aerospace, defense, and medical imaging systems where deterministic timing and radiation-tolerant configuration are essential.
FAQ
What is the maximum supported transceiver data rate for XC6VSX475T-1FF1156I?
The XC6VSX475T-1FF1156I supports transceiver data rates from 600 Mb/s up to 6.6 Gb/s per lane. This range enables compliance with PCIe Gen2, SATA II, and Serial RapidIO Gen2 protocols. All transceiver lanes in the XC6VSX475T-1FF1156I are fully operational within this range under industrial temperature conditions (-40°C to +100°C) and require no external retiming circuitry when used with standard FR4 PCB materials.
Does XC6VSX475T-1FF1156I support partial reconfiguration?
Yes, the XC6VSX475T-1FF1156I supports partial reconfiguration through its Internal Configuration Access Port (ICAP). This allows selective reloading of logic modules during operation without resetting the entire device. The XC6VSX475T-1FF1156I implements ICAP as a dedicated hardware interface accessible via user logic, enabling field-upgradable functions in radar and test equipment applications.
What I/O standards are supported by XC6VSX475T-1FF1156I?
The XC6VSX475T-1FF1156I supports SSTL-18, SSTL-15, HSTL-I, HSTL-II, LVCMOS, LVDS, and TMDS I/O standards across its configurable I/O banks. Each bank operates independently with programmable VCCO from 1.2 V to 3.3 V. These standards allow direct interfacing with DDR3 memory controllers, camera sensors, and display interfaces without level-shifting components.
What is the purpose of the DONE pin on XC6VSX475T-1FF1156I?
On the XC6VSX475T-1FF1156I, the DONE pin is an open-drain output that signals successful completion of configuration. It transitions high after the bitstream loads completely, CRC checks pass, and I/O pins exit high-impedance state. External pull-up is required. The XC6VSX475T-1FF1156I holds DONE low during configuration errors or CRC failure, enabling system-level fault detection and recovery sequencing.
How many Block RAMs does XC6VSX475T-1FF1156I contain?
The XC6VSX475T-1FF1156I contains 2,520 Block RAMs, each with 36 Kb capacity. These are organized as true dual-port memory blocks with independent read/write addresses, byte-write enable, and optional parity generation. In practice, this provides over 90 Mb of on-chip memory for frame buffering, coefficient storage, and FIFO implementation in signal processing pipelines.
XC6VSX475T-1FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37200
- Number of Logic Elements/Cells:
- 476160
- Total RAM Bits:
- 39223296
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VSX475T-1FF1156I FAQ
1.How can I place an order for XC6VSX475T-1FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX475T-1FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX475T-1FF1156I reliable?
The price and inventory of XC6VSX475T-1FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX475T-1FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VSX475T-1FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX475T-1FF1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX475T-1FF1156I?
XC6VSX475T-1FF1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX475T-1FF1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX475T-1FF1156I?
For technical support, including XC6VSX475T-1FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX475T-1FF1156I requirements.
6.How does Aetrix verify that XC6VSX475T-1FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VSX475T-1FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX475T-1FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VSX475T-1FF1156I?
All XC6VSX475T-1FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX475T-1FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX475T-1FF1156I part is unused and in its original packaging.
Return procedure for XC6VSX475T-1FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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