AMD XC6VSX475T-1FF1759I

Overview

XC6VSX475T-1FF1759I from AMD is a high-performance Virtex-6 FPGA featuring 475,840 logic cells, 28.8 Gb/s transceiver bandwidth, and -1 speed grade in a 1759-pin Flip-Chip Fine-Pitch BGA package. It integrates 36 DSP48E1 slices, 24 MB of block RAM, and supports PCIe Gen2 x8 endpoint/root complex operation in wired infrastructure line cards.

For engineers reviewing the XC6VSX475T-1FF1759I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2 V to 3.3 V), thermal design power (24.5 W typical), and configuration interface compatibility with SPI/BPI masters.

Technical Context

The XC6VSX475T-1FF1759I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated 10.3125 Gb/s multi-gigabit transceivers. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gb/s per pin.

Configuration is performed via Master SPI or Slave SelectMAP modes using external flash or processor control. The device includes internal clock management units (CMTs) with dual DCMs and PLLs for jitter reduction and frequency synthesis across multiple clock domains.

Key Specifications

Pinout & Package

XC6VSX475T-1FF1759I is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FF1759) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density routing environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC6VSX475T-1FF1759I, XCVU9P-2FLGA2104I provides greater scalability for future-proofing while XC7VX690T-2FFG1927I delivers higher serial bandwidth and PCIe Gen3 readiness-both require PCB redesign due to different packages and I/O voltage schemes.

Availability

XC6VSX475T-1FF1759I is available at Aetrix Electronics and suitable for wireless infrastructure, defense electronics, and optical transport equipment requiring stable component supply across extended product lifecycles.

Supply support for XC6VSX475T-1FF1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through FPGA, adaptive SoC, and software-defined platforms.

The Virtex-6 family was engineered for high-bandwidth, low-latency signal processing in wired/wireless infrastructure and defense systems where deterministic timing and transceiver integration are critical.

FAQ

What is the maximum supported transceiver data rate for XC6VSX475T-1FF1759I?

The XC6VSX475T-1FF1759I supports transceiver data rates up to 10.3125 Gb/s per lane. This enables compliance with 10GBASE-R Ethernet, CPRI Option 3, and OTU2/OTU3 protocols. The transceivers include built-in clock data recovery (CDR), 8B/10B encoding, and elastic buffers to manage source-synchronous timing skew. Actual achievable rate depends on PCB layout quality and reference clock stability.

Does XC6VSX475T-1FF1759I include hard IP for PCIe Gen2?

Yes, XC6VSX475T-1FF1759I integrates a hardened PCIe Gen2 endpoint block supporting x1, x2, x4, and x8 link widths. It handles physical layer signaling, data link layer ACK/NAK, and transaction layer TLP parsing without consuming logic resources. The block supports MSI and MSI-X interrupts and operates at 5.0 GT/s with automatic equalization training. Configuration space is accessible via AXI interface.

What configuration modes does XC6VSX475T-1FF1759I support?

XC6VSX475T-1FF1759I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI uses internal oscillator to drive external flash; Slave SelectMAP allows processor-controlled parallel loading via 32-bit bus; JTAG enables boundary scan and partial reconfiguration debugging. All modes support fallback mechanisms and CRC verification. Configuration bitstream is encrypted using AES-256 when enabled.

What is the I/O voltage range supported by XC6VSX475T-1FF1759I?

XC6VSX475T-1FF1759I supports I/O voltages from 1.2 V to 3.3 V across its banks, with bank-specific VCCO supplies. Each I/O bank can be independently configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards including LVDS and TMDS. On-die termination (ODT) is programmable from 25 Ω to 150 Ω per pin, enabling impedance matching without external resistors.

How many block RAM resources does XC6VSX475T-1FF1759I provide?

XC6VSX475T-1FF1759I contains 2,112 block RAM primitives, each 36 Kb in size, totaling 24 MB of distributed on-chip memory. These are organized as true dual-port RAM with independent read/write clocks and optional parity bits. They support byte-write enable and asynchronous reset, making them suitable for frame buffers, packet queues, and coefficient storage in DSP pipelines.