My Inquiry
My Account
AMD XC6VSX475T-1FFG1156I
- Part No.:
- XC6VSX475T-1FFG1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VSX475T-1FFG1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,037
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6VSX475T-1FFG1156I from AMD is a high-performance Virtex-6 FPGA featuring 475,872 logic cells, 28,800 DSP48E1 slices, and 24.5 Mb of block RAM, deployed in high-speed wired communications infrastructure and radar signal processing systems.
For engineers reviewing the XC6VSX475T-1FFG1156I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (600), transceiver line rate (6.6 Gb/s), thermal design power (29.2 W), and -1 speed grade timing performance.
Technical Context
The XC6VSX475T-1FFG1156I implements a 40 nm CMOS architecture with integrated GTX transceivers supporting PCIe Gen2, SRIO 2.1, and CPRI protocols. It includes dual-register LUTs, carry chains for arithmetic, and dedicated clock routing networks.
Configuration occurs via Master SelectMAP or JTAG, with support for bitstream encryption using AES-256 and HMAC-SHA-256. The device supports partial reconfiguration and dynamic power management through multiple VCCINT/VCCAUX voltage domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 475,872 - total configurable logic resources for complex digital functions |
| DSP Slices | 28,800 - fixed-point multiply-accumulate units optimized for filtering and FFT |
| Block RAM | 24.5 Mb - distributed memory capacity for buffering and data storage |
| Transceiver Speed | 6.6 Gb/s - maximum serial line rate per GTX channel for high-bandwidth links |
| I/O Pins | 600 - user-configurable single-ended or differential I/O with programmable drive strength |
| Speed Grade | -1 - guaranteed timing performance at industrial temperature range (-40°C to +100°C) |
| TDP | 29.2 W - typical active power consumption under defined benchmark conditions |
Pinout & Package
XC6VSX475T-1FFG1156I is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.0 V supply for FPGA logic fabric; requires low-noise regulation |
| VCCAUX | Auxiliary Power Supply | 1.8 V supply for configuration, clocking, and transceivers |
| M0–M2 | Mode Configuration Pins | Determine boot source (BPI, SPI, SelectMAP, JTAG) at power-up |
| INIT_B | Configuration Status | Open-drain output indicating configuration status and error detection |
| CCLK | Configuration Clock | Input clock for Master SelectMAP configuration mode |
| GTXREFCLK | Transceiver Reference Clock | Differential input for GTX PLL reference; supports 100–625 MHz |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint Support | Fully compliant endpoint implementation with integrated hard IP and AXI interface |
| Partial Reconfiguration | Enables dynamic module swapping without full system reset or downtime |
| AES-256 Bitstream Encryption | Hardware-accelerated encryption protecting intellectual property during configuration |
| Dual-Register LUTs | Increases logic density and enables efficient pipelining of combinatorial paths |
| Multi-Voltage I/O Banks | Supports concurrent 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling standards |
Applications
| Wireless Baseband Processing | Radar Signal Processing |
|---|---|
Use Scenario: Real-time baseband modulation/demodulation and MIMO precoding in LTE-A and 5G NR macrocell radios. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling symbol-level DSP, channel estimation, and layer mapping. Use Value: 28,800 DSP48E1 slices enable parallel execution of 128-point FFTs at 200 MHz, meeting 5G sub-6 GHz latency targets. | Use Scenario: Pulse-Doppler processing and beamforming in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: High-throughput signal conditioning engine performing CFAR detection, STAP, and synthetic aperture generation. Use Value: 475,872 logic cells support concurrent multi-channel pulse compression and real-time SAR image formation pipelines. |
| High-Speed Test Equipment | Avionics Data Concentrators |
Use Scenario: Protocol-aware pattern generation and analysis in 10G Ethernet and CPRI compliance testers. IC Role / Device Role / Timing Role: Deterministic protocol accelerator interfacing directly with 6.6 Gb/s GTX transceivers and external memory buffers. Use Value: GTX transceivers deliver stable 6.6 Gb/s line rates over backplane traces, enabling deterministic jitter < 0.3 UI RMS. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in flight control computers. IC Role / Device Role / Timing Role: Time-triggered network interface controller with hardware timestamping and traffic shaping. Use Value: Multi-voltage I/O banks allow direct connection to legacy 2.5 V AFDX PHYs and modern 1.8 V switch fabrics without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2.5× higher logic density, 16.3 Gb/s GTY transceivers, 20 nm process | Targets next-gen 5G mmWave and AI inference acceleration where bandwidth exceeds Virtex-6 capability | Select when migrating to higher throughput or requiring PCIe Gen4/Gen5 support |
| XC7VX690T-2FFG1927I | Virtex-7 architecture, 690K logic cells, 13.1 Gb/s GTH transceivers, 28 nm process | Offers improved DSP efficiency and lower static power for sustained radar waveform processing | Prefer for new designs needing higher reliability margin and extended lifecycle support beyond Virtex-6 EOL status |
Compared with XC6VSX475T-1FFG1156I, the XCVU9P delivers 2.5× logic capacity and double transceiver speed but requires PCB redesign; the XC7VX690T provides 45% more logic and better thermal headroom while maintaining similar board layout constraints and toolchain compatibility.
Availability
XC6VSX475T-1FFG1156I is available at Aetrix Electronics and suitable for wireless infrastructure, defense radar, and high-speed test equipment requiring stable component supply across long production cycles.
Supply support for XC6VSX475T-1FFG1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA, CPU, and GPU development.
The Virtex-6 family was engineered for high-bandwidth, low-latency signal processing in wired communications, aerospace, and defense systems demanding deterministic timing and field-upgradable logic.
FAQ
What is the operating temperature range for XC6VSX475T-1FFG1156I?
The XC6VSX475T-1FFG1156I is rated for industrial temperature operation from –40°C to +100°C ambient, validated per JEDEC JESD22-A104 standard. Its -1 speed grade guarantees timing closure across this full range, making XC6VSX475T-1FFG1156I suitable for harsh-environment deployments such as airborne radar and outdoor base stations.
Does XC6VSX475T-1FFG1156I support partial reconfiguration?
Yes, XC6VSX475T-1FFG1156I supports runtime partial reconfiguration via ICAP and PCIe interfaces, allowing functional modules to be swapped without resetting the entire device. This capability is implemented in hardware and documented in UG394, enabling XC6VSX475T-1FFG1156I to serve in mission-critical systems requiring continuous operation during firmware updates.
What configuration modes does XC6VSX475T-1FFG1156I support?
XC6VSX475T-1FFG1156I supports Master SelectMAP, Slave SelectMAP, Serial (SPI), BPI, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset, and all modes are fully supported in Xilinx ISE 14.7 and Vivado 2018.3 toolchains for XC6VSX475T-1FFG1156I integration.
Is XC6VSX475T-1FFG1156I compatible with PCIe Gen2 x8 endpoints?
Yes, XC6VSX475T-1FFG1156I integrates hardened PCIe Gen2 endpoint blocks supporting x1, x2, x4, and x8 lane widths with full link training, power management, and error reporting. The PCIe core complies with PCI Express Base Specification v2.1 and has been verified in production systems using XC6VSX475T-1FFG1156I as host-facing accelerators.
What is the maximum supported transceiver reference clock frequency for XC6VSX475T-1FFG1156I?
The GTX transceivers in XC6VSX475T-1FFG1156I accept differential reference clocks from 100 MHz to 625 MHz, with phase alignment achieved via internal PLLs. This range supports common standards including CPRI (307.2 MHz), SRIO 2.1 (125 MHz), and PCIe Gen2 (100 MHz), ensuring XC6VSX475T-1FFG1156I interoperability across multi-protocol backplanes.
XC6VSX475T-1FFG1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37200
- Number of Logic Elements/Cells:
- 476160
- Total RAM Bits:
- 39223296
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VSX475T-1FFG1156I FAQ
1.How can I place an order for XC6VSX475T-1FFG1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX475T-1FFG1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX475T-1FFG1156I reliable?
The price and inventory of XC6VSX475T-1FFG1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX475T-1FFG1156I is usually 5 days.
3.What payment methods are accepted for XC6VSX475T-1FFG1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX475T-1FFG1156I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX475T-1FFG1156I?
XC6VSX475T-1FFG1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX475T-1FFG1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX475T-1FFG1156I?
For technical support, including XC6VSX475T-1FFG1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX475T-1FFG1156I requirements.
6.How does Aetrix verify that XC6VSX475T-1FFG1156I is sourced from the original manufacturer or authorized distributors?
All XC6VSX475T-1FFG1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX475T-1FFG1156I meets industry standards.
7.What is the process for return or replacement of XC6VSX475T-1FFG1156I?
All XC6VSX475T-1FFG1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX475T-1FFG1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX475T-1FFG1156I part is unused and in its original packaging.
Return procedure for XC6VSX475T-1FFG1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6VSX475T-1FFG1156I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
