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AMD XC6VSX475T-1FFG1759I
- Part No.:
- XC6VSX475T-1FFG1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX475T-1FFG1759I.pdf
- Description:
- IC FPGA 840 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,664
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Product details
Overview
XC6VSX475T-1FFG1759I from AMD is a high-performance Virtex-6 FPGA with 475,800 logic cells, 28.8 Gb/s transceiver bandwidth, and -1 speed grade operating at industrial temperature range (-40°C to +100°C). It integrates 36-Kb Block RAM, DSP48E1 slices, and PCIe Gen2 x8 endpoint capability for high-speed serial interface applications.
For engineers reviewing the XC6VSX475T-1FFG1759I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage support (1.2V/1.5V/1.8V/2.5V/3.3V), total RAM capacity, and PCIe endpoint compliance in harsh-environment embedded systems.
Technical Context
The XC6VSX475T-1FFG1759I implements a multi-die architecture with 24 GTX transceivers supporting 600 Mb/s–6.6 Gb/s line rates and protocol-specific primitives for PCIe Gen2, SATA, and CPRI. Its configuration logic supports JTAG, SelectMAP, and SPI master mode with AES bitstream encryption.
It features 1,128 user I/Os distributed across 32 banks, each configurable for LVCMOS, SSTL, HSTL, or differential standards including LVDS and TMDS. The device uses 40 nm HKMG process technology and supports partial reconfiguration via ICAP.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 475,800 - determines maximum combinational and sequential logic density for complex algorithm acceleration |
| Transceivers | 24 GTX - enables 24 independent serial links up to 6.6 Gb/s for multi-channel data acquisition |
| Block RAM | 32,400 Kb - provides on-chip memory for buffering, FIFOs, or coefficient storage in signal processing pipelines |
| I/O Pins | 1,128 - supports high-pin-count interconnect to ADCs, DACs, FMC carriers, and backplane interfaces |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns clock period for critical path logic in industrial control loops |
| Operating Temp | -40°C to +100°C - qualified for deployment in uncooled outdoor base stations and railway onboard systems |
| PCIe Support | Gen2 x8 Endpoint - allows direct attachment to host CPU without bridge chips in real-time vision systems |
Pinout & Package
XC6VSX475T-1FFG1759I is housed in a 1759-ball Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch, designed for high thermal dissipation and signal integrity in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration shift register during master SPI or SelectMAP mode startup |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Control | Active-low input signaling configuration memory readiness and error reset capability |
| M0–M2 | Mode Selection | Three-pin bus selecting one of eight configuration modes (JTAG, Slave Serial, etc.) |
| GTXREFCLK0 | Transceiver Reference | Dedicated differential input for synchronizing GTX transceiver PLLs to external low-jitter clock source |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration | Enables dynamic logic module swapping via ICAP without system reset, critical for adaptive radar waveform updates |
| AES Bitstream Encryption | Protects intellectual property by decrypting configuration data on-the-fly using 256-bit keys stored in eFUSE |
| Multi-Voltage I/O Banks | Allows concurrent interfacing to 1.2V ASICs, 1.8V memory, and 3.3V legacy peripherals without level shifters |
| PCIe Gen2 Endpoint | Reduces latency and BOM cost by eliminating external PCIe switch or bridge in edge AI inference accelerators |
| High-Speed Transceivers | Supports deterministic jitter < 1.0 ps RMS for coherent optical module timing alignment in 100G line cards |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTX transceivers interface to ADC/DAC arrays. Use Value: 475K logic cells enable parallel channel processing; -1 speed grade ensures sub-microsecond latency for closed-loop tracking. | Use Scenario: High-throughput image reconstruction in MRI and CT scanners using iterative algorithms. IC Role / Device Role / Timing Role: Configurable logic implements custom back-projection kernels; Block RAM buffers projection data streams. Use Value: 32.4 Mb on-chip RAM eliminates external DDR bottlenecks; PCIe Gen2 x8 enables direct GPU co-processing. |
| Industrial Ethernet Gateways | Avionics Data Concentrators |
Use Scenario: Protocol translation between PROFINET, EtherCAT, and Time-Sensitive Networking (TSN) in factory automation. IC Role / Device Role / Timing Role: Dual-port BRAM and hard Ethernet MACs manage deterministic packet scheduling and timestamping. Use Value: 1,128 I/Os support simultaneous multi-protocol PHY interfaces; industrial temp rating ensures reliability in control cabinets. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B data aggregation in flight control computers. IC Role / Device Role / Timing Role: FPGA implements redundant AFDX end-system controllers with built-in health monitoring and CRC validation. Use Value: AES encryption secures configuration against tampering; GTX transceivers meet DO-160 lightning-induced transient immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2,586K logic cells, higher transceiver count (64 GTY), but larger package and higher power | Better suited for 400G Ethernet and AI training workloads requiring >2x logic density | Select when migrating beyond Virtex-6 scalability limits or requiring PCI Express Gen3 support |
| XC7VX690T-2FFG1927I | Virtex-7 generation, 693,120 logic cells, same -2 speed grade, 36 GTX transceivers, 2104-ball FFG package | Offers improved DSP slice count and lower static power, but requires PCB redesign due to different ball map | Choose for new designs needing higher DSP throughput and verified radiation tolerance in space-grade variants |
Compared with XC6VSX475T-1FFG1759I, the XCVU9P-2FLGA2104I delivers 5.4× more logic and Gen3 PCIe but demands new thermal and power delivery design; the XC7VX690T-2FFG1927I extends Virtex-6 capabilities with 46% more logic and enhanced DSP efficiency while retaining similar I/O voltage flexibility.
Availability
XC6VSX475T-1FFG1759I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and industrial Ethernet gateway applications requiring stable component supply across extended product lifecycles.
Supply support for XC6VSX475T-1FFG1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Virtex-6 family was engineered for high-bandwidth, low-latency programmable logic in mission-critical infrastructure where deterministic timing and multi-protocol serial connectivity are essential.
FAQ
What is the maximum supported transceiver data rate for XC6VSX475T-1FFG1759I?
The XC6VSX475T-1FFG1759I supports GTX transceivers with a maximum data rate of 6.6 Gb/s per lane, validated for protocols including PCIe Gen2, SATA II, and CPRI. This rate is guaranteed under industrial temperature conditions and with proper reference clock jitter specifications met in the design.
Does XC6VSX475T-1FFG1759I support partial reconfiguration?
Yes, XC6VSX475T-1FFG1759I supports partial reconfiguration through the Internal Configuration Access Port (ICAP), enabling dynamic logic module updates without full device reset. This capability is used in adaptive systems such as software-defined radio and real-time radar waveform switching.
What configuration modes are available for XC6VSX475T-1FFG1759I?
XC6VSX475T-1FFG1759I supports multiple configuration modes including JTAG, Master SPI, Slave Serial, and SelectMAP, selected via M0–M2 pins. Each mode offers distinct trade-offs in boot time, security, and host controller integration flexibility.
Is XC6VSX475T-1FFG1759I qualified for industrial temperature operation?
Yes, XC6VSX475T-1FFG1759I is rated for industrial temperature range (-40°C to +100°C), with full functionality and timing compliance verified across this range. Thermal derating guidelines and package-specific thermal resistance values are provided in the official Virtex-6 DC and Switching Characteristics datasheet.
What I/O standards does XC6VSX475T-1FFG1759I support?
XC6VSX475T-1FFG1759I supports LVCMOS, SSTL, HSTL, LVDS, TMDS, and differential signaling standards across its 32 I/O banks. Each bank is independently configurable for 1.2V, 1.5V, 1.8V, 2.5V, or 3.3V VCCO, enabling mixed-voltage system interfacing without external level shifters.
XC6VSX475T-1FFG1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37200
- Number of Logic Elements/Cells:
- 476160
- Total RAM Bits:
- 39223296
- Number of I/O:
- 840
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX475T-1FFG1759I FAQ
1.How can I place an order for XC6VSX475T-1FFG1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX475T-1FFG1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX475T-1FFG1759I reliable?
The price and inventory of XC6VSX475T-1FFG1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX475T-1FFG1759I is usually 5 days.
3.What payment methods are accepted for XC6VSX475T-1FFG1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX475T-1FFG1759I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX475T-1FFG1759I?
XC6VSX475T-1FFG1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX475T-1FFG1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX475T-1FFG1759I?
For technical support, including XC6VSX475T-1FFG1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX475T-1FFG1759I requirements.
6.How does Aetrix verify that XC6VSX475T-1FFG1759I is sourced from the original manufacturer or authorized distributors?
All XC6VSX475T-1FFG1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX475T-1FFG1759I meets industry standards.
7.What is the process for return or replacement of XC6VSX475T-1FFG1759I?
All XC6VSX475T-1FFG1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX475T-1FFG1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX475T-1FFG1759I part is unused and in its original packaging.
Return procedure for XC6VSX475T-1FFG1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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