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AMD XC6VSX475T-2FF1759C
- Part No.:
- XC6VSX475T-2FF1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX475T-2FF1759C.pdf
- Description:
- IC FPGA 840 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,699
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Product details
Overview
XC6VSX475T-2FF1759C from AMD is a high-performance Virtex-6 FPGA with 475,800 logic cells, 28.8 Gb/s transceiver bandwidth, and 36.9 Mb of block RAM, deployed in high-speed serial communication systems such as 10G Ethernet line cards and radar signal processors.
For engineers reviewing the XC6VSX475T-2FF1759C datasheet, pinout, applications, or equivalent options, key selection factors include speed grade (-2), I/O count (700), transceiver compliance (XAUI, PCIe Gen2), and thermal design power (21.5 W).
Technical Context
The XC6VSX475T-2FF1759C implements a 40 nm FPGA architecture with integrated multi-gigabit transceivers supporting data rates from 600 Mb/s to 6.6 Gb/s, and configurable logic blocks with six-input LUTs and dual flip-flops per slice. It includes dedicated DSP48E1 slices delivering 250 GMAC/s peak performance at -2 speed grade.
Configuration is performed via Master SelectMAP or JTAG, with support for bitstream encryption using AES-256 and HMAC-SHA-256. The device operates across commercial temperature range (0°C to 85°C) and requires 1.0 V core, 1.8 V auxiliary, and 2.5 V I/O supply rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 475,800 - determines maximum combinational/sequential logic capacity for complex digital functions |
| Block RAM | 36.9 Mb - enables large on-chip buffering and data storage without external memory |
| Transceiver Speed | 6.6 Gb/s - supports XAUI, PCIe Gen2, and CPRI protocols with minimal serialization overhead |
| I/O Pins | 700 - provides high-density interface routing for multi-protocol system interconnect |
| Speed Grade | -2 - guarantees timing closure at 600 MHz system clock with 1.0 V core supply |
| TDP | 21.5 W - defines thermal envelope requiring active cooling in dense PCB layouts |
| DSP Slices | 2,520 - delivers 250 GMAC/s for real-time filtering, FFT, and beamforming acceleration |
Pinout & Package
XC6VSX475T-2FF1759C is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | Supplies 1.0 V to FPGA fabric; decoupling required within 10 mm of each pin |
| VCCAUX | Auxiliary Power Supply | Provides 1.8 V to configuration logic, clock management, and transceivers |
| VCCO | I/O Bank Power | Configurable per bank (1.2–3.3 V); sets output voltage swing and input threshold |
| MRCC/MRCC_N | Multi-Region Clock Input | Dedicated differential pair for low-jitter clock injection into multiple clock regions |
| GTX_CLK0_N/P | Transceiver Reference Clock | Drives GTX transceiver PLLs; must meet ±50 ppm frequency accuracy and <1.5 ps RMS jitter |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTX Transceivers | 32 lanes operating up to 6.6 Gb/s with built-in PRBS generation and error detection |
| DSP48E1 Slices | 2,520 units with 25-bit pre-adder, 18×25 multiplier, and 48-bit accumulator for pipelined arithmetic |
| PCIe Gen2 Endpoint Support | Hard IP block enabling x1/x2/x4/x8 link widths with full TLP processing and DMA engine integration |
| AES-256 Bitstream Encryption | Prevents unauthorized configuration and intellectual property theft during field updates |
| Partial Reconfiguration | Enables dynamic module swapping without resetting system state or halting operation |
Applications
| 10G Ethernet Line Card | Radar Signal Processor |
|---|---|
Use Scenario: Aggregating and switching 10GbE traffic in telecom edge routers with line-rate packet classification. IC Role / Device Role / Timing Role: FPGA fabric implements MAC-layer logic, SERDES interface, and deep packet inspection engines. Use Value: XC6VSX475T-2FF1759C delivers deterministic latency under 200 ns and supports 128K-entry TCAM emulation using distributed RAM. | Use Scenario: Real-time pulse-Doppler processing in airborne synthetic aperture radar (SAR) systems. IC Role / Device Role / Timing Role: Configurable accelerator for matched filtering, CFAR detection, and SAR image formation pipelines. Use Value: XC6VSX475T-2FF1759C achieves 128-point FFT in 1.2 µs using pipelined DSP48E1 slices and block RAM-based twiddle storage. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: High-throughput image reconstruction in CT scanners requiring parallel back-projection and iterative algorithms. IC Role / Device Role / Timing Role: Co-processor interfacing with GPU host via PCIe Gen2 x8, managing DDR3 memory coherency and DMA scheduling. Use Value: XC6VSX475T-2FF1759C sustains 6.4 GB/s memory bandwidth using 16 independent 64-bit DDR3 interfaces with write leveling calibration. | Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and AFDX data streams in flight control computers. IC Role / Device Role / Timing Role: Protocol bridge and time-synchronized message router with deterministic jitter < 5 ns. Use Value: XC6VSX475T-2FF1759C implements hardware timestamping and priority arbitration across 24 concurrent serial channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU3P-2FFVD1760E | UltraScale architecture, 1.1 GHz system clock, 16.3 Gb/s transceivers, higher power (32 W) | Better suited for 25G+ Ethernet and AI inference acceleration; lacks native PCIe Gen2 endpoint hard IP | Select when migrating to 16 nm process and requiring >10 Gb/s serial links |
| XC7VX690T-2FFG1927I | Virtex-7 architecture, 690K logic cells, 13.1 Gb/s transceivers, industrial temp (-40°C to 100°C) | Higher logic density and extended temperature range; no AES-256 encryption support | Select when needing wider temperature margin and larger fabric without bitstream security |
Compared with XC6VSX475T-2FF1759C, the XCVU3P-2FFVD1760E offers higher serial bandwidth but requires PCB redesign due to different package and power delivery; the XC7VX690T-2FFG1927I provides greater logic capacity and extended temperature operation but omits cryptographic configuration protection.
Availability
XC6VSX475T-2FF1759C is available at Aetrix Electronics and suitable for 10G Ethernet line cards, radar signal processors, and medical imaging backends requiring stable component supply over extended production lifecycles.
Supply support for XC6VSX475T-2FF1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies for data center, embedded, and client markets.
The Virtex-6 family was designed for high-bandwidth, low-latency signal processing and protocol bridging in wired infrastructure, defense electronics, and scientific instrumentation.
FAQ
What is the maximum transceiver data rate supported by XC6VSX475T-2FF1759C?
The XC6VSX475T-2FF1759C supports GTX transceivers operating up to 6.6 Gb/s per lane. This enables compliance with 10GBASE-R, CPRI Option 3, and PCIe Gen2 standards. Each transceiver lane includes built-in clock data recovery, elastic buffers, and 8B/10B encoding/decoding logic. The device contains 32 GTX transceivers, all fully functional at this rate under -2 speed grade conditions.
Does XC6VSX475T-2FF1759C support partial reconfiguration?
Yes, XC6VSX475T-2FF1759C supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This allows dynamic swapping of logic modules without resetting the entire device or halting system operation. Implementation requires Vivado Design Suite 2018.3 or later and adherence to placement constraints for reconfigurable partitions. The feature is used in applications like protocol adaptation in software-defined radios.
What power supplies are required for XC6VSX475T-2FF1759C operation?
XC6VSX475T-2FF1759C requires three primary supply rails: 1.0 V ±3% for VCCINT (core logic), 1.8 V ±3% for VCCAUX (configuration and clock management), and bank-specific VCCO (1.2 V to 3.3 V) for I/O signaling. Decoupling capacitors must be placed within 10 mm of each power pin, and thermal management must maintain junction temperature below 100°C. Total typical power consumption is 21.5 W at full utilization.
Is XC6VSX475T-2FF1759C compatible with PCIe Gen2 endpoints?
Yes, XC6VSX475T-2FF1759C includes hardened PCIe Gen2 endpoint blocks supporting x1, x2, x4, and x8 link widths. These blocks implement full Transaction Layer Packet (TLP) parsing, credit-based flow control, and DMA engine integration. The implementation complies with PCI Express Base Specification Revision 2.1 and supports hot-plug detection and advanced error reporting features required in server and telecom applications.
What is the operating temperature range for XC6VSX475T-2FF1759C?
XC6VSX475T-2FF1759C is rated for commercial temperature operation from 0°C to +85°C ambient. This range applies to the FF1759C package variant and assumes proper PCB thermal design with adequate copper pour and airflow. Junction temperature must remain below 100°C under worst-case power conditions. For extended temperature applications, the industrial-grade variant XC6VSX475T-2FF1759I is available with -40°C to +100°C specification.
XC6VSX475T-2FF1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37200
- Number of Logic Elements/Cells:
- 476160
- Total RAM Bits:
- 39223296
- Number of I/O:
- 840
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX475T-2FF1759C FAQ
1.How can I place an order for XC6VSX475T-2FF1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX475T-2FF1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX475T-2FF1759C reliable?
The price and inventory of XC6VSX475T-2FF1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX475T-2FF1759C is usually 5 days.
3.What payment methods are accepted for XC6VSX475T-2FF1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX475T-2FF1759C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX475T-2FF1759C?
XC6VSX475T-2FF1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX475T-2FF1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX475T-2FF1759C?
For technical support, including XC6VSX475T-2FF1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX475T-2FF1759C requirements.
6.How does Aetrix verify that XC6VSX475T-2FF1759C is sourced from the original manufacturer or authorized distributors?
All XC6VSX475T-2FF1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX475T-2FF1759C meets industry standards.
7.What is the process for return or replacement of XC6VSX475T-2FF1759C?
All XC6VSX475T-2FF1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX475T-2FF1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX475T-2FF1759C part is unused and in its original packaging.
Return procedure for XC6VSX475T-2FF1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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