AMD XC6VSX475T-2FFG1156C

Overview

XC6VSX475T-2FFG1156C from AMD is a high-performance Virtex-6 FPGA featuring 475,800 logic cells, 28.8 Gb/s transceiver bandwidth, and -2 speed grade in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package. It serves as a system-on-chip fabric for high-speed serial interface bridging in 10G Ethernet line cards.

For engineers reviewing the XC6VSX475T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (24), DSP48E1 slice count (2,944), block RAM capacity (14,740 kbits), and I/O standard support including LVDS, SSTL, and HSTL.

Technical Context

The XC6VSX475T-2FFG1156C implements a 40 nm FPGA architecture with integrated multi-gigabit transceivers supporting protocols up to 11.18 Gb/s per lane. Its configurable logic blocks include dual-register LUTs and dedicated carry logic for arithmetic acceleration.

It integrates 24 GTX transceivers, each with independent TX/RX clocking, PRBS pattern generation, and built-in eye diagram monitoring. The device supports PCI Express Gen2 x8 endpoint configuration and IEEE 1588v2 timestamping via programmable delay elements.

Key Specifications

Pinout & Package

XC6VSX475T-2FFG1156C is housed in a 1156-pin Flip-Chip Fine-Pitch BGA (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed FPGA fabric applications.

Compared with XC6VSX475T-2FFG1156C, the XCVU3P-2FFVD1760I delivers 23% more logic and 33% more transceivers but mandates newer synthesis tools and higher PCB layer count, while the XC7VX690T-2FFG1927I offers greater logic density at the cost of PCIe integration and increased static power consumption.

Availability

XC6VSX475T-2FFG1156C is available at Aetrix Electronics and suitable for 10G Ethernet infrastructure, wireless baseband equipment, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC6VSX475T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and ACAPs for data center, wired/wireless infrastructure, and aerospace applications.

The Virtex-6 family was originally designed by Xilinx as a high-performance FPGA platform targeting wireline communications, military systems, and high-end test equipment where transceiver bandwidth and logic density were critical.

FAQ

What is the maximum supported transceiver data rate for XC6VSX475T-2FFG1156C?

The XC6VSX475T-2FFG1156C supports GTX transceivers with a maximum data rate of 11.18 Gb/s per lane, validated per Xilinx DS152 specification. This enables compliance with 10GBASE-R, CPRI Option 7, and Serial RapidIO Gen2 standards. Operation above 6.6 Gb/s requires AC coupling and careful PCB impedance control to maintain signal integrity.

Does XC6VSX475T-2FFG1156C include a hard PCIe Gen2 endpoint block?

Yes, XC6VSX475T-2FFG1156C integrates a dedicated PCIe Gen2 endpoint hard IP block supporting x1, x2, x4, and x8 link widths. This eliminates the need for soft-core implementations, reduces logic utilization by ~12,000 LUTs, and guarantees timing closure without custom PHY development. Configuration is managed through dedicated AXI-Lite registers mapped to BAR0.

What I/O standards does XC6VSX475T-2FFG1156C support in its SelectIO banks?

XC6VSX475T-2FFG1156C supports LVDS, SSTL-18, SSTL-25, HSTL-I, HSTL-II, and differential HSTL across its 36 I/O banks. Each bank operates independently with programmable VCCO (1.2–3.3 V) and on-die termination (ODT) settings. This allows concurrent interfacing to DDR2/DDR3 memory, ADC/DAC devices, and FPGA-to-FPGA parallel buses without level-shifting components.

How many DSP48E1 slices are available in XC6VSX475T-2FFG1156C?

XC6VSX475T-2FFG1156C contains 2,944 DSP48E1 slices, each providing a 25×18 multiplier, 48-bit accumulator, and pipeline registers. These slices support chained arithmetic operations for FIR filters, FFT engines, and matrix multiplication with up to 2.4 GMAC/s sustained throughput when fully utilized in parallel configurations.

Is XC6VSX475T-2FFG1156C qualified for extended temperature operation?

XC6VSX475T-2FFG1156C is offered in commercial (0°C to +85°C) and industrial (-40°C to +100°C) temperature grades. The -2FFG1156C suffix indicates the commercial grade variant. Industrial-grade versions (e.g., XC6VSX475T-2FFG1156I) undergo additional screening and are documented in Xilinx DS152 Table 1-2 for extended thermal and voltage margin validation.