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AMD XC6VSX475T-2FFG1759C
- Part No.:
- XC6VSX475T-2FFG1759C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX475T-2FFG1759C.pdf
- Description:
- IC FPGA 840 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,566
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Product details
Overview
XC6VSX475T-2FFG1759C from AMD is a high-performance Virtex-6 FPGA with 475,800 logic cells, 28.8 Gb/s transceiver bandwidth, and -2 speed grade in a 1759-pin Flip-Chip Fine-Pitch BGA package. It integrates DSP48E1 slices, Block RAM, and PCIe Gen2 x8 endpoint capability for high-speed serial interface applications.
For engineers reviewing the XC6VSX475T-2FFG1759C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (24), I/O standard support (LVDS, SSTL, HSTL), on-chip memory depth (36 Mb total Block RAM), and thermal design power (22.5 W typical).
Technical Context
The XC6VSX475T-2FFG1759C implements a 40 nm CMOS process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices supporting 25×18 multiply-accumulate operations, and integrated 6.6 Gb/s multi-gigabit transceivers. It supports PCI Express Gen2 x8 endpoint configuration and includes hardened Ethernet MAC blocks.
Configuration occurs via Master SelectMAP or JTAG, with dual-boot capability using external SPI flash. The device supports partial reconfiguration and operates across commercial temperature range (0°C to 85°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 475,800 - determines maximum combinational/sequential logic capacity for complex digital systems |
| Transceiver Lanes | 24 - enables up to 24 independent high-speed serial links (e.g., 24× 6.6 Gb/s) |
| Block RAM | 36 Mb - provides on-die memory for FIFOs, buffers, and lookup tables without external DRAM |
| DSP Slices | 2,448 - delivers fixed-point arithmetic throughput for signal processing and math-intensive workloads |
| I/O Standards | LVDS, SSTL-18, HSTL-I, DIFF_HSTL_I - supports interfacing with DDR2/DDR3 memory and high-speed ADCs/DACs |
| Speed Grade | -2 - guarantees timing closure at higher clock frequencies than -1 grade, with tighter setup/hold margins |
Pinout & Package
XC6VSX475T-2FFG1759C is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration shift register during Master SelectMAP mode |
| DIN | Configuration Data Input | Serial data input for bitstream loading in Master SelectMAP mode |
| INIT_B | Configuration Status | Open-drain output indicating configuration status (low = error or incomplete) |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts boot |
| MGTAVCC | Analog Transceiver Supply | 1.0 V supply for multi-gigabit transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hardened IP block enabling direct connection to host systems without external bridge logic |
| Partial Reconfiguration | Allows dynamic swapping of logic modules during operation to reduce resource footprint |
| Dual-Boot Configuration | Supports two independent bitstreams stored in external SPI flash for fail-safe firmware updates |
| Integrated Ethernet MAC | 10/100/1000 Mbps MAC with GMII/RGMII interface reduces PHY interface complexity |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and CFAR algorithms; transceivers interface with ADC/DACs at 500 MSPS. Use Value: 24 transceiver lanes and 2,448 DSP slices enable simultaneous multi-channel processing with deterministic latency. | Use Scenario: Digitization and preprocessing of wideband RF signals in test equipment and spectrum analyzers. IC Role / Device Role / Timing Role: Configurable I/O banks interface with 16-bit, 250 MSPS ADCs; Block RAM buffers streaming data before offload. Use Value: 36 Mb on-chip RAM eliminates need for external DDR3, reducing board area and signal integrity risk. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: Image reconstruction pipeline in CT and MRI scanners requiring low-latency pixel processing. IC Role / Device Role / Timing Role: Logic fabric implements back-projection and filtering kernels; PCIe Gen2 x8 connects to host CPU for image transfer. Use Value: Hardened PCIe endpoint ensures reliable, high-throughput data transfer without software driver overhead. | Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553B, and AFDX traffic in flight control systems. IC Role / Device Role / Timing Role: FPGA implements multiple protocol engines concurrently; LVDS I/O supports differential bus signaling. Use Value: Support for SSTL and HSTL standards allows direct interface with legacy avionics memory and bus controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2,586K logic cells, 100+ GTY transceivers, -2I industrial grade | Higher density and bandwidth; requires updated toolchain (Vivado 2019.1+) and PCB redesign | Preferred for new designs needing >2× logic capacity and 10.3125 Gb/s transceivers |
| XC6VLX760T-2FFG1759C | Virtex-6 family, same package and pinout, but 760K logic cells and no GTX transceivers (only GTP) | Lacks 6.6 Gb/s serial I/O; suitable only for non-transceiver-heavy logic-only tasks | Drop-in replacement only if transceiver usage is zero and logic utilization ≤760K cells |
Compared with XC6VSX475T-2FFG1759C, XCVU9P-2FLGA2104I offers scalable bandwidth and logic for next-gen systems but demands full hardware and software requalification, while XC6VLX760T-2FFG1759C shares mechanical compatibility but sacrifices serial connectivity-making it viable only in pure logic expansion scenarios.
Availability
XC6VSX475T-2FFG1759C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC6VSX475T-2FFG1759C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, graphics, and AI acceleration technologies.
The Virtex-6 family was designed for high-bandwidth, low-latency system integration in defense, aerospace, and scientific instrumentation applications.
FAQ
What is the maximum supported transceiver data rate for XC6VSX475T-2FFG1759C?
The XC6VSX475T-2FFG1759C supports GTX transceivers rated up to 6.6 Gb/s per lane. This rate is guaranteed under -2 speed grade conditions with proper reference clock jitter and PCB interconnect design. The XC6VSX475T-2FFG1759C does not include GTY or GTH transceivers, which appear in later Virtex families.
Does XC6VSX475T-2FFG1759C support partial reconfiguration?
Yes, the XC6VSX475T-2FFG1759C supports dynamic partial reconfiguration through Xilinx ISE Design Suite 14.7 tools. This allows runtime logic module swapping without resetting the entire device. The XC6VSX475T-2FFG1759C implements frame-based reconfiguration using dedicated configuration logic and boundary-scan infrastructure.
What configuration modes are supported by XC6VSX475T-2FFG1759C?
The XC6VSX475T-2FFG1759C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) flash configuration. Dual-boot capability is enabled when using external SPI flash with two bitstream images. The XC6VSX475T-2FFG1759C requires correct M0–M2 pin strapping to select the active mode at power-up.
Is XC6VSX475T-2FFG1759C qualified for automotive applications?
No, the XC6VSX475T-2FFG1759C is specified for commercial temperature range (0°C to +85°C junction) and is not AEC-Q100 qualified. It lacks automotive-grade screening, burn-in, and failure rate reporting. For automotive use, engineers must select Xilinx Automotive (XA) variants such as XA6VSX475T, which undergo additional qualification testing.
What is the total Block RAM capacity of XC6VSX475T-2FFG1759C?
The XC6VSX475T-2FFG1759C contains 36,864 Kbits (36 Mb) of total Block RAM distributed across 1,152 BRAM primitives. Each BRAM can be configured as 36 Kb dual-port memory or split into two 18 Kb blocks. This capacity is fixed and cannot be increased via logic synthesis or external memory mapping.
XC6VSX475T-2FFG1759C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37200
- Number of Logic Elements/Cells:
- 476160
- Total RAM Bits:
- 39223296
- Number of I/O:
- 840
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX475T-2FFG1759C FAQ
1.How can I place an order for XC6VSX475T-2FFG1759C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX475T-2FFG1759C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX475T-2FFG1759C reliable?
The price and inventory of XC6VSX475T-2FFG1759C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX475T-2FFG1759C is usually 5 days.
3.What payment methods are accepted for XC6VSX475T-2FFG1759C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX475T-2FFG1759C transactions.
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4.How is shipping managed for XC6VSX475T-2FFG1759C?
XC6VSX475T-2FFG1759C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX475T-2FFG1759C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX475T-2FFG1759C?
For technical support, including XC6VSX475T-2FFG1759C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX475T-2FFG1759C requirements.
6.How does Aetrix verify that XC6VSX475T-2FFG1759C is sourced from the original manufacturer or authorized distributors?
All XC6VSX475T-2FFG1759C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX475T-2FFG1759C meets industry standards.
7.What is the process for return or replacement of XC6VSX475T-2FFG1759C?
All XC6VSX475T-2FFG1759C units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX475T-2FFG1759C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX475T-2FFG1759C part is unused and in its original packaging.
Return procedure for XC6VSX475T-2FFG1759C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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