AMD XC6VSX475T-2FFG1759E

Overview

XC6VSX475T-2FFG1759E from AMD is a high-performance Virtex-6 FPGA featuring 475,800 logic cells, 28.8 Gb/s transceiver bandwidth, and -2 speed grade in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. It serves as a system-on-chip fabric for high-speed serial interface bridging in 10G Ethernet line cards.

For engineers reviewing the XC6VSX475T-2FFG1759E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (24), DSP48E1 slice count (2,448), and I/O standard support (LVDS, SSTL, HSTL).

Technical Context

The XC6VSX475T-2FFG1759E implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (BRAM), and dedicated DSP48E1 slices for arithmetic-intensive tasks. It integrates 24 multi-gigabit transceivers supporting protocols including PCIe Gen2, SATA, and 10G Ethernet.

Its clocking subsystem includes eight mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs), enabling precise jitter filtering and frequency synthesis across multiple domains. The device supports SelectIO standards up to 1.8 V and operates within industrial temperature range (-40°C to +100°C).

Key Specifications

Pinout & Package

XC6VSX475T-2FFG1759E is housed in a 1759-ball Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in multi-layer boards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC6VSX475T-2FFG1759E, XCVU9P-2FLGA2104E delivers 5.4× more logic and native 25G support but increases PCB complexity and thermal management burden; XC7VX690T-2FFG1927I offers 45% more logic and 50% more transceivers at comparable power, making it the preferred upgrade path for sustaining 10G-class systems.

Availability

XC6VSX475T-2FFG1759E is available at Aetrix Electronics and suitable for 10G Ethernet infrastructure, PCIe-based accelerators, and medical imaging backend systems requiring stable component supply and long-term industrial temperature support.

Supply support for XC6VSX475T-2FFG1759E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace applications.

The Virtex-6 family was engineered for high-bandwidth, low-latency programmable logic in wired communications, defense radar, and scientific instrumentation systems.

FAQ

What is the maximum transceiver line rate supported by XC6VSX475T-2FFG1759E?

The XC6VSX475T-2FFG1759E supports GTX transceivers with a maximum line rate of 6.6 Gb/s. This enables full compliance with 10GBASE-KR, PCIe Gen2, and SATA II standards. Each of the 24 transceiver lanes operates independently within this range, and the device includes built-in clock data recovery (CDR) and elastic buffers to maintain signal integrity at these speeds. The XC6VSX475T-2FFG1759E achieves this performance while maintaining sub-150 fs integrated jitter under typical operating conditions.

Does XC6VSX475T-2FFG1759E support partial reconfiguration?

Yes, XC6VSX475T-2FFG1759E supports partial reconfiguration through its dedicated ICAP (Internal Configuration Access Port) and frame-based bitstream loading mechanism. This allows dynamic swapping of logic modules-such as protocol engines or filter banks-without resetting I/O banks or disrupting active transceiver links. The XC6VSX475T-2FFG1759E implements this capability using hardware-controlled configuration controllers that isolate reconfigurable regions from static logic, ensuring deterministic timing behavior during updates.

What I/O standards are supported by XC6VSX475T-2FFG1759E?

XC6VSX475T-2FFG1759E supports LVDS, SSTL-18, HSTL-I, DIFF_HSTL_I_18, and other SelectIO standards across its 600+ user I/O pins. Each I/O bank is independently configurable for voltage levels between 1.2 V and 1.8 V, enabling mixed-standard interfaces-for example, interfacing DDR3 memory (SSTL-15) alongside 10G Ethernet PHYs (LVDS). The XC6VSX475T-2FFG1759E also provides programmable slew rate and drive strength per pin group to meet signal integrity requirements.

Is XC6VSX475T-2FFG1759E qualified for industrial temperature operation?

Yes, XC6VSX475T-2FFG1759E is rated for industrial temperature operation from -40°C to +100°C ambient. This qualification covers all logic, transceiver, and memory controller functions under specified voltage and timing margins. The XC6VSX475T-2FFG1759E undergoes extended burn-in and thermal cycling validation per JEDEC JESD22-A108, and its FC-FBGA package includes enhanced thermal vias and solder mask defined pads to sustain reliability in convection-cooled enclosures.

What clock management resources are available in XC6VSX475T-2FFG1759E?

XC6VSX475T-2FFG1759E integrates eight Mixed-Mode Clock Managers (MMCMs), each capable of generating up to six independent output clocks with fine-grained phase shift, duty cycle correction, and frequency synthesis. These MMCMs support input frequencies from 10 MHz to 800 MHz and deliver outputs ranging from 5 MHz to 1.2 GHz. The XC6VSX475T-2FFG1759E uses these resources to synchronize transceiver lanes, memory interfaces, and logic domains with sub-150 fs integrated jitter performance.