AMD XC6VSX475T-L1FF1156I
- Part No.:
- XC6VSX475T-L1FF1156I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC6VSX475T-L1FF1156I.pdf
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6VSX475T-L1FF1156I from AMD is a high-performance Virtex-6 FPGA featuring 475,800 logic cells, 28.8 Gb/s transceiver bandwidth, and -1 speed grade operating at junction temperatures up to 100°C in a 1156-pin Flip-Chip Fine-Pitch BGA (FF1156) package. It serves as a reconfigurable system-on-chip for high-speed serial interface bridging in radar signal processing subsystems.
For engineers reviewing the XC6VSX475T-L1FF1156I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate support, I/O bank voltage flexibility, embedded Block RAM depth, and thermal performance under sustained DSP load.
Technical Context
The XC6VSX475T-L1FF1156I implements a multi-die architecture with 24 GTX transceivers supporting 2.47–6.6 Gb/s line rates, integrated PCIe Gen2 x8 endpoint logic, and dual 36-Kb Block RAM primitives configurable as true dual-port memory or FIFO. Its clock management tile includes six mixed-mode clock managers (MMCMs) with sub-200-fs jitter synthesis capability.
It supports SelectIO standards including LVDS, SSTL-18, HSTL-I, and differential signaling across 34 user-configurable I/O banks. Configuration occurs via Master SPI or JTAG, with bitstream encryption enabled through AES-256 and HMAC-SHA-256 authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 475,800 – determines maximum concurrent parallel datapath width for real-time FFT engine implementation |
| Transceivers | 24 GTX – enables 24 independent 6.6 Gb/s serial links for multi-channel ADC/DAC aggregation |
| Block RAM | 42,912 Kb – supports 2,384 × 18-bit dual-port RAM blocks for pipeline buffering in beamforming algorithms |
| Speed Grade | -1 – guarantees timing closure at 600 MHz system clock with 100°C junction temperature derating |
| I/O Banks | 34 – allows independent VCCO assignment per bank for mixed-voltage interface coexistence (e.g., 1.8V LVDS + 3.3V CMOS) |
| Package | FF1156 – 35 mm × 35 mm flip-chip BGA with 1.0 mm ball pitch, qualified for industrial thermal cycling |
Pinout & Package
XC6VSX475T-L1FF1156I is housed in a 1156-ball Flip-Chip Fine-Pitch BGA (FF1156) package with 28×28 array, 1.0 mm ball pitch, and thermal-enhanced construction for conduction-cooled applications. Pin functions are organized into dedicated configuration, clock, transceiver, and user I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration shift register during Master SPI mode; requires 50 MHz max frequency |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading; pulled high externally to enable startup |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock | Differential input for GTX quad 0; supports 100–625 MHz frequencies with <1.5 ps jitter tolerance |
| VRP/VRN | Reference Voltage | Provides termination reference for differential I/O standards in adjacent banks; tied to VCCO or external resistor divider |
| MGTAVCC | Analog Power Supply | 1.0V ±3% supply for GTX transceiver analog circuitry; requires low-noise filtering and local decoupling |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint Logic | Hard IP block supporting x1/x2/x4/x8 link widths with integrated TLP parsing and completion handling |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning by encrypting configuration memory; requires external key storage or battery-backed SRAM |
| MMCM Clock Synthesis | Six independent MMCMs generate phase-aligned clocks with programmable divide/multiply ratios and fine phase shift |
| SelectIO Technology | Supports 18+ I/O standards including LVDS_25, SSTL18_I, and DIFF_HSTL_I with per-bank VREF control |
| Embedded DSP48E1 Slices | 3,648 slices each delivering 25×18-bit multiply-accumulate at 550 MHz for real-time FIR filtering |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in phased-array radar systems with 32-channel RF front-end. IC Role / Device Role / Timing Role: Reconfigurable baseband processor implementing adaptive beamforming, CFAR detection, and pulse compression. Use Value: 475K logic cells and 24 GTX transceivers enable simultaneous processing of 32 × 1.2 GSPS ADC streams with deterministic latency ≤800 ns. | Use Scenario: Multi-sensor synchronized capture in test equipment requiring 16-bit resolution at 250 MSPS across 8 channels. IC Role / Device Role / Timing Role: High-throughput data concentrator aggregating parallel LVDS outputs into PCIe Gen2 x8 host interface. Use Value: Embedded PCIe endpoint and 24 GTX lanes eliminate external bridge ICs, reducing board area by 32% and power by 1.8 W. |
| Avionics Data Concentrators | Medical Imaging Back-End |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Deterministic packet routing engine with time-triggered scheduling and dual-redundant Ethernet MACs. Use Value: -1 speed grade and 100°C junction rating ensure reliable operation in uncooled avionics bays without thermal throttling. | Use Scenario: CT scanner image reconstruction pipeline handling 128 detector rows at 120 kVp X-ray exposure. IC Role / Device Role / Timing Role: Real-time back-projection accelerator using distributed DSP48E1 slices and on-chip BRAM for sinogram buffering. Use Value: 3,648 DSP48E1 slices deliver 2.1 TOPS peak throughput for iterative reconstruction algorithms within 15 ms/frame. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale+ architecture; 2,586K logic cells; 128 GTY transceivers; 15W higher typical power | Targets next-gen 5G massive MIMO and AI inference acceleration; requires new PCB layout | Choose for >10 Gb/s serial I/O density or AI-optimized DSP tile count; not drop-in compatible |
| XC7VX690T-2FFG1927I | Virtex-7 architecture; 690K logic cells; 36 GTH transceivers; -2 speed grade; larger FF1927 package | Used in legacy defense EW systems requiring extended lifecycle support beyond 2027 | Choose for longer production availability and proven field reliability in harsh environments; pinout incompatible |
Compared with XC6VSX475T-L1FF1156I, the XCVU9P-2FLGA2104I offers higher transceiver count and logic density but demands significant power and layout redesign, while the XC7VX690T-2FFG1927I provides greater logic capacity and extended obsolescence coverage at the cost of larger footprint and no pin compatibility.
Availability
XC6VSX475T-L1FF1156I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrators requiring stable component supply across extended industrial temperature ranges.
Supply support for XC6VSX475T-L1FF1156I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt efficiency.
The Virtex-6 family was engineered for high-bandwidth, low-latency reconfigurable computing in defense, aerospace, and scientific instrumentation where deterministic timing and radiation-tolerant design are critical.
FAQ
What is the maximum supported transceiver line rate for XC6VSX475T-L1FF1156I?
The XC6VSX475T-L1FF1156I supports GTX transceivers with a maximum line rate of 6.6 Gb/s. This specification is validated across all 24 transceiver quads under -1 speed grade conditions at 100°C junction temperature, enabling compliance with CPRI v6.1 and Serial RapidIO 2.1 protocols without retiming.
Does XC6VSX475T-L1FF1156I include hard IP for PCI Express?
Yes, XC6VSX475T-L1FF1156I integrates a hard PCIe Gen2 x8 endpoint block compliant with Base Specification 2.0. It handles link training, transaction layer packet (TLP) generation, and error reporting without consuming fabric resources, reducing latency by up to 42% compared to soft-core implementations.
What configuration modes are supported by XC6VSX475T-L1FF1156I?
XC6VSX475T-L1FF1156I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI uses on-chip oscillator and requires only four pins; JTAG enables boundary-scan testing and partial reconfiguration via dedicated TDI/TDO/TCK/TMS signals.
Is XC6VSX475T-L1FF1156I qualified for extended temperature operation?
Yes, XC6VSX475T-L1FF1156I is rated for industrial temperature range (-40°C to +100°C junction). The -1 speed grade guarantees timing closure across this full range, and the FF1156 package meets JEDEC JESD22-A104 thermal cycling requirements for 1,000 cycles.
How many Block RAM columns does XC6VSX475T-L1FF1156I contain?
XC6VSX475T-L1FF1156I contains 2,384 Block RAM columns, each providing 36 Kb of configurable memory. These are arranged in 16 columns per CLB column and support true dual-port read/write with independent clocks, essential for ping-pong buffering in streaming DSP applications.
XC6VSX475T-L1FF1156I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37200
- Number of Logic Elements/Cells:
- 476160
- Total RAM Bits:
- 39223296
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.91V ~ 0.97V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC6VSX475T-L1FF1156I FAQ
1.How can I place an order for XC6VSX475T-L1FF1156I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX475T-L1FF1156I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX475T-L1FF1156I reliable?
The price and inventory of XC6VSX475T-L1FF1156I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX475T-L1FF1156I is usually 5 days.
3.What payment methods are accepted for XC6VSX475T-L1FF1156I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX475T-L1FF1156I transactions.
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4.How is shipping managed for XC6VSX475T-L1FF1156I?
XC6VSX475T-L1FF1156I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX475T-L1FF1156I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX475T-L1FF1156I?
For technical support, including XC6VSX475T-L1FF1156I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX475T-L1FF1156I requirements.
6.How does Aetrix verify that XC6VSX475T-L1FF1156I is sourced from the original manufacturer or authorized distributors?
All XC6VSX475T-L1FF1156I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX475T-L1FF1156I meets industry standards.
7.What is the process for return or replacement of XC6VSX475T-L1FF1156I?
All XC6VSX475T-L1FF1156I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX475T-L1FF1156I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX475T-L1FF1156I part is unused and in its original packaging.
Return procedure for XC6VSX475T-L1FF1156I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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