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AMD XC6VSX475T-L1FF1759I
- Part No.:
- XC6VSX475T-L1FF1759I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1759-BBGA, FCBGA
- Datasheet:
-
XC6VSX475T-L1FF1759I.pdf
- Description:
- IC FPGA 840 I/O 1759FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,200
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Product details
Overview
XC6VSX475T-L1FF1759I from AMD is a high-performance Virtex-6 FPGA featuring 475,800 logic cells, 28.8 Gb/s serial transceiver bandwidth (11.18 Gb/s per lane), and -1 speed grade operation at industrial temperature range (-40°C to +100°C). It integrates 36-Kb Block RAM, DSP48E1 slices, and PCIe Gen2 x8 endpoint capability for high-speed data processing in radar signal conditioning systems.
For engineers reviewing the XC6VSX475T-L1FF1759I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (24), I/O standard support (LVDS, SSTL, HSTL), on-chip memory depth (19,660 Kb BRAM), and thermal design power (24.5 W typical).
Technical Context
The XC6VSX475T-L1FF1759I implements a 40 nm CMOS architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for 25×18 multiply-accumulate operations, and integrated 11.18 Gb/s GTP transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. It supports multi-gigabit serial I/O with programmable pre-emphasis and receiver equalization.
Configuration is performed via Master SelectMAP or JTAG interface using external SPI flash or PROM. The device includes internal voltage regulation monitoring, thermal shutdown circuitry, and IEEE 1149.1/1532 boundary-scan compliance for production testability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 475,800 - total available LUTs+FFs for complex digital logic implementation |
| Block RAM | 19,660 Kb - on-chip memory for FIFOs, buffers, and data caching without external DRAM |
| GTP Transceivers | 24 lanes @ 11.18 Gb/s - supports PCIe Gen2 x8, SATA II, and SRIO 2.1 physical layer |
| DSP Slices | 2,520 DSP48E1 - fixed-point arithmetic units enabling real-time filtering and FFT acceleration |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II - enables direct interfacing with ADCs, DDR2/3 memory, and FMC mezzanine cards |
| Speed Grade | -1 - guarantees timing closure at 1.2 V core voltage and industrial temperature range |
| Thermal Design Power | 24.5 W typical - determines heatsink sizing and airflow requirements in sealed enclosures |
Pinout & Package
XC6VSX475T-L1FF1759I is housed in a 1759-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm pitch, designed for high-density PCB layouts and thermal dissipation via center thermal ball array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V regulated input powering CLBs, DSP slices, and interconnect routing |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, clock management, and transceiver reference circuits |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank enabling mixed-voltage I/O interfaces |
| MRCC/MRCC_N | Multi-Gigabit Reference Clock Input | Differential pair for transceiver PLL reference clock (100–625 MHz) |
| MGTREFCLK0/1 | Transceiver reference clock | Primary differential inputs for GTP transceiver banks (supports spread-spectrum clocking) |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
| CCLK | Configuration clock | Input clock for Master SelectMAP mode; frequency up to 100 MHz |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint | Integrated hard IP block supporting x1/x2/x4/x8 link widths with full protocol stack offload |
| Dynamic Reconfiguration | Partial reconfiguration capability enables runtime logic updates without system reset |
| System Monitor | On-die temperature and supply voltage sensors with 12-bit ADC for real-time health monitoring |
| Transceiver Calibration | Automatic calibration of TX pre-emphasis and RX equalization per lane during link training |
| Configurable I/O Banks | 32 independent I/O banks with per-bank voltage and standard selection for heterogeneous interface integration |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing time-critical FFTs and CFAR detection using DSP48E1 slices and BRAM-based delay lines. Use Value: 24 GTP lanes enable direct connection to 12-channel ADC front-ends at 250 MSPS, eliminating intermediate serialization bottlenecks. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanners. IC Role / Device Role / Timing Role: Co-processor managing raw k-space data ingestion, parallel back-projection, and DICOM compression offload. Use Value: 475K logic cells support concurrent execution of 16-channel FIR filters and 1024-point FFT engines with deterministic latency under 8 µs. |
| Avionics Data Concentrator | High-Energy Physics Trigger |
Use Scenario: ARINC 429/664 and MIL-STD-1553 bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Protocol bridge and time-stamped packet router with deterministic jitter < 50 ps RMS. Use Value: LVDS I/O banks interface directly with multiple avionics PHYs while maintaining DO-254 traceability through static timing analysis. | Use Scenario: Sub-microsecond trigger decision engine in particle detector readout systems. IC Role / Device Role / Timing Role: Real-time pattern matching unit comparing hit data against 2M+ templates stored in distributed BRAM. Use Value: -1 speed grade ensures setup/hold timing margins > 0.3 ns across -40°C to +100°C, critical for radiation-hardened operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 58.2 Gb/s GTY transceivers, higher power (42 W typical) | Targets next-gen 5G massive MIMO and AI inference acceleration requiring >2x logic density | Select when migrating from Virtex-6 legacy designs needing >2x DSP throughput and PCIe Gen4 support |
| XC7VX690T-2FFG1927I | 7-series architecture, 693,120 logic cells, 28.05 Gb/s GTX transceivers, same -2 speed grade but higher TDP (31.5 W) | Offers improved power efficiency per logic cell and native DDR3/4 controller IP | Choose for new designs prioritizing lower static power and integrated memory controller over legacy Virtex-6 toolchain compatibility |
Compared with XC6VSX475T-L1FF1759I, XCVU9P-2FLGA2104I delivers 4.4× more logic and Gen4 transceivers but requires board redesign and new toolflow; XC7VX690T-2FFG1927I provides 45% more logic at similar transceiver performance with better thermal headroom for air-cooled deployments.
Availability
XC6VSX475T-L1FF1759I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and high-energy physics trigger applications requiring stable component supply across extended lifecycle programs.
Supply support for XC6VSX475T-L1FF1759I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Virtex-6 family was engineered for high-bandwidth, low-latency signal processing in defense, aerospace, and scientific instrumentation where deterministic timing and industrial temperature resilience are mandatory.
FAQ
What is the maximum supported transceiver data rate for XC6VSX475T-L1FF1759I?
The XC6VSX475T-L1FF1759I supports a maximum transceiver line rate of 11.18 Gb/s per GTP lane. This enables PCIe Gen2 x8, SATA II, and SRIO 2.1 compliance. The device contains 24 GTP transceivers, and all lanes meet this specification under industrial temperature conditions with proper reference clock stability and PCB signal integrity.
Does XC6VSX475T-L1FF1759I support partial reconfiguration?
Yes, XC6VSX475T-L1FF1759I supports dynamic partial reconfiguration (DPR) through its ICAP interface and frame-based bitstream loading. This allows runtime updates of specific logic regions without resetting the entire device, enabling adaptive signal processing pipelines in radar and communications systems where functional modes change on-the-fly.
What I/O standards are supported by XC6VSX475T-L1FF1759I?
XC6VSX475T-L1FF1759I supports LVDS, SSTL-18/25, HSTL-I/II, LVCMOS, and differential signaling standards across its 32 configurable I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V, allowing simultaneous interfacing with DDR2/3 memory, high-speed ADCs, and FMC mezzanine cards without level-shifting components.
What is the thermal design power (TDP) of XC6VSX475T-L1FF1759I?
The typical thermal design power (TDP) of XC6VSX475T-L1FF1759I is 24.5 W under worst-case operating conditions (100% logic utilization, 24 transceivers active at 11.18 Gb/s, industrial temperature). This value guides heatsink selection and airflow requirements in conduction-cooled or forced-air enclosures used in avionics and radar subsystems.
Is XC6VSX475T-L1FF1759I qualified for industrial temperature operation?
Yes, XC6VSX475T-L1FF1759I is rated for industrial temperature operation from -40°C to +100°C. Its -1 speed grade guarantees timing closure across this full range when operated at 1.2 V core voltage and compliant I/O voltages, making it suitable for deployment in uncontrolled environments such as airborne radar housings and outdoor medical imaging equipment.
XC6VSX475T-L1FF1759I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-6 SXT
- Package/Case:
- 1759-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37200
- Number of Logic Elements/Cells:
- 476160
- Total RAM Bits:
- 39223296
- Number of I/O:
- 840
- Number of Gates:
- -
- Voltage - Supply:
- 0.91V ~ 0.97V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1759-FCBGA (42.5x42.5)
XC6VSX475T-L1FF1759I FAQ
1.How can I place an order for XC6VSX475T-L1FF1759I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6VSX475T-L1FF1759I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6VSX475T-L1FF1759I reliable?
The price and inventory of XC6VSX475T-L1FF1759I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6VSX475T-L1FF1759I is usually 5 days.
3.What payment methods are accepted for XC6VSX475T-L1FF1759I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6VSX475T-L1FF1759I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6VSX475T-L1FF1759I?
XC6VSX475T-L1FF1759I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6VSX475T-L1FF1759I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6VSX475T-L1FF1759I?
For technical support, including XC6VSX475T-L1FF1759I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6VSX475T-L1FF1759I requirements.
6.How does Aetrix verify that XC6VSX475T-L1FF1759I is sourced from the original manufacturer or authorized distributors?
All XC6VSX475T-L1FF1759I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6VSX475T-L1FF1759I meets industry standards.
7.What is the process for return or replacement of XC6VSX475T-L1FF1759I?
All XC6VSX475T-L1FF1759I units undergo pre-shipment inspection (PSI). If there is an issue with XC6VSX475T-L1FF1759I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6VSX475T-L1FF1759I part is unused and in its original packaging.
Return procedure for XC6VSX475T-L1FF1759I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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