AMD XC7A100T-1CSG324C
- Part No.:
- XC7A100T-1CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A100T-1CSG324C.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:119
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Product details
Overview
XC7A100T-1CSG324C from AMD (formerly Xilinx) is a Kintex-7 family FPGA with 101,440 logic cells, 600 DSP slices, 4.9 Gb/s transceiver capability, and 13.1 Mb of block RAM. It serves as a high-performance programmable logic fabric for real-time signal processing in radar baseband systems.
For engineers reviewing the XC7A100T-1CSG324C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -1 speed grade timing performance, and C-grade temperature rating (0°C to 85°C).
Technical Context
The XC7A100T-1CSG324C implements a 28 nm HKMG process architecture with SelectIO technology supporting single-ended and differential standards including LVCMOS, LVDS, and TMDS. Its configuration interface includes SPIx4 and JTAG, and it supports partial reconfiguration via ICAP.
It integrates dual 12-bit 1 MSPS ADCs for auxiliary monitoring, and its clocking resources include six MMCMs and twelve PLLs for multi-domain frequency synthesis and jitter attenuation across mixed-signal subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 600 - enables parallel multiply-accumulate operations for FIR filtering and FFT acceleration |
| Block RAM | 13.1 Mb - supports large on-chip data buffering and coefficient storage without external memory |
| Transceiver Speed | 4.9 Gb/s - meets CPRI v6 and JESD204B subclass 1 link requirements for wireless infrastructure |
| I/O Standards | LVCMOS, LVDS, TMDS, SSTL - allows direct interfacing with ADCs, DACs, DDR3, and video serializers |
| Speed Grade | -1 - guarantees timing closure at 640 MHz system clock with worst-case static timing analysis |
| Temperature Grade | C (0°C to 85°C) - qualified for commercial and industrial ambient environments |
Pinout & Package
XC7A100T-1CSG324C is housed in a 324-pin CSG (Chip Scale Grid Array) package with 0.8 mm pitch, 15 mm × 15 mm body size, and exposed thermal pad for enhanced power dissipation in sustained compute workloads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.0 V core supply input requiring low-noise regulation and local decoupling |
| P16 | VCCAUX | 1.8 V auxiliary supply for configuration, clocking, and transceiver reference |
| A13 | M0–M2 | Configuration mode select inputs sampled at power-on reset to determine boot source |
| E19 | INIT_B | Open-drain status output indicating configuration memory readiness or error condition |
| R15 | CLK_IN1_P | Differential input for primary user clock domain, compatible with LVDS or LVPECL |
| T14 | IO_L1P_T0_0 | Programmable I/O bank 0 pin supporting 1.2–3.3 V single-ended or differential signaling |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping during operation without full device reset, reducing system downtime |
| Dual 12-bit 1 MSPS ADCs | Provides on-die analog monitoring of supply voltages and die temperature, eliminating external sensors |
| Six MMCM + Twelve PLL | Delivers precise clock domain isolation and sub-100 fs integrated jitter for multi-rate serial links |
| SelectIO Technology | Allows per-bank I/O voltage assignment and simultaneous support of multiple interface standards |
| PCIe Gen2 x4 Endpoint | Integrates hard IP for host communication with ≤ 500 ns latency and no soft-core resource overhead |
Applications
| Radar Baseband Processing | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Configurable digital front-end processor handling ADC sample ingestion, channelization, and CFAR detection. Use Value: 600 DSP slices enable concurrent 128-channel FFTs at 100 MHz update rate with deterministic latency. | Use Scenario: High-fidelity ultrasound echo digitization and B-mode image reconstruction. IC Role / Device Role / Timing Role: Time-aligned acquisition controller synchronizing 64-channel ADCs and managing DMA transfers to DDR3 memory. Use Value: 13.1 Mb block RAM buffers full-frame RF data before GPU-assisted rendering, eliminating external FIFOs. |
| Wireless Remote Radio Unit | Industrial Machine Vision Controller |
Use Scenario: CPRI-compliant fronthaul interface between BBU and active antenna array. IC Role / Device Role / Timing Role: JESD204B subclass 1 serializer/deserializer bridging FPGA fabric to RFICs with deterministic latency. Use Value: 4.9 Gb/s transceivers meet CPRI option 10 line rate (9.8304 Gbps aggregate) using dual-lane configuration. | Use Scenario: Multi-camera synchronization and real-time defect classification on production lines. IC Role / Device Role / Timing Role: Deterministic I/O hub coordinating GigE Vision cameras, encoder feedback, and FPGA-accelerated CNN inference. Use Value: LVDS-capable I/O banks directly interface 10-bit CMOS image sensors at 120 fps with sub-cycle skew control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-1CSG324C | 74,695 logic cells, 480 DSP slices, same package and speed grade | Lower gate count limits complex filter banks and multi-standard protocol stacks | Preferred when cost sensitivity outweighs need for >100K logic or >600 DSP slices |
| XCKU035-1FFVA676C | Kintex UltraScale architecture, 258,600 logic cells, 15.3 Gb/s transceivers, different package | Requires PCB redesign due to FFG676 package and higher power delivery demands | Selected for next-generation designs needing PCIe Gen3, DDR4, or higher serial bandwidth |
Compared with XC7A75T-1CSG324C and XCKU035-1FFVA676C, the XC7A100T-1CSG324C delivers optimal balance of DSP density, transceiver speed, and pin-compatible upgrade path within the Kintex-7 footprint-enabling reuse of existing thermal and power delivery design while scaling compute capacity.
Availability
XC7A100T-1CSG324C is available at Aetrix Electronics and suitable for radar baseband processing, medical imaging data acquisition, and wireless remote radio unit applications requiring stable component supply and long-term industrial availability.
Supply support for XC7A100T-1CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets following its acquisition of Xilinx in 2022.
The Kintex-7 family, including XC7A100T-1CSG324C, was architected for high-throughput, low-latency signal processing in wireless infrastructure, test & measurement, and aerospace/defense systems.
FAQ
What is the maximum supported I/O standard voltage for XC7A100T-1CSG324C?
The XC7A100T-1CSG324C supports I/O bank voltages from 1.2 V to 3.3 V, configurable per bank. Each I/O bank can be independently assigned a VCCO voltage, enabling coexistence of LVCMOS33, LVCMOS18, and LVDS interfaces on the same device without level-shifting circuitry. This flexibility is confirmed in the Kintex-7 FPGA Data Sheet (DS182, v1.22).
Does XC7A100T-1CSG324C include built-in analog-to-digital converters?
Yes, XC7A100T-1CSG324C integrates two 12-bit, 1 MSPS auxiliary ADCs accessible via dedicated pins (VP/VN). These ADCs monitor internal supply rails and die temperature, providing telemetry data through the XADC DRP interface. They are not intended for high-speed signal acquisition but serve critical system health monitoring functions.
What configuration modes does XC7A100T-1CSG324C support?
XC7A100T-1CSG324C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is determined by the M[2:0] pin states at power-on reset. The device also supports fallback configuration and multi-boot via external flash addressing, enabling field-upgradable bitstreams without hardware modification.
Is XC7A100T-1CSG324C qualified for industrial temperature operation?
Yes, the 'C' suffix in XC7A100T-1CSG324C denotes Commercial/Industrial temperature grade, rated for operation from 0°C to +85°C ambient. This qualification covers all silicon, packaging, and characterization testing per Xilinx specification DS182, making it suitable for enclosed industrial enclosures and outdoor wireless equipment without forced cooling.
Can XC7A100T-1CSG324C implement PCIe Gen2 x4 endpoints?
Yes, XC7A100T-1CSG324C contains hardened PCIe Gen2 x4 endpoint blocks compliant with PCI Express Base Specification v2.1. It achieves ≤500 ns transaction latency and supports MSI/MSI-X interrupt delivery. The implementation requires no LUT resources, preserving logic capacity for application-specific functions.
XC7A100T-1CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A100T-1CSG324C FAQ
1.How can I place an order for XC7A100T-1CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-1CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-1CSG324C reliable?
The price and inventory of XC7A100T-1CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-1CSG324C is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-1CSG324C transactions.
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5.How can I obtain technical support or documentation for XC7A100T-1CSG324C?
For technical support, including XC7A100T-1CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-1CSG324C requirements.
6.How does Aetrix verify that XC7A100T-1CSG324C is sourced from the original manufacturer or authorized distributors?
All XC7A100T-1CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-1CSG324C meets industry standards.
7.What is the process for return or replacement of XC7A100T-1CSG324C?
All XC7A100T-1CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-1CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-1CSG324C part is unused and in its original packaging.
Return procedure for XC7A100T-1CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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