AMD XC7A100T-1CSG324CES9937
- Part No.:
- XC7A100T-1CSG324CES9937
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A100T-1CSG324CES9937.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7A100T-1CSG324CES9937 from AMD is a Kintex-7 FPGA featuring 101,440 logic cells, 6.9 Gb/s transceiver capability, and 13.1 Mb of block RAM, deployed in high-speed serial interface bridging and industrial vision processing systems.
For engineers reviewing the XC7A100T-1CSG324CES9937 datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), -1 speed grade timing performance, and CSG324 package thermal profile for convection-cooled embedded deployments.
Technical Context
The XC7A100T-1CSG324CES9937 implements a 28 nm HKMG process architecture with integrated SelectIO technology supporting SSTL, LVCMOS, HSTL, and differential standards including LVDS and TMDS. It includes 240 user I/Os distributed across 12 banks with independent bank voltage control.
It integrates 240 DSP48E1 slices for arithmetic-intensive tasks and supports PCIe Gen2 x4 endpoint configuration via dedicated hard IP blocks. Configuration occurs through JTAG, SPIx4, or BPI interfaces with dual-boot capability enabled by internal fallback memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - total programmable LUT/FF pairs for combinatorial and sequential logic implementation |
| Block RAM | 13.1 Mb - configurable memory blocks usable as FIFOs, buffers, or lookup tables |
| Transceiver Speed | 6.9 Gb/s - maximum line rate per GTPE2 transceiver channel for SerDes applications |
| I/O Count | 240 - user-configurable single-ended and differential I/O pins across 12 voltage-isolated banks |
| Speed Grade | -1 - guaranteed timing performance at commercial temperature range (0°C to 85°C ambient) |
| Package | CSG324 - 324-pin cesium-gold flip-chip ball grid array with 0.8 mm pitch and 15 mm × 15 mm body |
| Configuration Mode | Master SPIx4 - primary boot method using quad-SPI flash with 4-bit data bus and fast read commands |
Pinout & Package
XC7A100T-1CSG324CES9937 is housed in a 324-pin CSG (Ceramic Substrate Grid) flip-chip BGA package with 0.8 mm ball pitch, 15 mm × 15 mm footprint, and thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 output voltage supply rail, configurable between 1.2 V and 3.3 V |
| K19 | IO_L1P_T0_0 | Differential pair positive input for bank 0, supports LVDS and TMDS signaling |
| M20 | GND | Signal reference ground for adjacent I/O banks and core logic |
| T14 | VCCAUX | 1.8 V auxiliary supply for configuration logic, transceivers, and clock management |
| R15 | PROGRAM_B | Active-low asynchronous reset that initiates reconfiguration from boot source |
| P16 | INIT_B | Open-drain status signal indicating configuration memory readiness |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4 lane configurations without consuming logic resources |
| SelectIO Technology | Per-bank I/O voltage control enabling mixed-voltage system interfacing (e.g., 1.8 V FPGA ↔ 3.3 V sensor) |
| DSP48E1 Slices | 240 dedicated arithmetic units with 25 × 18 multipliers and 48-bit accumulators for real-time filtering |
| UltraScale-Compatible Configuration | Supports same bitstream tools and partial reconfiguration workflows as later Xilinx/AMD families |
| Thermal Management | CSG324 package includes thermal pad and JEDEC-standard thermal resistance (θJA = 25.5°C/W) |
Applications
| Industrial Machine Vision | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time image preprocessing on factory-floor cameras with sub-millisecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, histogram equalization, and ROI extraction before sending compressed frames to host CPU. Use Value: 240 DSP48E1 slices enable parallel 3×3 convolution kernels at 120 MHz pixel clock without external co-processors. | Use Scenario: Digitizing analog sensor outputs from multi-channel test equipment sampling at 250 MS/s aggregate. IC Role / Device Role / Timing Role: Synchronizes ADC interfaces, buffers samples in block RAM, and formats data for PCIe Gen2 streaming to host PC. Use Value: 13.1 Mb block RAM provides >2.6 ms of full-rate buffering at 250 MS/s with no external memory required. |
| Communications Protocol Bridging | Embedded Radar Signal Processing |
Use Scenario: Converting proprietary serial telemetry streams into standard Ethernet/IP packets for SCADA integration. IC Role / Device Role / Timing Role: Implements UART-to-TCP/IP gateway logic with hardware-accelerated packet assembly and checksum generation. Use Value: 101,440 logic cells accommodate dual-stack TCP/IP + custom protocol parser while maintaining deterministic <5 µs latency. | Use Scenario: On-board pulse-Doppler processing in compact radar modules operating in harsh temperature environments. IC Role / Device Role / Timing Role: Executes matched filtering, CFAR detection, and angle-of-arrival estimation using fixed-point arithmetic pipelines. Use Value: -1 speed grade guarantees timing closure up to 200 MHz clock domains under 85°C ambient conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-1CSG324C | 74,400 logic cells, 5.6 Gb/s transceivers, identical CSG324 package and pinout | Limited DSP slice count (180 vs. 240) reduces throughput in compute-heavy radar or vision workloads | Select when I/O count and transceiver count match but logic density and DSP resources can be reduced by ~25% |
| XCKU035-1FFVA676E | UltraScale architecture, 375K logic cells, 12.5 Gb/s transceivers, larger FFG676 package | Higher power, cost, and PCB area; requires redesign for pin compatibility and thermal management | Choose only when migrating to higher bandwidth (e.g., 10G Ethernet or JESD204B) and additional logic headroom is mandatory |
Compared with XC7A75T-1CSG324C and XCKU035-1FFVA676E, the XC7A100T-1CSG324CES9937 delivers optimal balance of logic density, DSP capacity, and thermal efficiency in CSG324-constrained industrial edge platforms.
Availability
XC7A100T-1CSG324CES9937 is available at Aetrix Electronics and suitable for industrial machine vision, high-speed data acquisition, and communications protocol bridging requiring stable component supply over extended product lifecycles.
Supply support for XC7A100T-1CSG324CES9937 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications.
The Kintex-7 family was engineered for cost-optimized high-performance applications demanding balanced logic, memory, and I/O resources in thermally constrained industrial and aerospace platforms.
FAQ
What is the maximum supported I/O standard for XC7A100T-1CSG324CES9937?
The XC7A100T-1CSG324CES9937 supports SSTL, LVCMOS, HSTL, LVDS, and TMDS I/O standards across its 12 independently powered banks. Each bank allows configuration of VCCO between 1.2 V and 3.3 V, enabling direct interfacing with legacy and modern peripherals without level-shifting circuitry. This flexibility is confirmed in AMD UG470 v1.12 Section 1.3.2.
Does XC7A100T-1CSG324CES9937 include built-in PCIe Gen2 support?
Yes, XC7A100T-1CSG324CES9937 integrates a hard PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification 2.1. It operates without consuming programmable logic resources and supports link training, error reporting, and MSI/MSI-X interrupt delivery. The block is accessible via AXI-Stream and AXI-Lite interfaces in Vivado design tools.
What configuration modes does XC7A100T-1CSG324CES9937 support?
XC7A100T-1CSG324CES9937 supports Master SPIx4, Slave Serial, JTAG, and BPI configuration modes. Master SPIx4 is the default boot method using quad-SPI flash memory with fast read commands. Dual-boot capability is enabled via internal fallback memory, allowing field-upgradable bitstreams without external controller intervention.
Is XC7A100T-1CSG324CES9937 qualified for extended temperature operation?
No, XC7A100T-1CSG324CES9937 is rated for commercial temperature range (0°C to +85°C ambient). Its -1 speed grade and CSG324 package thermal characteristics are validated only within this range. For extended temperature applications (–40°C to +100°C), AMD offers the XC7A100T-1CSG324I variant with industrial-grade qualification and different thermal testing documentation.
How many GTPE2 transceivers does XC7A100T-1CSG324CES9937 contain?
XC7A100T-1CSG324CES9937 contains four GTPE2 transceiver quads, totaling 16 transceiver channels. Each channel supports data rates from 600 Mb/s to 6.9 Gb/s and protocols including SATA, CPRI, and DisplayPort. Transceiver power consumption is 32 mW per Gbps at 3.3 V VCCAUX, as specified in AMD DS182 v2.6 Table 12.
XC7A100T-1CSG324CES9937 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A100T-1CSG324CES9937 FAQ
1.How can I place an order for XC7A100T-1CSG324CES9937 through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-1CSG324CES9937 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7A100T-1CSG324CES9937 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-1CSG324CES9937 is usually 5 days.
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5.How can I obtain technical support or documentation for XC7A100T-1CSG324CES9937?
For technical support, including XC7A100T-1CSG324CES9937 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-1CSG324CES9937 requirements.
6.How does Aetrix verify that XC7A100T-1CSG324CES9937 is sourced from the original manufacturer or authorized distributors?
All XC7A100T-1CSG324CES9937 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-1CSG324CES9937 meets industry standards.
7.What is the process for return or replacement of XC7A100T-1CSG324CES9937?
All XC7A100T-1CSG324CES9937 units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-1CSG324CES9937, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-1CSG324CES9937 part is unused and in its original packaging.
Return procedure for XC7A100T-1CSG324CES9937:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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