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AMD XC7A100T-1CSG324I
- Part No.:
- XC7A100T-1CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A100T-1CSG324I.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,716
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Product details
Overview
XC7A100T-1CSG324I from AMD is a Kintex-7 family FPGA with 101,440 logic cells, 13.1 Mb of block RAM, 600 DSP slices, and 400 I/O pins in a 324-pin CSG package. It operates at -1 speed grade (1.0 ns CLB delay) and supports transceivers up to 6.6 Gb/s for high-speed serial interfaces in reconfigurable computing systems.
For engineers reviewing the XC7A100T-1CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, transceiver count and rate, I/O voltage support (1.2 V to 3.3 V), thermal performance in industrial temperature range (–40°C to +100°C), and configuration interface options (JTAG, SPI, SelectMAP).
Technical Context
The XC7A100T-1CSG324I implements a heterogeneous architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It integrates 24 transceivers compliant with PCIe Gen2, SATA, and CPRI standards, each supporting data rates from 600 Mb/s to 6.6 Gb/s.
Configuration is performed via Master SPI, Slave SelectMAP, or JTAG; bitstream encryption and HMAC authentication are supported. The device uses 28 nm HKMG process technology and includes integrated analog-to-digital converter (XADC) for on-chip monitoring of temperature and supply voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Block RAM | 13.1 Mb - distributed across 360 BRAM primitives, each configurable as 36 Kb dual-port memory |
| DSP Slices | 600 - fixed-point arithmetic units supporting 25 × 18-bit multiply-accumulate with pipeline control |
| Transceivers | 24 - multi-protocol SerDes supporting PCIe Gen2 x4, SATA II/III, and CPRI up to 6.6 Gb/s |
| I/O Pins | 400 - user-configurable banks supporting LVCMOS, LVDS, SSTL, HSTL, and differential signaling standards |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under industrial temperature conditions |
| Operating Temp | –40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
The XC7A100T-1CSG324I is housed in a 324-pin CSG (Chip Scale Grid Array) package with 1.0 mm pitch, 15 × 15 mm body size, and exposed thermal pad for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, clock management, and transceiver reference circuitry |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2 V–3.3 V) enabling mixed-voltage interface interoperability |
| M0–M2 | Mode configuration pins | Determine boot source (SPI, BPI, or SelectMAP) and configuration mode at power-up |
| CCLK | Configuration clock | Input clock for master SPI configuration; frequency ≤ 50 MHz for reliable bitstream loading |
| INIT_B | Configuration status | Open-drain output indicating configuration progress and error state during startup |
Key Features
| Feature | Design Value |
|---|---|
| Integrated XADC | On-die 12-bit ADC with dual-channel sampling for real-time monitoring of die temperature and supply rail voltages |
| PCIe Gen2 Endpoint | Hard IP block supporting x1/x2/x4 lane configurations with full link training and error reporting |
| AXI Interconnect Support | Native integration with AXI4-Stream and AXI4-Lite protocols for seamless SoC interconnect with ARM-based processors |
| Bitstream Encryption | AES-256 encryption with HMAC authentication ensures secure configuration and intellectual property protection |
| Partial Reconfiguration | Enables dynamic module swapping without full device reset, reducing system downtime in mission-critical applications |
Applications
| High-Speed Data Acquisition | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time sensor fusion from multiple high-resolution cameras and analog front-ends in automated inspection systems. IC Role / Device Role / Timing Role: FPGA fabric processes pixel data pipelines, synchronizes multi-sensor triggers, and manages DMA transfers to host memory. Use Value: 400 I/O pins enable parallel camera interfaces; 24 transceivers support CoaXPress or Camera Link HS physical layers. | Use Scenario: Embedded vision processing in robotic arms requiring low-latency image preprocessing and motion coordination. IC Role / Device Role / Timing Role: Configurable logic implements custom convolution accelerators and real-time motion control state machines. Use Value: 600 DSP slices deliver >200 GOPS peak compute; -1 speed grade ensures deterministic timing for sub-millisecond loop cycles. |
| Wireless Baseband Processing | Test & Measurement Equipment |
Use Scenario: LTE and 5G NR physical layer processing in small-cell base stations with flexible waveform generation. IC Role / Device Role / Timing Role: Implements FFT/IFFT, channel coding, and digital pre-distortion using hardened DSP and memory resources. Use Value: 13.1 Mb block RAM buffers multi-frame OFDM symbols; transceivers interface directly with RFICs via JESD204B v1.1. | Use Scenario: Modular signal analyzers requiring reconfigurable digital downconversion and protocol decoding. IC Role / Device Role / Timing Role: Hosts firmware-defined signal processing chains and high-speed data capture engines. Use Value: Partial reconfiguration allows runtime switching between modulation analysis, spectrum sensing, and bus protocol emulation functions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K160T-1FFG676I | Higher logic density (162,240 LCs), larger package (676-pin FFG), 32 transceivers, higher power consumption | Better suited for multi-gigabit Ethernet aggregation or radar beamforming with wider datapaths | Select when >120k logic cells or ≥32 transceivers are required; board redesign needed due to package and power delivery changes |
| XCKU035-1FFVA676I | UltraScale architecture, 220k logic cells, 40 transceivers up to 12.5 Gb/s, DDR4 controller hard IP | Targets next-gen 10G+ networking and AI inference acceleration where bandwidth and memory subsystem matter more than cost | Choose for new designs needing PCIe Gen3/Gen4, DDR4, or higher transceiver rates; not drop-in compatible with XC7A100T-1CSG324I |
Compared with XC7A100T-1CSG324I, XC7K160T-1FFG676I offers greater resource headroom at higher cost and thermal load, while XCKU035-1FFVA676I delivers architectural advances including higher-speed transceivers and hardened memory controllers-neither is pin-compatible, but both serve adjacent performance tiers in AMD's FPGA roadmap.
Availability
XC7A100T-1CSG324I is available at Aetrix Electronics and suitable for high-speed data acquisition, industrial machine vision, wireless baseband processing, and test & measurement equipment requiring stable component supply across extended temperature ranges.
Supply support for XC7A100T-1CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in CPUs, GPUs, and adaptive SoCs.
The Kintex-7 family, including XC7A100T-1CSG324I, was designed for cost-optimized, high-bandwidth applications such as wired communications, video processing, and industrial automation where balanced logic, memory, and I/O resources are critical.
FAQ
What is the maximum transceiver data rate supported by XC7A100T-1CSG324I?
The XC7A100T-1CSG324I supports transceiver line rates from 600 Mb/s up to 6.6 Gb/s. This enables compliance with PCIe Gen2, SATA III, and CPRI standards. Each of its 24 transceivers can be independently configured within this range, and the device includes built-in clock data recovery (CDR) and elastic buffers for jitter tolerance in high-speed serial links.
Does XC7A100T-1CSG324I support partial reconfiguration?
Yes, XC7A100T-1CSG324I supports partial reconfiguration through Vivado Design Suite tools. This capability allows specific logical regions of the FPGA fabric to be updated dynamically without resetting the entire device. It is used in applications like protocol switching in test equipment or adaptive filtering in communication systems where continuous operation is essential.
What configuration modes are available for XC7A100T-1CSG324I?
XC7A100T-1CSG324I supports three primary configuration modes: Master SPI (using internal oscillator), Slave SelectMAP (parallel interface with external processor), and JTAG (for debugging and programming). Mode selection is controlled by M0–M2 pins at power-up, and all modes support bitstream encryption and HMAC authentication for secure deployment.
Is XC7A100T-1CSG324I qualified for industrial temperature operation?
Yes, XC7A100T-1CSG324I is rated for industrial temperature operation from –40°C to +100°C. This qualification applies to the -1 speed grade variant in the CSG324 package and includes full timing guarantees and reliability testing per JEDEC standards. Thermal design must account for the exposed thermal pad and recommended PCB copper pour layout.
What I/O standards does XC7A100T-1CSG324I support?
XC7A100T-1CSG324I supports a wide range of I/O standards including LVCMOS (1.2 V to 3.3 V), LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, and differential signaling variants. Each of its 400 user I/O pins is grouped into banks with independent VCCO supplies, allowing mixed-voltage operation and interoperability with diverse peripheral interfaces on the same PCB.
XC7A100T-1CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A100T-1CSG324I FAQ
1.How can I place an order for XC7A100T-1CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-1CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-1CSG324I reliable?
The price and inventory of XC7A100T-1CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-1CSG324I is usually 5 days.
3.What payment methods are accepted for XC7A100T-1CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-1CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-1CSG324I?
XC7A100T-1CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-1CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-1CSG324I?
For technical support, including XC7A100T-1CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-1CSG324I requirements.
6.How does Aetrix verify that XC7A100T-1CSG324I is sourced from the original manufacturer or authorized distributors?
All XC7A100T-1CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-1CSG324I meets industry standards.
7.What is the process for return or replacement of XC7A100T-1CSG324I?
All XC7A100T-1CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-1CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-1CSG324I part is unused and in its original packaging.
Return procedure for XC7A100T-1CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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