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AMD XC7A100T-1FGG676C
- Part No.:
- XC7A100T-1FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7A100T-1FGG676C.pdf
- Description:
- IC FPGA 300 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,393
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Product details
Overview
XC7A100T-1FGG676C from AMD (formerly Xilinx) is a Kintex-7 FPGA featuring 101,440 logic cells, 600 DSP slices, 14.4 Mb of block RAM, and support for DDR3 memory interfaces up to 800 MHz. It is packaged in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch and operates at -1 speed grade (1.0 ns CLB delay).
For engineers reviewing the XC7A100T-1FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver capability (16 GTP transceivers up to 3.75 Gb/s), thermal design power (12.5 W typical), and industrial temperature range (-40°C to +100°C junction).
Technical Context
The XC7A100T-1FGG676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It integrates hardened IP including PCIe Gen2 x4 endpoint, Gigabit Ethernet MAC, and clock management tiles with MMCM and PLL.
It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling (LVDS, TMDS, RSDS) across its 400 user I/O pins. Configuration is performed via JTAG, SPIx4, or BPI parallel modes using external flash or processor-controlled initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - determines maximum combinational/sequential logic capacity for RTL implementation |
| DSP Slices | 600 - enables high-throughput arithmetic operations for filtering, FFT, and math-intensive algorithms |
| Block RAM | 14.4 Mb - provides on-chip memory for data buffering, FIFOs, and lookup tables without external memory |
| User I/O Pins | 400 - supports wide parallel interfaces, multi-channel ADC/DAC control, and high-pin-count peripheral expansion |
| GTP Transceivers | 16 × 3.75 Gb/s - delivers serial connectivity for camera links, JESD204B, and custom high-speed protocols |
| Speed Grade | -1 - specifies timing closure margin; CLB propagation delay ≤ 1.0 ns under worst-case conditions |
| Operating Temp | -40°C to +100°C - qualifies for industrial and extended-temperature embedded deployments |
Pinout & Package
XC7A100T-1FGG676C is housed in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm ball pitch, 27 × 27 mm body size, and thermal lid. The package supports standard reflow profiles and requires controlled impedance PCB routing for high-speed I/O and transceivers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, SelectIO banks, and transceiver analog circuitry |
| VCCO | I/O bank power | Programmable voltage per bank (1.2–3.3V) enabling mixed-voltage interface compatibility |
| M0–M2 | Configuration mode pins | Determine boot source (JTAG, SPI, BPI) and configuration width during power-up |
| CCLK | Configuration clock | Drives internal configuration state machine; may be internally generated or externally supplied |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration progress and error detection |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x4 Endpoint | Hardened root port or endpoint logic eliminates soft-core resource usage and guarantees timing compliance |
| MMCM + PLL Clock Management | Enables precise clock synthesis, phase shifting, and jitter reduction across multiple domains |
| SelectIO Technology | Supports 21 I/O standards with programmable drive strength, slew rate, and termination for signal integrity |
| Partial Reconfiguration Support | Allows dynamic module swapping without full device reset-critical for runtime adaptability |
| AXI Interconnect Infrastructure | Integrated high-performance interconnect for connecting processors, peripherals, and accelerators in SoC-style designs |
Applications
| High-Speed Data Acquisition | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time digitization and preprocessing of multi-channel sensor streams from radar or LIDAR systems. IC Role / Device Role / Timing Role: FPGA fabric performs time-critical signal conditioning, windowing, and FFT acceleration before host transfer. Use Value: 600 DSP slices and 14.4 Mb block RAM enable on-the-fly spectral analysis without off-chip memory bottlenecks. | Use Scenario: Synchronization and pixel processing across multiple CMOS image sensors in factory automation cameras. IC Role / Device Role / Timing Role: XC7A100T-1FGG676C acts as a timing controller and image pipeline accelerator with MIPI CSI-2 receiver logic. Use Value: 400 user I/Os and 16 GTP transceivers support concurrent high-bandwidth sensor inputs and frame buffer streaming. |
| Communications Baseband Processing | Test & Measurement Equipment |
Use Scenario: Modem subsystem in small-cell wireless infrastructure requiring adaptive filtering and channel coding. IC Role / Device Role / Timing Role: Implements LTE/NR physical layer functions including turbo decoding, OFDM modulation, and MIMO precoding. Use Value: Hardened PCIe Gen2 x4 interface enables low-latency host communication for real-time parameter updates and diagnostics. | Use Scenario: Digital sampling front-end in oscilloscopes and protocol analyzers with deep memory buffers. IC Role / Device Role / Timing Role: Manages high-speed ADC capture, trigger logic, and waveform compression before storage or display. Use Value: -1 speed grade ensures deterministic timing for sub-nanosecond trigger resolution and sample alignment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A100T-2FGG676I | Faster speed grade (-2) with 0.9 ns CLB delay; higher static power and tighter voltage tolerance | Better suited for designs requiring higher clock frequencies or stricter timing margins | Select XC7A100T-2FGG676I only when timing closure fails at -1 grade or when >200 MHz system clocks are required |
| XC7A75T-1FGG676C | Reduced resources: 75,520 logic cells, 420 DSP slices, 10.8 Mb block RAM, same package and speed grade | Lower gate count limits complex algorithm partitioning and multi-channel parallelism | Choose XC7A75T-1FGG676C where cost sensitivity outweighs resource headroom and transceiver count |
Compared with XC7A100T-1FGG676C, the -2 speed grade offers tighter timing but increases power and cost, while the XC7A75T-1FGG676C reduces logic and memory capacity without changing footprint-making it suitable for scaled-down implementations where full XC7A100T resources are unused.
Availability
XC7A100T-1FGG676C is available at Aetrix Electronics and suitable for high-speed data acquisition, industrial machine vision, and communications baseband processing requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7A100T-1FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Kintex-7 family, including XC7A100T-1FGG676C, was designed for cost-optimized high-performance applications demanding balanced logic, DSP, memory, and I/O resources in industrial, aerospace, and communications systems.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7A100T-1FGG676C?
XC7A100T-1FGG676C supports DDR3 SDRAM interfaces up to 800 MHz data rate (400 MHz clock frequency) using its integrated Memory Interface Generator (MIG) core. This capability is validated across all I/O banks compatible with SSTL15 standards and requires proper PCB layout adherence to Xilinx UG586 guidelines for signal integrity and timing closure.
Does XC7A100T-1FGG676C include built-in PCIe Gen2 support?
Yes, XC7A100T-1FGG676C integrates a hardened PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification 2.1. It supports both root port and endpoint configurations, requires no additional logic resources, and delivers deterministic latency for high-reliability host communication in embedded systems.
What configuration modes are supported by XC7A100T-1FGG676C?
XC7A100T-1FGG676C supports JTAG, Master SPI (x1/x2/x4), and Master BPI (x16) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Bitstream loading can also be initiated via ICAP or PCIe after initial configuration, enabling partial reconfiguration and remote updates.
Is XC7A100T-1FGG676C qualified for industrial temperature operation?
Yes, XC7A100T-1FGG676C is rated for industrial temperature range with junction operating temperature from -40°C to +100°C. This qualification applies to the C-grade device and is verified per Xilinx DS182 specification, making it suitable for deployment in uncontrolled environments such as factory floors and outdoor equipment enclosures.
How many GTP transceivers does XC7A100T-1FGG676C provide, and what is their maximum data rate?
XC7A100T-1FGG676C includes 16 GTP transceivers, each capable of operation up to 3.75 Gb/s. These transceivers support protocols including CPRI, Aurora, and custom serial links, and are electrically compatible with JESD204B subclass 0/1 for high-speed data converter interfacing.
XC7A100T-1FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC7A100T-1FGG676C FAQ
1.How can I place an order for XC7A100T-1FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-1FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-1FGG676C reliable?
The price and inventory of XC7A100T-1FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-1FGG676C is usually 5 days.
3.What payment methods are accepted for XC7A100T-1FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-1FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-1FGG676C?
XC7A100T-1FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-1FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-1FGG676C?
For technical support, including XC7A100T-1FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-1FGG676C requirements.
6.How does Aetrix verify that XC7A100T-1FGG676C is sourced from the original manufacturer or authorized distributors?
All XC7A100T-1FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-1FGG676C meets industry standards.
7.What is the process for return or replacement of XC7A100T-1FGG676C?
All XC7A100T-1FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-1FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-1FGG676C part is unused and in its original packaging.
Return procedure for XC7A100T-1FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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