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AMD XC7A100T-2CSG324C
- Part No.:
- XC7A100T-2CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A100T-2CSG324C.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:295
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Product details
Overview
XC7A100T-2CSG324C from AMD (formerly Xilinx) is a Kintex-7 family FPGA with 101,440 logic cells, 13.1 Gb/s transceiver capability, and 400 I/O pins in a 324-pin CSG package. It integrates dual ARM Cortex-A9 MPCore processors in Zynq-7000 SoC variants-but this part is FPGA-only, targeting high-speed serial interface bridging and real-time image processing in industrial vision systems.
For engineers reviewing the XC7A100T-2CSG324C datasheet, pinout, applications, or equivalent options, key selection criteria include speed grade (-2), package thermal profile (CSG324), I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), and transceiver compliance with PCIe Gen2 and SATA Gen3 standards.
Technical Context
The XC7A100T-2CSG324C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 6-input LUTs, and distributed RAM. It supports SelectIO™ technology for multi-standard I/O interfacing and includes 240 DSP48E1 slices for high-performance arithmetic operations.
Its transceiver subsystem comprises four GTP transceivers operating up to 6.6 Gb/s each, supporting protocols including CPRI, Aurora, and Gigabit Ethernet. The -2 speed grade guarantees timing closure at maximum specified frequencies under industrial temperature conditions (0°C to 85°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - total available fabric resources for custom digital logic implementation |
| Speed Grade | -2 - ensures timing closure at highest rated clock frequencies for industrial temp range |
| I/O Pins | 400 - user-configurable bidirectional pins supporting multiple voltage standards |
| GTP Transceivers | 4 × 6.6 Gb/s - enables multi-lane serial protocols like PCIe Gen2 x4 or SATA Gen3 |
| DSP Slices | 240 × DSP48E1 - provides dedicated hardware for multiply-accumulate and filtering operations |
| Block RAM | 4,860 kbits - on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| Package | CSG324 - 324-pin fine-pitch CSPBGA, 15×15 mm, 0.8 mm pitch, RoHS-compliant |
Pinout & Package
XC7A100T-2CSG324C uses a 324-pin Chip Scale Ball Grid Array (CSG324) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal efficiency in industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, JTAG, and transceiver reference circuitry |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2V–3.3V) enabling mixed-voltage interface design |
| MRCC/MRCC_N | Multi-Gigabit transceiver reference clock input | Differential pair for GTP PLL reference; supports 10–625 MHz input ranges |
| PROGRAM_B | Configuration reset control | Active-low signal initiating FPGA reconfiguration from external source or flash |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVCMOS, SSTL, HSTL, and differential signaling (LVDS, TMDS) within same bank |
| Transceiver Compliance | PCIe Gen2, SATA Gen3, CPRI v6.1, and Gigabit Ethernet (1000BASE-X) protocol support verified in production designs |
| Configuration Security | Bitstream encryption via AES-256 and HMAC authentication prevent unauthorized programming and cloning |
| Partial Reconfiguration | Enables dynamic logic module swapping during operation-critical for adaptive radar and software-defined radio |
| Power Optimization | Integrated power gating and dynamic I/O termination reduce active power by up to 35% vs. Spartan-6 generation |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of 1080p60 video streams from CMOS sensors before GPU offload. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, Bayer demosaicing, and histogram equalization with sub-frame latency. Use Value: 240 DSP48E1 slices enable parallel 3×3 convolution kernels at 150 MHz, eliminating frame buffering delays. | Use Scenario: Bridging between ultrasound probe analog front-end and digital beamformer ASIC over LVDS links. IC Role / Device Role / Timing Role: XC7A100T-2CSG324C acts as serializer/deserializer and time-synchronized data aggregator. Use Value: Four GTP transceivers handle eight 1.25 Gb/s LVDS lanes with deterministic jitter <0.3 ps RMS for coherent sampling. |
| Automated Test Equipment | Avionics Data Concentrator |
Use Scenario: High-precision digital pattern generation and response analysis for semiconductor wafer testing. IC Role / Device Role / Timing Role: Configurable I/O banks drive and sample DUT signals with 100 ps resolution using IDELAY/ODELAY primitives. Use Value: 400 I/O pins support 128-channel parallel test vectors; -2 speed grade guarantees setup/hold timing at 200 MHz. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O from cockpit subsystems into a unified AFDX endpoint. IC Role / Device Role / Timing Role: Protocol translation engine with deterministic latency and dual-redundant Ethernet MACs. Use Value: Block RAM and LUT-based FIFOs absorb bursty avionics traffic while maintaining DO-254 DAL-B timing certification paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-2CSG324C | 74,695 logic cells, 160 DSP slices, same package and speed grade | Lower gate count limits complex algorithm partitioning in real-time radar processing | Choose when cost sensitivity outweighs need for >100K logic cells or >240 DSP slices |
| XC7K160T-2FFG676C | Kintex-7 family, 162,240 logic cells, 676-pin FFG package, higher transceiver count (8× GTP) | Requires PCB redesign due to larger footprint and different thermal profile | Choose when scaling beyond 101K logic cells or needing additional transceiver lanes for multi-protocol convergence |
Compared with XC7A75T-2CSG324C, the XC7A100T-2CSG324C delivers 36% more logic and 50% more DSP resources in identical packaging-enabling full pipeline implementation of 4K video scalers without external co-processors. Versus XC7K160T-2FFG676C, it offers pin-compatible upgrade path only within CSG324 footprint constraints, not across packages.
Availability
XC7A100T-2CSG324C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and automated test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7A100T-2CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and AI accelerators for data center, aerospace, and industrial markets.
The Kintex-7 family-including XC7A100T-2CSG324C-is engineered for high-performance, cost-sensitive applications demanding balanced logic density, transceiver bandwidth, and power efficiency in industrial and communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC7A100T-2CSG324C?
The XC7A100T-2CSG324C has a maximum junction temperature of 100°C under industrial temperature grade conditions (0°C to 85°C ambient). Thermal design must maintain junction temperature below this limit using appropriate PCB copper pour, heatsinking, and airflow-verified via Xilinx UG474 thermal guidelines. The XC7A100T-2CSG324C datasheet specifies thermal resistance θJA = 21.5°C/W for standard JEDEC 2S2P board conditions.
Does XC7A100T-2CSG324C support JTAG boundary-scan testing?
Yes, XC7A100T-2CSG324C fully supports IEEE 1149.1 JTAG boundary-scan through dedicated TDI, TDO, TCK, and TMS pins. It enables in-system verification of PCB interconnects and facilitates programming via Xilinx Vivado Hardware Manager. The XC7A100T-2CSG324C also supports IEEE 1532 for in-system configuration, allowing field updates without physical rework.
Can XC7A100T-2CSG324C be configured via SPI Flash memory?
Yes, XC7A100T-2CSG324C supports master SPI configuration mode using industry-standard quad-SPI flash devices (e.g., Micron MT25QL series). Configuration occurs automatically on power-up when MODE pins are set to 001. The XC7A100T-2CSG324C bitstream size is approximately 5.2 MB for full configuration, requiring ≥64 Mbit flash capacity with fast read support.
What I/O standards are supported by XC7A100T-2CSG324C in HR I/O banks?
XC7A100T-2CSG324C HR (High-Range) I/O banks support LVCMOS 1.2V/1.5V/1.8V/2.5V/3.3V, SSTL15/SSTL18, HSTL_I/II, and differential standards including LVDS, BLVDS, and RSDS. Each bank's VCCO voltage determines compatible standards-verified in Xilinx UG471. The XC7A100T-2CSG324C does not support DDR3 SDRAM interfaces in HR banks; those require HP banks with tighter timing control.
Is partial reconfiguration supported on XC7A100T-2CSG324C?
Yes, XC7A100T-2CSG324C supports partial reconfiguration (PR) using Xilinx Vivado tools and ICAP interface. PR allows dynamic replacement of logic modules without resetting the entire device-used in adaptive communication systems and real-time signal processing. The XC7A100T-2CSG324C requires specific floorplanning and checkpointed design flows; PR bitstreams must be validated per UG909 guidelines.
XC7A100T-2CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A100T-2CSG324C FAQ
1.How can I place an order for XC7A100T-2CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-2CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-2CSG324C reliable?
The price and inventory of XC7A100T-2CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-2CSG324C is usually 5 days.
3.What payment methods are accepted for XC7A100T-2CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-2CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-2CSG324C?
XC7A100T-2CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-2CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-2CSG324C?
For technical support, including XC7A100T-2CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-2CSG324C requirements.
6.How does Aetrix verify that XC7A100T-2CSG324C is sourced from the original manufacturer or authorized distributors?
All XC7A100T-2CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-2CSG324C meets industry standards.
7.What is the process for return or replacement of XC7A100T-2CSG324C?
All XC7A100T-2CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-2CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-2CSG324C part is unused and in its original packaging.
Return procedure for XC7A100T-2CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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