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AMD XC7A100T-2FGG676CES9937
- Part No.:
- XC7A100T-2FGG676CES9937
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7A100T-2FGG676CES9937.pdf
- Description:
- IC FPGA 300 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,286
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Product details
Overview
XC7A100T-2FGG676CES9937 from AMD is a Kintex-7 FPGA featuring 101,440 logic cells, 12.5 Gb/s transceiver capability, and 676-pin Fine-Pitch BGA (FPGA) package with -2 speed grade. It integrates 480 DSP slices, 6.9 Mb of block RAM, and supports PCIe Gen2 x8 endpoint functionality in high-reliability industrial control systems.
For engineers reviewing the XC7A100T-2FGG676CES9937 datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, I/O bank voltage support (1.2 V to 3.3 V), thermal performance under sustained 1.0 W/mm² power density, and configuration interface compatibility with SPIx4 or SelectMAP.
Technical Context
The XC7A100T-2FGG676CES9937 implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated MGTs supporting 600 Mb/s to 12.5 Gb/s serial protocols. It includes dual 32-bit AXI interconnects and hardened PCIe Gen2 endpoint logic.
Configuration is performed via Master SPI or Slave SelectMAP mode using external flash or processor-controlled parallel interface. The device supports JTAG boundary-scan (IEEE 1149.1) and partial reconfiguration through ICAP interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Block RAM | 6.9 Mb - distributed as 36 Kb BRAM primitives usable as memory, FIFO, or shift register |
| DSP Slices | 480 - each supports 25 × 18-bit multiply-accumulate with pre-adder and pipeline registers |
| Transceiver Speed | 12.5 Gb/s - maximum line rate per GTPE2 channel, supporting CPRI, SATA, and PCIe Gen2 |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports mixed-voltage operation across 12 I/O banks (1.2 V to 3.3 V) |
| Configuration Interface | Master SPI x4 / Slave SelectMAP - enables boot from quad-SPI flash or parallel configuration by host processor |
| Speed Grade | -2 - guarantees timing closure at 1.0 ns clock-to-out and 0.8 ns setup/hold margins for critical paths |
Pinout & Package
XC7A100T-2FGG676CES9937 is housed in a 676-ball Fine-Pitch Ball Grid Array (FPGA) package with 0.8 mm pitch, 27 × 27 array, and thermal-enhanced epoxy mold compound. Package dimensions are 27 mm × 27 mm × 2.33 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multi-Function I/O | Configurable as GPIO, SDIO, UART, SPI, I2C, or CAN controller pins for PS-side peripheral interfacing |
| HR Bank 13–16 | High-Range I/O Bank | Supports 1.8 V/2.5 V/3.3 V signaling with up to 1,080 Mbps DDR3 data rates |
| HP Bank 32–35 | High-Performance I/O Bank | Supports 1.2 V/1.35 V/1.5 V signaling with sub-1 ns skew for DDR3/DDR4 memory interfaces |
| GTPE2_CLK0/1 | Transceiver Reference Clock Input | Dedicated differential inputs for 100 MHz to 800 MHz reference clocks driving GTPE2 transceivers |
| CCLK, INIT_B, DONE | Configuration Control | Master SPI configuration handshake signals; DONE indicates successful bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Endpoint Hard IP | Integrated endpoint logic eliminates need for soft-core PCIe controllers and reduces design verification effort |
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reset, critical for runtime-adaptive signal processing |
| AXI Interconnect Fabric | Dual 32-bit AXI4-Lite and AXI4-Stream interfaces simplify integration with ARM Cortex-A9 processor subsystem |
| UltraScale-Compatible Toolflow | Uses Vivado Design Suite v2018.2+ with identical synthesis, place-and-route, and debug workflows as newer families |
| Industrial Temperature Range | Operates reliably from –40 °C to +100 °C junction temperature, validated per AEC-Q100 Class 2 requirements |
Applications
| Industrial Motor Drive Controller | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis synchronization and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA fabric executes position loop algorithms, PWM generation, and safety monitoring logic with deterministic <1 µs latency. Use Value: 480 DSP slices enable simultaneous 16-channel motor current estimation; HR I/O banks interface directly to isolated ADCs and gate drivers. | Use Scenario: High-throughput CT/MRI raw data aggregation from 64+ analog front-end channels before compression and transfer. IC Role / Device Role / Timing Role: Acts as real-time data concentrator and preprocessing engine with parallel 12-bit ADC sampling at 40 MSPS per channel. Use Value: 6.9 Mb block RAM buffers 2.1 seconds of uncompressed 16-bit data; GTPE2 transceivers stream to host GPU over PCIe Gen2 x8. |
| Avionics Sensor Fusion Unit | 5G Remote Radio Head (RRH) |
Use Scenario: Time-synchronized fusion of inertial, GPS, and vision sensor streams in DO-254-compliant flight control hardware. IC Role / Device Role / Timing Role: Implements IEEE 1588 PTP timestamping, Kalman filter acceleration, and ARINC 429/664 interface bridging. Use Value: -2 speed grade ensures sub-5 ns jitter on 100 MHz PTP clocks; MIO pins route dual CAN FD and MIL-STD-1553B buses. | Use Scenario: Digital predistortion (DPD) and crest factor reduction (CFR) processing in active antenna systems with 4×4 MIMO. IC Role / Device Role / Timing Role: Hosts real-time DPD coefficient update engine and CFR lookup tables with 12.5 Gb/s JESD204B interface to RF DACs. Use Value: 101,440 logic cells accommodate dual 12-tap DPD engines; HP I/O banks drive DDR3 memory at 1,066 MHz for coefficient storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system-on-module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, 215K logic cells, 16.3 Gb/s transceivers, higher static power | Targets higher-bandwidth 5G baseband and radar beamforming where XC7A100T-2FGG676CES9937 lacks sufficient DSP throughput | Select when >200 GOPS fixed-point compute or >20 Gb/s aggregate serial bandwidth is required |
| XC7K160T-2FFG676C | Same Kintex-7 family, 162K logic cells, identical -2 speed grade and 676-pin FGG package | Used where larger logic capacity is needed for multi-protocol gateway functions without changing PCB layout | Drop-in upgrade path if additional CLBs or BRAM are required post-design validation |
Compared with XC7A100T-2FGG676CES9937, XCKU035-2FFVA676E delivers higher serial bandwidth and compute density at increased cost and power, while XC7K160T-2FFG676C offers direct pin-compatible scalability within the same footprint and thermal envelope.
Availability
XC7A100T-2FGG676CES9937 is available at Aetrix Electronics and suitable for industrial motor drives, medical imaging subsystems, avionics sensor hubs, and 5G remote radio heads requiring stable component supply across extended product lifecycles.
Supply support for XC7A100T-2FGG676CES9937 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Kintex-7 family targets high-performance, cost-sensitive applications such as wireless infrastructure, video processing, and industrial automation, balancing logic capacity, transceiver bandwidth, and power efficiency.
FAQ
What is the maximum supported transceiver line rate for XC7A100T-2FGG676CES9937?
The XC7A100T-2FGG676CES9937 supports a maximum transceiver line rate of 12.5 Gb/s per GTPE2 channel. This enables compliance with PCIe Gen2, CPRI Option 3, and SATA III standards. The actual achievable rate depends on board layout quality, reference clock stability, and signal integrity margin. XC7A100T-2FGG676CES9937 requires external 100 MHz or 156.25 MHz reference clocks for full-rate operation.
Does XC7A100T-2FGG676CES9937 support partial reconfiguration?
Yes, XC7A100T-2FGG676CES9937 supports partial reconfiguration through its ICAP (Internal Configuration Access Port) interface. This allows dynamic swapping of logic modules without resetting the entire device. XC7A100T-2FGG676CES9937 requires Vivado Design Suite v2015.4 or later and proper floorplanning to define reconfigurable partitions. Verified use cases include adaptive filtering and protocol switching in medical and aerospace systems.
What configuration modes are supported by XC7A100T-2FGG676CES9937?
XC7A100T-2FGG676CES9937 supports Master SPI (x1/x2/x4), Slave SelectMAP (x8/x16), and JTAG configuration modes. Master SPI is most common for standalone boot from quad-SPI flash. XC7A100T-2FGG676CES9937 also supports fallback configuration and multi-boot via external M[2:0] pins. Configuration security features include AES-256 bitstream encryption and HMAC authentication.
Is XC7A100T-2FGG676CES9937 qualified for automotive applications?
XC7A100T-2FGG676CES9937 is not AEC-Q100 qualified, but it meets industrial temperature range (–40 °C to +100 °C) and has been deployed in automotive test equipment and ADAS prototyping platforms. XC7A100T-2FGG676CES9937 does not carry automotive-specific reliability certifications such as PPAP or ISO/TS 16949 process compliance. For production automotive ECUs, AMD recommends the XA series derivatives.
What is the I/O voltage range supported by XC7A100T-2FGG676CES9937?
XC7A100T-2FGG676CES9937 supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. HR (High-Range) banks support 1.8 V/2.5 V/3.3 V standards including SSTL18, SSTL15, and HSTL_I, while HP (High-Performance) banks support 1.2 V/1.35 V/1.5 V for DDR3/DDR4 memory interfaces. XC7A100T-2FGG676CES9937 requires separate VCCO supplies per bank.
XC7A100T-2FGG676CES9937 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC7A100T-2FGG676CES9937 FAQ
1.How can I place an order for XC7A100T-2FGG676CES9937 through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-2FGG676CES9937 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-2FGG676CES9937 reliable?
The price and inventory of XC7A100T-2FGG676CES9937 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-2FGG676CES9937 is usually 5 days.
3.What payment methods are accepted for XC7A100T-2FGG676CES9937?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-2FGG676CES9937 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-2FGG676CES9937?
XC7A100T-2FGG676CES9937 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-2FGG676CES9937 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-2FGG676CES9937?
For technical support, including XC7A100T-2FGG676CES9937 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-2FGG676CES9937 requirements.
6.How does Aetrix verify that XC7A100T-2FGG676CES9937 is sourced from the original manufacturer or authorized distributors?
All XC7A100T-2FGG676CES9937 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-2FGG676CES9937 meets industry standards.
7.What is the process for return or replacement of XC7A100T-2FGG676CES9937?
All XC7A100T-2FGG676CES9937 units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-2FGG676CES9937, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-2FGG676CES9937 part is unused and in its original packaging.
Return procedure for XC7A100T-2FGG676CES9937:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7A100T-2FGG676CES9937 Tags
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