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AMD XC7A100T-2FGG676I
- Part No.:
- XC7A100T-2FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7A100T-2FGG676I.pdf
- Description:
- IC FPGA 300 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,055
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Product details
Overview
XC7A100T-2FGG676I from AMD is a Kintex-7 family FPGA with 101,440 logic cells, 13.1 GMACs of DSP performance, and 4.5 Mb of block RAM. It features 400 I/O pins in a 676-pin FCBGA package and supports transceivers up to 6.6 Gb/s. It is used in high-throughput industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7A100T-2FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver speed, logic cell density, block RAM capacity, and thermal performance under sustained operation.
Technical Context
The XC7A100T-2FGG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 18×25 DSP slices, and 240 dedicated transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. Its I/O bank structure supports multiple voltage standards including LVDS, SSTL, and HSTL.
It integrates dual 32-bit AXI interconnects, supports JTAG and SelectMAP configuration modes, and includes built-in analog-to-digital converter (XADC) for on-chip monitoring of temperature and supply voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 240 - enables parallel multiply-accumulate operations at up to 400 MHz for filtering and FFT workloads |
| Block RAM | 4.5 Mb - supports large on-chip data buffering and FIFO construction without external memory |
| Transceiver Speed | 6.6 Gb/s - meets line rates for PCIe Gen2 x4 and SATA III interfaces |
| I/O Pins | 400 - provides scalable connectivity for sensor arrays, memory interfaces, and high-speed serial links |
| Package | 676-pin FCBGA (27×27 mm, 1.0 mm pitch) - enables high-density routing and thermal dissipation in compact PCB layouts |
Pinout & Package
XC7A100T-2FGG676I is housed in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 27×27 array, 1.0 mm ball pitch, and thermal lid. Pin functions are organized into 12 I/O banks, each supporting independent VCCO and VREF settings.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | MRCC_L15P | Dedicated multi-gigabit transceiver reference clock input (positive) for bank 15 |
| H18 | MRCC_L15N | Dedicated multi-gigabit transceiver reference clock input (negative) for bank 15 |
| A14 | IO_L1P_T0_0 | Configurable single-ended or differential I/O in bank 0, supports LVCMOS18/LVDS |
| B14 | IO_L1N_T0_0 | Complementary I/O pair for differential signaling in bank 0 |
| T19 | VCCINT | Core logic supply (1.0V ±3%) - requires low-noise regulation and local decoupling |
| U19 | GND | Core ground plane connection - critical for signal integrity and power return path |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping during runtime without full device reset |
| XADC Integration | On-die 12-bit ADC monitors die temperature and 4 supply rails with ±2% accuracy |
| PCIe Gen2 Endpoint | Hard IP block supports x1/x2/x4 lane configurations with integrated PHY and link training |
| AXI Interconnect | Dual 32-bit AXI4-Lite and AXI4-Stream interfaces simplify SoC integration with ARM processors or soft cores |
| Configuration Security | Bitstream encryption via AES-256 and HMAC authentication prevent unauthorized programming and cloning |
Applications
| Industrial Machine Vision | Medical Ultrasound Beamforming |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction from high-frame-rate CMOS sensors. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level convolution and histogram equalization; transceivers interface with sensor bridges. Use Value: 101,440 logic cells and 240 DSP slices enable sub-millisecond latency for edge inference pipelines. | Use Scenario: Digital beam synthesis and echo signal processing in portable ultrasound systems. IC Role / Device Role / Timing Role: XC7A100T-2FGG676I performs channel alignment, FIR filtering, and envelope detection using dedicated DSP slices. Use Value: 6.6 Gb/s transceivers support high-bandwidth data transfer from ADC front-ends while maintaining deterministic timing. |
| Avionics Data Concentrators | Test & Measurement Equipment |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control units. IC Role / Device Role / Timing Role: Configurable I/O banks interface with legacy avionics buses; AXI interconnect routes data to PowerPC or ARM host. Use Value: 400 I/O pins and multi-standard I/O support eliminate need for external level shifters or bus translators. | Use Scenario: High-resolution waveform generation and real-time spectral analysis in modular PXI platforms. IC Role / Device Role / Timing Role: XC7A100T-2FGG676I implements digital downconverters and FFT engines synchronized to precision clock sources. Use Value: 4.5 Mb block RAM buffers multi-channel time-domain samples for coherent averaging and harmonic analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A100T-1FGG676I | Slower speed grade (-1 vs -2): max I/O toggle rate 1.25 Gb/s vs 1.33 Gb/s; lower static power | Suitable for cost-sensitive designs where transceiver bandwidth < 6.0 Gb/s is acceptable | Select when PCIe Gen2 x4 or SATA III line rates are not required |
| XC7K160T-2FBG676I | Kintex-7 family upgrade: 162,240 logic cells, 360 DSP slices, same package footprint and pinout | Required for higher gate count or additional transceiver lanes in next-gen systems | Choose for scalability path without PCB redesign if future logic expansion is anticipated |
Compared with XC7A100T-2FGG676I, the -1 speed grade trades transceiver performance for lower power, while the XC7K160T-2FBG676I offers direct pin-compatible headroom in logic and DSP resources-both retain identical I/O banking and configuration interface compatibility.
Availability
XC7A100T-2FGG676I is available at Aetrix Electronics and suitable for industrial imaging, medical diagnostics, and avionics subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC7A100T-2FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications through its Xilinx product portfolio.
The Kintex-7 family, including XC7A100T-2FGG676I, was designed for high-performance, cost-optimized applications demanding balanced logic, DSP, and I/O resources in aerospace, test equipment, and real-time video systems.
FAQ
What is the maximum transceiver data rate supported by XC7A100T-2FGG676I?
The XC7A100T-2FGG676I supports transceiver line rates up to 6.6 Gb/s per lane. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA III (6.0 Gb/s), and SRIO Gen2 (5.0 GT/s) standards. The transceiver architecture includes built-in clock data recovery (CDR) and programmable equalization to maintain signal integrity across PCB traces and connectors.
Does XC7A100T-2FGG676I include on-chip analog monitoring capability?
Yes, XC7A100T-2FGG676I integrates the XADC (Xilinx Analog-to-Digital Converter), a dual 12-bit ADC that monitors internal die temperature and four external supply voltages (VCCINT, VCCAUX, VCCBRAM, and VCCO). It delivers ±2% measurement accuracy and supports alarm thresholds and periodic sampling without external components.
What configuration modes are supported by XC7A100T-2FGG676I?
XC7A100T-2FGG676I supports JTAG, Master SPI, Slave SPI, and SelectMAP configuration modes. JTAG is used for debugging and boundary-scan testing; SPI modes enable fast, space-efficient bitstream loading from flash memory; SelectMAP allows high-speed parallel configuration via microprocessor or ASIC interface.
Is XC7A100T-2FGG676I compatible with other Kintex-7 FPGAs in the same package?
XC7A100T-2FGG676I shares the FGG676 package with several Kintex-7 devices, including XC7K70T and XC7K160T variants. While pinout is identical across the FGG676 footprint, I/O bank assignments and dedicated resource placement (e.g., transceivers, clocks) differ. Full functional compatibility requires verification against specific design constraints and resource utilization.
What thermal management guidance applies to XC7A100T-2FGG676I in continuous operation?
XC7A100T-2FGG676I has a maximum junction temperature of 100°C and requires a thermal solution capable of dissipating up to 12.5 W under worst-case operating conditions. AMD recommends a 4-layer PCB with internal ground/power planes, thermal vias under the package, and a heatsink rated for ≥15°C/W in still air environments.
XC7A100T-2FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC7A100T-2FGG676I FAQ
1.How can I place an order for XC7A100T-2FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-2FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-2FGG676I reliable?
The price and inventory of XC7A100T-2FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-2FGG676I is usually 5 days.
3.What payment methods are accepted for XC7A100T-2FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-2FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-2FGG676I?
XC7A100T-2FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-2FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-2FGG676I?
For technical support, including XC7A100T-2FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-2FGG676I requirements.
6.How does Aetrix verify that XC7A100T-2FGG676I is sourced from the original manufacturer or authorized distributors?
All XC7A100T-2FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-2FGG676I meets industry standards.
7.What is the process for return or replacement of XC7A100T-2FGG676I?
All XC7A100T-2FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-2FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-2FGG676I part is unused and in its original packaging.
Return procedure for XC7A100T-2FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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