AMD XC7A100T-2FTG256C

Overview

XC7A100T-2FTG256C from AMD (formerly Xilinx) is a Kintex-7 FPGA featuring 101,440 logic cells, 13,200 Kbits of block RAM, 240 DSP slices, and 16 GTX transceivers operating up to 6.6 Gb/s. It is packaged in a 256-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch and supports -2 speed grade timing.

For engineers reviewing the XC7A100T-2FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (170 user I/Os), transceiver lane count and data rate, block RAM depth and width configuration, and thermal performance under sustained 2.5 W typical dynamic power.

Technical Context

The XC7A100T-2FTG256C implements a fully programmable logic fabric based on 6-input LUTs and distributed RAM, with integrated clock management using MMCM and PLL blocks supporting jitter filtering and frequency synthesis. It includes SelectIO technology enabling single-ended and differential I/O standards including LVCMOS, SSTL, HSTL, and TMDS.

Configuration is performed via JTAG, SPI, or BPI interfaces, and the device supports partial reconfiguration and bitstream encryption using AES-256. Its GTX transceivers comply with PCIe Gen2, SATA, and CPRI protocols, with built-in 8B/10B encoding and elastic buffers.

Key Specifications

Pinout & Package

XC7A100T-2FTG256C is housed in a 256-ball Fine-Pitch Thin BGA (FTGBGA) package with 17×17 array, 0.8 mm ball pitch, and 1.05 mm body height. Thermal pad on underside requires solder paste stencil design and ground plane connection for thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC7A75T-2FTG256I, XC7A100T-2FTG256C delivers 36% more logic and 18% more BRAM for complex control-plane logic; versus XCKU035-2FFVA676E, it offers lower cost and smaller footprint but lacks UltraScale routing efficiency and higher-speed transceivers.

Availability

XC7A100T-2FTG256C is available at Aetrix Electronics and suitable for high-speed video processing, industrial Ethernet gateways, and medical imaging interfaces requiring stable component supply across multi-year production cycles.

Supply support for XC7A100T-2FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Kintex-7 family targets cost-optimized high-performance applications including wired communications, video infrastructure, and test equipment, balancing logic density, transceiver count, and power efficiency.

FAQ

What is the maximum supported data rate for GTX transceivers on the XC7A100T-2FTG256C?

The XC7A100T-2FTG256C GTX transceivers support a maximum line rate of 6.6 Gb/s per lane. This is validated across process, voltage, and temperature corners for the -2 speed grade. The XC7A100T-2FTG256C achieves this rate using internal CDR circuits and supports protocols including CPRI, SATA II, and PCIe Gen2 without external retiming.

Does the XC7A100T-2FTG256C support partial reconfiguration?

Yes, the XC7A100T-2FTG256C supports partial reconfiguration through its ICAP interface and dedicated configuration logic. This allows runtime replacement of specific logic modules while keeping the rest of the design operational. The XC7A100T-2FTG256C requires Vivado Design Suite 2018.2 or later to implement and verify partial bitstreams.

What I/O standards are supported by the XC7A100T-2FTG256C SelectIO resources?

The XC7A100T-2FTG256C SelectIO resources support 21 I/O standards including LVCMOS (1.2V–3.3V), SSTL (Class I/II), HSTL (Class I/III), and differential standards such as LVDS, BLVDS, and TMDS. Each I/O bank is independently powered, enabling mixed-voltage operation across the XC7A100T-2FTG256C device.

What is the thermal design power (TDP) of the XC7A100T-2FTG256C under typical operation?

The XC7A100T-2FTG256C has a typical dynamic power consumption of 2.5 W under representative logic utilization and I/O activity. Its thermal design power depends on configuration, clock frequency, and I/O loading-but the XC7A100T-2FTG256C's 17×17 mm FTGBGA package includes an exposed thermal pad that must be connected to a solid ground plane for effective heat dissipation.

Can the XC7A100T-2FTG256C be configured via JTAG only, or are other methods available?

The XC7A100T-2FTG256C supports multiple configuration modes: JTAG, Master SPI, Slave SelectMAP, and Boundary Scan. JTAG is used primarily for debugging and programming during development, while SPI and SelectMAP are used for production configuration from flash memory. All methods are supported simultaneously in the XC7A100T-2FTG256C without hardware modification.