AMD XC7A100T-2FTG256I
- Part No.:
- XC7A100T-2FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC7A100T-2FTG256I.pdf
- Description:
- IC FPGA 170 I/O 256FTBGA
- Quantity:
- Payment:

- Shipping:

Inventory:211
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Product details
Overview
XC7A100T-2FTG256I from AMD (formerly Xilinx) is a Kintex-7 FPGA featuring 101,440 logic cells, 12.5 Gb/s transceiver capability, and -2 speed grade in a 256-pin FTBGA package. It integrates Block RAM, DSP slices, and PCIe Gen2 hard IP for high-performance embedded vision and industrial control applications.
For engineers reviewing the XC7A100T-2FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver voltage compliance (1.8 V / 1.0 V), I/O bank voltage flexibility (1.2–3.3 V), and thermal performance under sustained 1.0 W dynamic power.
Technical Context
The XC7A100T-2FTG256I implements a 28 nm HKMG process-based architecture with 600 user I/Os distributed across 14 configurable I/O banks. Its dual-register flip-flops support 750 MHz system clocking, and the integrated 6.6 Gb/s GTPE4 transceivers comply with PCIe Gen2, SATA, and CPRI standards.
Configuration is supported via Master SPI, Slave SelectMAP, or JTAG, with bitstream encryption enabled through AES-256 and HMAC-SHA-256. The device includes dedicated clock management tiles with MMCM and PLL blocks supporting jitter < 150 fs RMS over 12 kHz–20 MHz bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - determines maximum combinational/sequential logic capacity for HDL synthesis |
| Block RAM | 3,320 kbit - supports on-chip data buffering and FIFO implementation without external memory |
| DSP Slices | 240 - enables 250+ GMAC/s fixed-point math for real-time filtering and FFT processing |
| Transceiver Speed | 12.5 Gb/s - enables single-lane CPRI v6 or dual-lane PCIe Gen3 x1 link operation |
| I/O Banks | 14 - allows independent voltage assignment per bank for mixed-voltage interface coexistence |
| Speed Grade | -2 - guarantees timing closure at 750 MHz system clock with 1.0 V core supply |
| Package | FTG256 - 17 × 17 mm, 0.8 mm pitch, RoHS-compliant fine-pitch BGA with thermal pad |
Pinout & Package
XC7A100T-2FTG256I uses a 256-pin Fine-Pitch Thin BGA (FTBGA) package with exposed thermal pad. Pinout follows Xilinx UG475 v1.13 (Kintex-7 FPGA Packaging and Pinout) for FTG256 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G19 | VCCO_0 | I/O bank 0 output voltage supply - must match connected peripheral interface voltage (e.g., 1.8 V for LVDS) |
| K17 | MRCC_1 | Multi-Region Clock Capable input - accepts differential clock up to 800 MHz for global clock distribution |
| M20 | GND | Ground reference for analog and digital sections - requires low-inductance connection to PCB ground plane |
| T14 | VRP_13 | Reference voltage for bank 13 - sets termination threshold for SSTL-15 and SSTL-18 interfaces |
| U18 | INIT_B | Open-drain configuration status indicator - pulled low during bitstream loading failure |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Hard IP | Integrated endpoint controller with AXI4-Lite register map - eliminates soft-core resource usage and reduces latency by 40% vs. PL-based implementation |
| AES-256 Bitstream Encryption | On-chip decryption engine with HMAC-SHA-256 authentication - prevents unauthorized configuration and cloning of firmware logic |
| MMCM + PLL Clock Management | Two independent clock generators per tile - supports phase alignment, frequency synthesis, and jitter cleaning for multi-domain timing |
| Configurable I/O Standards | Supports LVCMOS, SSTL, HSTL, LVDS, TMDS up to 1.8 V - enables direct interfacing with DDR3, HDMI, and industrial sensors |
| Partial Reconfiguration Support | Runtime logic module swap without full reconfiguration - enables field-upgradable functions in aerospace and medical systems |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time image preprocessing pipeline in automated optical inspection (AOI) systems. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, histogram equalization, and ROI extraction before sending compressed frames to host CPU. Use Value: 240 DSP slices enable 1080p@60fps Sobel edge detection with sub-frame latency; PCIe Gen2 x4 provides 2 GB/s frame streaming bandwidth. | Use Scenario: High-speed data acquisition and protocol bridging between ultrasound transducer arrays and ARM-based processing modules. IC Role / Device Role / Timing Role: XC7A100T-2FTG256I acts as a deterministic time-synchronized interface controller handling LVDS sensor streams and DDR3 buffering. Use Value: 14 I/O banks allow concurrent 1.2 V LVDS (sensor), 1.5 V DDR3 (buffer), and 3.3 V UART (debug) signaling without level shifters. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation unit in flight control subsystems. IC Role / Device Role / Timing Role: Dedicated hard IP handles ARINC 429 encoding/decoding while programmable logic manages time-stamped message routing and redundancy switching. Use Value: -2 speed grade ensures deterministic 1.2 μs worst-case latency for safety-critical command forwarding under extended temperature (-40°C to +100°C). | Use Scenario: Modular signal generator with arbitrary waveform synthesis and real-time modulation feedback loop. IC Role / Device Role / Timing Role: XC7A100T-2FTG256I implements DDS cores, digital upconverters, and closed-loop DAC calibration logic in same device. Use Value: 3,320 kbit Block RAM stores 16k-point waveform tables; GTPE4 transceivers synchronize multiple instrument modules at 100 ps skew. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-2FTG256I | 74,400 logic cells, 210 DSP slices, identical FTG256 package and speed grade | Limited DSP and BRAM capacity reduces viability for multi-channel FFT or large frame buffers | Select when cost sensitivity outweighs need for >200 DSP slices or >2.5 MB on-chip memory |
| XCKU035-2FFVA676I | Kintex UltraScale, 225K logic cells, 16.3 Gb/s transceivers, larger 676-pin FCBGA package | Higher performance and density require PCB redesign; supports PCIe Gen3 and DDR4 natively | Choose for next-generation designs requiring >10 Gb/s serial links or migration path beyond 7-series lifecycle |
Compared with XC7A75T-2FTG256I and XCKU035-2FFVA676I, the XC7A100T-2FTG256I delivers optimal balance of transceiver bandwidth, DSP throughput, and pin-compatible upgrade path within the Kintex-7 family-enabling reuse of existing FTG256 layouts while supporting PCIe Gen2 and DDR3-1866 interfaces without external PHYs.
Availability
XC7A100T-2FTG256I is available at Aetrix Electronics and suitable for industrial machine vision, avionics data concentrators, and medical imaging interface applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC7A100T-2FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.
The Kintex-7 family, including XC7A100T-2FTG256I, was architected for high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and serial connectivity-targeting industrial automation, test equipment, and medical imaging systems.
FAQ
What is the maximum supported I/O standard voltage for XC7A100T-2FTG256I?
The XC7A100T-2FTG256I supports I/O voltages from 1.2 V to 3.3 V across its 14 configurable I/O banks. Each bank operates independently, enabling simultaneous use of LVCMOS12, SSTL15, and HSTL_I standards. Bank-specific VCCO and VRN/VREF settings must be configured per UG475 guidelines to ensure signal integrity and timing closure.
Does XC7A100T-2FTG256I include hardened PCIe Gen2 endpoints?
Yes, XC7A100T-2FTG256I integrates a hardened PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification 2.1. This includes physical layer (PHY), data link layer (DLL), and transaction layer (TL) logic, supporting both root complex and endpoint roles with AXI4-Stream and AXI4-Lite interfaces for seamless integration into host processor systems.
What configuration modes does XC7A100T-2FTG256I support?
XC7A100T-2FTG256I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Master SPI is most common for compact flash-based boot; Slave SelectMAP enables high-speed parallel loading from microcontrollers. All modes support bitstream encryption and fallback configuration via dual-bitstream storage in external SPI flash.
Is XC7A100T-2FTG256I qualified for extended temperature operation?
Yes, the "I" suffix in XC7A100T-2FTG256I denotes Industrial temperature grade (-40°C to +100°C junction). Thermal performance is validated per Xilinx DS182, with recommended PCB layout including thermal vias under the exposed pad and ≥2 oz copper planes to maintain junction temperature below 100°C under 1.0 W typical dynamic power.
Can XC7A100T-2FTG256I implement partial reconfiguration?
Yes, XC7A100T-2FTG256I fully supports partial reconfiguration using Vivado Design Suite. Dynamic logic modules-including PCIe endpoints, FFT engines, or custom I/O protocols-can be swapped at runtime without resetting the entire device. This capability requires dedicated configuration port access and adheres to Xilinx UG909 timing and placement constraints.
XC7A100T-2FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 170
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC7A100T-2FTG256I FAQ
1.How can I place an order for XC7A100T-2FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-2FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-2FTG256I reliable?
The price and inventory of XC7A100T-2FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-2FTG256I is usually 5 days.
3.What payment methods are accepted for XC7A100T-2FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-2FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-2FTG256I?
XC7A100T-2FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-2FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-2FTG256I?
For technical support, including XC7A100T-2FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-2FTG256I requirements.
6.How does Aetrix verify that XC7A100T-2FTG256I is sourced from the original manufacturer or authorized distributors?
All XC7A100T-2FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-2FTG256I meets industry standards.
7.What is the process for return or replacement of XC7A100T-2FTG256I?
All XC7A100T-2FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-2FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-2FTG256I part is unused and in its original packaging.
Return procedure for XC7A100T-2FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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