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AMD XC7A100T-3CSG324E
- Part No.:
- XC7A100T-3CSG324E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A100T-3CSG324E.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:100
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Product details
Overview
XC7A100T-3CSG324E from AMD is a Kintex-7 FPGA with 101,440 logic cells, 3.3 V I/O voltage, -3 speed grade, and 324-pin CSG package. It integrates 600 DSP slices, 4.9 Mb of block RAM, and supports PCIe Gen2 x8, DDR3-1866, and 6.6 Gb/s transceivers. It is used in high-performance industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7A100T-3CSG324E datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, transceiver data rate, I/O bank voltage flexibility, block RAM depth, and thermal performance in compact PCB layouts.
Technical Context
The XC7A100T-3CSG324E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated clock management tiles (CMT) with MMCM and PLL. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling such as LVDS and TMDS.
Its transceiver subsystem includes eight GTPE2 transceivers capable of 6.6 Gb/s line rates, supporting protocols like PCIe Gen2, SATA, and CPRI. The device features dual 12-bit 1 MSPS ADCs for on-die analog monitoring and configuration via JTAG, ICAP, or SPI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - determines maximum combinational/sequential logic density for custom digital functions |
| Block RAM | 4.9 Mb - enables large on-chip data buffering and FIFO implementation without external memory |
| DSP Slices | 600 - provides parallel fixed/floating-point MAC operations for filtering and FFT acceleration |
| Transceiver Speed | 6.6 Gb/s - supports serial protocols including PCIe Gen2 x8 and CPRI over copper or optical interfaces |
| I/O Standards | LVCMOS, SSTL, HSTL, LVDS, TMDS - allows direct interfacing with memory, sensors, displays, and FMC mezzanine cards |
| ADC Channels | 2 × 12-bit - enables real-time monitoring of on-chip temperature, supply voltage, and die conditions |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies for critical paths in high-speed designs |
Pinout & Package
XC7A100T-3CSG324E uses a 324-pin CSG (Chip-Scale Grid Array) package with 0.8 mm pitch, 15 × 15 mm body size, and exposed thermal pad for enhanced heat dissipation in thermally constrained applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V supply for FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration, clocking, and transceiver reference circuits |
| VCCO_0 | I/O bank voltage | Configurable 1.2–3.3 V per bank; sets logic threshold and drive strength for connected peripherals |
| MGTAVCC | Transceiver analog supply | 1.0 V analog rail for GTPE2 transceiver PLLs and serializers; sensitive to ripple |
| PROGRAM_B | Configuration control | Active-low input that initiates reconfiguration from external flash or host processor |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Integrated ADC | Two 12-bit channels monitor internal temperature and supply rails without external sensors |
| PCIe Gen2 Endpoint | Hard IP block supports x1/x2/x4/x8 link widths with full protocol stack handling in hardware |
| DDR3 Memory Controller | Hard macro supports up to DDR3-1866 with 64-bit data bus and ECC capability |
| Transceiver Flexibility | Eight GTPE2 transceivers configurable as 1–8 lanes with independent reference clocks per quad |
| Partial Reconfiguration | Enables dynamic logic updates in operational systems without full device reset or downtime |
Applications
| Industrial Machine Vision | Medical Ultrasound Beamforming |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction on high-resolution CMOS sensor streams. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level convolution and histogram equalization; transceivers interface with camera links (e.g., SLVS-EC). Use Value: 101,440 logic cells and 600 DSP slices enable sub-frame latency processing without offloading to host CPU. | Use Scenario: Digital beam synthesis and RF echo digitization in portable ultrasound systems. IC Role / Device Role / Timing Role: XC7A100T-3CSG324E hosts time-aligned channel processing pipelines and controls 12-bit ADC sampling via programmable logic. Use Value: On-die 12-bit ADC monitors supply stability during high-current transmit bursts, improving system reliability. |
| 5G Wireless Remote Radio Head | Test & Measurement Equipment |
Use Scenario: CPRI fronthaul interface and digital pre-distortion (DPD) computation in compact RRH units. IC Role / Device Role / Timing Role: GTPE2 transceivers handle 6.6 Gb/s CPRI links; DSP slices implement adaptive DPD algorithms in real time. Use Value: -3 speed grade ensures deterministic timing for multi-tap FIR filters operating at 300+ MHz clock domains. | Use Scenario: High-speed digital pattern generation and acquisition in automated test equipment (ATE). IC Role / Device Role / Timing Role: Configurable I/O banks interface with DUTs using multiple voltage standards; block RAM stores deep test vectors. Use Value: 4.9 Mb of block RAM enables >1 M-sample capture depth at 200 MS/s without external memory bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, 352K logic cells, higher transceiver count (16× 12.5 Gb/s), 1.2 V core | Targets higher bandwidth protocols (PCIe Gen3, 10G Ethernet) and larger algorithm footprints | Choose when migrating to higher throughput or requiring hardened 10G MAC/PCS blocks |
| XC7A75T-2CSG324I | Same Kintex-7 family, lower logic count (74,400 cells), -2 speed grade, industrial temp range | Suitable for cost-sensitive, thermally stable environments with relaxed timing margins | Choose for reduced BOM cost where 101K logic cells and -3 timing are not required |
Compared with XC7A100T-3CSG324E, XCKU035-2FFVA676E delivers significantly higher logic density and transceiver bandwidth but requires board redesign due to different package and voltage requirements; XC7A75T-2CSG324I offers pin-compatible migration path within Kintex-7 with trade-offs in speed grade and resource count.
Availability
XC7A100T-3CSG324E is available at Aetrix Electronics and suitable for industrial imaging, medical ultrasound, 5G remote radio head, and automated test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7A100T-3CSG324E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - especially in industrial automation, medical imaging, and wireless infrastructure.
FAQ
What is the maximum supported DDR3 data rate for XC7A100T-3CSG324E?
The XC7A100T-3CSG324E supports DDR3-1866 (933 MHz) using its hard memory controller IP. This is verified in UG473 and applies to 64-bit interfaces with on-die termination and calibrated I/O. The -3 speed grade ensures reliable operation at this rate under worst-case voltage and temperature conditions. XC7A100T-3CSG324E does not support DDR4 or LPDDR3.
Does XC7A100T-3CSG324E include built-in analog-to-digital conversion capability?
Yes, XC7A100T-3CSG324E integrates two 12-bit, 1 MSPS ADC channels accessible via dedicated pins (VP/VN). These measure internal die temperature, VCCINT, VCCAUX, and VCCBRAM. The ADC is documented in XAPP1271 and enabled through configuration registers. XC7A100T-3CSG324E does not support external analog input multiplexing beyond these four monitored supplies.
What transceiver protocols are natively supported by XC7A100T-3CSG324E?
XC7A100T-3CSG324E's GTPE2 transceivers natively support PCIe Gen2 (x1/x2/x4/x8), SATA I/II/III, CPRI, and DisplayPort 1.1. Protocol support is implemented via hard IP blocks and validated PHY layers in UG476. XC7A100T-3CSG324E does not include native support for USB 3.0, HDMI, or 10G Ethernet without soft logic implementation.
Is XC7A100T-3CSG324E compatible with Xilinx Vivado Design Suite?
Yes, XC7A100T-3CSG324E is fully supported in Xilinx Vivado Design Suite 2018.3 and later versions. Device files, IP integrators, and timing analysis tools for the Kintex-7 family are included out-of-the-box. XC7A100T-3CSG324E requires Vivado HL WebPACK or higher license tier for full place-and-route capability.
What is the operating temperature range for XC7A100T-3CSG324E?
XC7A100T-3CSG324E is specified for commercial temperature range (0 °C to +85 °C ambient), denoted by the 'E' suffix in the part number. This rating applies to junction temperature limits defined in DS182. XC7A100T-3CSG324E is not rated for extended or industrial temperature ranges; for those, the 'I' suffix variant (e.g., XC7A100T-3CSG324I) must be selected.
XC7A100T-3CSG324E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A100T-3CSG324E FAQ
1.How can I place an order for XC7A100T-3CSG324E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-3CSG324E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-3CSG324E reliable?
The price and inventory of XC7A100T-3CSG324E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-3CSG324E is usually 5 days.
3.What payment methods are accepted for XC7A100T-3CSG324E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-3CSG324E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-3CSG324E?
XC7A100T-3CSG324E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-3CSG324E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-3CSG324E?
For technical support, including XC7A100T-3CSG324E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-3CSG324E requirements.
6.How does Aetrix verify that XC7A100T-3CSG324E is sourced from the original manufacturer or authorized distributors?
All XC7A100T-3CSG324E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-3CSG324E meets industry standards.
7.What is the process for return or replacement of XC7A100T-3CSG324E?
All XC7A100T-3CSG324E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-3CSG324E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-3CSG324E part is unused and in its original packaging.
Return procedure for XC7A100T-3CSG324E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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