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AMD XC7A100T-3FTG256E
- Part No.:
- XC7A100T-3FTG256E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC7A100T-3FTG256E.pdf
- Description:
- IC FPGA 170 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,211
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Product details
Overview
XC7A100T-3FTG256E from AMD (formerly Xilinx) is a high-performance Artix-7 FPGA featuring 101,440 logic cells, 13,200 Kbits of block RAM, and 240 DSP slices. It operates at -3 speed grade (fastest in Artix-7), supports 600 MHz I/O, and is packaged in a 256-pin Fine-Pitch Ball Grid Array (FTBGA). It is used in industrial vision systems requiring real-time image processing and deterministic latency.
For engineers reviewing the XC7A100T-3FTG256E datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver count (no GT transceivers), thermal performance (100°C junction), and configuration interface (SPIx4/JTAG).
Technical Context
The XC7A100T-3FTG256E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kbit block RAMs, and dedicated DSP48E1 slices for arithmetic-intensive tasks. It includes SelectIO technology supporting single-ended and differential standards up to LVDS 1.8 V.
No integrated transceivers are present - this device belongs to the "T" (Transceiver-less) variant of Artix-7. Configuration is performed via master SPI or JTAG, with support for fallback and multi-boot through external flash memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - determines maximum combinational and sequential logic density for custom digital functions |
| Block RAM | 13,200 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM |
| DSP Slices | 240 - enables fixed-point MAC operations at up to 450 MHz for filtering or motor control algorithms |
| I/O Standards | Supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, TMDS - allows direct interfacing with DDR3, image sensors, and FPD-Link III |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency within Artix-7 T-series devices |
| Junction Temp | 100°C - defines maximum allowable silicon temperature under sustained operation with proper thermal design |
| Configuration Mode | Master SPI x4 / JTAG - enables fast parallel configuration from quad-SPI flash or debug programming via standard tools |
Pinout & Package
XC7A100T-3FTG256E is housed in a 256-ball Fine-Pitch BGA (FTBGA) package with 1.0 mm ball pitch, 17 × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation. Pinout follows Xilinx Artix-7 FTG256 footprint standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.0V core supply input - must be tightly regulated with low-noise, high-PSRR LDO or DC/DC converter |
| A2 | VCCAUX | 1.8V auxiliary supply - powers configuration logic, JTAG, and certain I/O banks |
| P1 | VCCO_0 | 1.2–3.3V I/O bank supply - sets voltage level for all pins in Bank 0 (e.g., for interfacing with 1.8V sensor interface) |
| T16 | M0/M1/M2 | Configuration mode select - sets boot source (SPI/JTAG) and data width during power-up |
| R15 | INIT_B | Open-drain status output - signals configuration status and enables system-level error detection |
| U14 | CCLK | Configuration clock input - driven externally during master SPI mode or generated internally during JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping in runtime - critical for adaptive signal processing in radar or comms systems |
| AXI Interconnect Integration | Allows seamless integration with ARM Cortex-A9 processors in Zynq-7000 hybrid designs via AXI4-Lite/AXI4-Stream |
| ISE & Vivado Tool Compatibility | Full synthesis, implementation, and debug support in both legacy ISE 14.7 and current Vivado 2023.x toolchains |
| Low Static Power | Typical 25 mW static power at 85°C - reduces thermal load and enables fanless industrial enclosure designs |
| Single Event Upset (SEU) Mitigation | Configurable CRC checking and built-in scrubbing controller - improves reliability in terrestrial industrial environments |
Applications
| Industrial Machine Vision | Motor Control & Drives |
|---|---|
Use Scenario: Real-time preprocessing of 1080p@60fps camera streams in robotic guidance systems. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, edge detection, and ROI extraction before CPU handoff. Use Value: Deterministic sub-10 µs latency enables closed-loop response within motion control cycle time. | Use Scenario: Field-oriented control (FOC) execution for 3-phase PMSM motors in CNC spindles. IC Role / Device Role / Timing Role: XC7A100T-3FTG256E implements PWM generation, current sensing ADC interface, and PI loop computation. Use Value: 240 DSP slices deliver 12 kHz FOC update rate with <1 µs jitter on PWM outputs. |
| Programmable Logic Controllers (PLC) | Test & Measurement Equipment |
Use Scenario: High-speed digital I/O expansion and protocol bridging (Modbus TCP ↔ CANopen) in modular PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic handles timing-critical fieldbus arbitration and bit-stuffing logic. Use Value: 101,440 logic cells support dual-core soft-CPU plus deterministic I/O sequencer in one device. | Use Scenario: Digital pattern generation and acquisition synchronization in automated test systems. IC Role / Device Role / Timing Role: XC7A100T-3FTG256E manages precise trigger routing, sample clock division, and data buffering. Use Value: 600 MHz I/O toggle rate enables 300 MHz sampling clock distribution with <50 ps skew across 48 channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-3FTG256E | 74,695 logic cells, 10,800 Kbits BRAM, 210 DSP slices - smaller resource set at same speed grade and package | Suitable for cost-sensitive designs with reduced algorithm complexity or lower channel count | Select when full 101K LC capacity is unused and BOM cost reduction is prioritized |
| XC7A15T-3FTG256E | 17,000 logic cells, 3,240 Kbits BRAM, 40 DSP slices - significantly scaled-down variant in identical FTG256 package | Targeted at simple glue logic, I/O expansion, or lightweight protocol translation | Choose for minimal-footprint control logic where XC7A100T-3FTG256E resources are over-provisioned |
Compared with XC7A75T-3FTG256E and XC7A15T-3FTG256E, the XC7A100T-3FTG256E delivers 36% more logic and 14% more DSP slices while maintaining identical thermal profile and PCB footprint - enabling scalability without layout revision.
Availability
XC7A100T-3FTG256E is available at Aetrix Electronics and suitable for industrial automation, machine vision, and motor control applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC7A100T-3FTG256E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and SoCs for data center, AI, and embedded markets.
The Artix-7 family, including XC7A100T-3FTG256E, was designed for cost-sensitive, high-performance embedded applications demanding logic density, I/O flexibility, and low power - especially in industrial and vision systems.
FAQ
What is the maximum supported I/O voltage for XC7A100T-3FTG256E?
The XC7A100T-3FTG256E supports I/O voltages from 1.2 V to 3.3 V across its 12 I/O banks. Each bank is independently configurable - for example, Bank 0 can run at 1.8 V for sensor interface while Bank 14 operates at 3.3 V for legacy industrial bus signaling. This per-bank VCCO control enables mixed-voltage system integration without level shifters.
Does XC7A100T-3FTG256E include high-speed serial transceivers?
No, the XC7A100T-3FTG256E does not include GT transceivers. It belongs to the Artix-7 "T" series, which omits multi-gigabit transceivers to reduce cost and power. For designs requiring PCIe, SATA, or 10GbE, engineers must select an "LX" or "SXT" variant such as XC7A200T or XC7A35T with integrated GTP/GTX transceivers.
What configuration modes does XC7A100T-3FTG256E support?
The XC7A100T-3FTG256E supports Master SPI (x1/x2/x4), Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI x4 is most common for production, delivering up to 160 MB/s configuration rate from quad-SPI flash. JTAG is used for prototyping and debugging via Vivado Hardware Manager or iMPACT tools.
Is XC7A100T-3FTG256E pin-compatible with other Artix-7 FTG256 devices?
Yes, XC7A100T-3FTG256E shares identical FTG256 pinout and package dimensions with XC7A75T-3FTG256E and XC7A15T-3FTG256E. This allows hardware reuse across performance tiers - a single PCB can accommodate any of these three variants, simplifying inventory and enabling late-stage design optimization based on firmware requirements.
What thermal management guidance applies to XC7A100T-3FTG256E?
XC7A100T-3FTG256E has a maximum junction temperature of 100°C and requires a thermal pad on the PCB bottom layer connected to a solid copper pour. Recommended thermal vias (≥20× 0.3 mm diameter) under the package improve heat transfer. Under typical 60% logic utilization, board-level thermal simulation shows 68°C junction rise with 1.5 W total power dissipation and 200 LFM airflow.
XC7A100T-3FTG256E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 170
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC7A100T-3FTG256E FAQ
1.How can I place an order for XC7A100T-3FTG256E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-3FTG256E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-3FTG256E reliable?
The price and inventory of XC7A100T-3FTG256E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-3FTG256E is usually 5 days.
3.What payment methods are accepted for XC7A100T-3FTG256E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-3FTG256E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-3FTG256E?
XC7A100T-3FTG256E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-3FTG256E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-3FTG256E?
For technical support, including XC7A100T-3FTG256E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-3FTG256E requirements.
6.How does Aetrix verify that XC7A100T-3FTG256E is sourced from the original manufacturer or authorized distributors?
All XC7A100T-3FTG256E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-3FTG256E meets industry standards.
7.What is the process for return or replacement of XC7A100T-3FTG256E?
All XC7A100T-3FTG256E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-3FTG256E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-3FTG256E part is unused and in its original packaging.
Return procedure for XC7A100T-3FTG256E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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