AMD XC7A100T-L1CSG324I
- Part No.:
- XC7A100T-L1CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7A100T-L1CSG324I.pdf
- Description:
- IC FPGA 210 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7A100T-L1CSG324I from AMD (formerly Xilinx) is a Kintex-7 family FPGA with 101,440 logic cells, 13.1 Mb of block RAM, 600 DSP slices, and supports -1L speed grade operation at junction temperatures up to 100°C in a 324-pin CSGA package. It is used in high-throughput industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7A100T-L1CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver line rates up to 6.6 Gb/s, and configuration via SPIx4 or SelectMAP interface.
Technical Context
The XC7A100T-L1CSG324I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and 25 × 18-bit signed multipliers per DSP48E1 slice. It integrates 16 GTX transceivers supporting PCIe Gen2, SATA, and CPRI protocols.
Configuration is performed through Master SPI or Slave SelectMAP modes using external flash or processor control. The device supports JTAG boundary-scan testing and partial reconfiguration for dynamic function swapping without full system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - total programmable LUTs + flip-flops for custom digital logic implementation |
| Block RAM | 13.1 Mb - distributed memory capacity for FIFOs, buffers, and lookup tables |
| DSP Slices | 600 - fixed-point arithmetic units enabling real-time filtering and FFT computation |
| GTX Transceivers | 16 × - serial I/O supporting 600 Mb/s to 6.6 Gb/s line rates with embedded clock recovery |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - enables direct interfacing with ADCs, DDR3 memory, and video PHYs |
| Speed Grade | -1L - guaranteed timing performance at 100°C junction temperature with reduced power consumption |
| Configuration Interface | Master SPI x4 / Slave SelectMAP - allows boot from quad-SPI flash or host processor loading |
Pinout & Package
The XC7A100T-L1CSG324I is housed in a 324-pin CSGA (Chip Scale Grid Array) package with 0.8 mm pitch, 15 × 15 mm body size, and thermal pad for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI/SelectMAP/JTAG) during power-up reset |
| CCLK | Configuration Clock | Input clock for Master SPI configuration; driven by FPGA or external source |
| DIN | Serial Data Input | Primary data input for SPI configuration; supports x1/x2/x4 modes |
| INIT_B | Configuration Status | Open-drain output indicating configuration memory readiness or error |
| PROGRAM_B | Configuration Reset | Active-low input to initiate configuration sequence and clear internal state |
| GTXREFCLK0/1 | Transceiver Reference Clock | Dedicated differential inputs for GTX transceiver PLL reference clocks |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation without full device reset |
| Integrated PCI Express Block | Hard IP supporting Gen2 x1/x2/x4 endpoints with AXI streaming interface |
| AXI Interconnect Infrastructure | On-chip switching fabric for connecting multiple masters/slaves with QoS and arbitration |
| UltraFast Memory Interface | DDR3/DDR3L controller supporting 800–1066 MHz data rates with calibration engine |
| Power-Optimized Architecture | -1L speed grade delivers 15% lower dynamic power vs. -2 grade at same frequency |
Applications
| Industrial Machine Vision | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time image preprocessing pipeline on factory-floor inspection systems with sub-millisecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, histogram equalization, and ROI extraction before CPU offload. Use Value: 600 DSP slices enable parallel 2D convolution kernels; GTX transceivers interface directly with CMOS image sensors at 3.125 Gb/s. | Use Scenario: High-resolution ultrasound beamforming subsystem requiring deterministic timing and low jitter. IC Role / Device Role / Timing Role: Timing-critical digital backend synchronizes ADC sampling, applies delay compensation, and formats data for PCIe transmission. Use Value: -1L speed grade ensures stable operation at 85°C ambient; UltraFast DDR3 controller buffers 128 MB of echo data. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: ARINC 429 and MIL-STD-1553 bus aggregation unit in airborne edge computing nodes. IC Role / Device Role / Timing Role: Protocol translation engine with deterministic latency and dual-redundant I/O banks. Use Value: 324-pin CSGA package meets DO-254 mechanical reliability requirements; LVDS I/O supports 155.52 MHz bus clocks. | Use Scenario: Modular signal analyzer with real-time spectrum analysis and deep memory capture. IC Role / Device Role / Timing Role: High-speed data acquisition controller managing ADC front-end, memory buffering, and USB 3.0/PCIe host interface. Use Value: 13.1 Mb block RAM stores >256 MSamples at 1 GS/s; GTX transceivers feed data to host at 5 Gb/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A100T-1CSG324C | Commercial speed grade (-1), 0–85°C operating range, no extended temperature qualification | Suitable for lab-grade test equipment but not certified for industrial or avionics thermal profiles | Select when ambient temperature stays below 70°C and cost sensitivity outweighs thermal margin |
| XCKU035-1FFVA676I | Kintex UltraScale architecture, 242K logic cells, higher transceiver count (20 GTY), 16 nm process | Required for >10 Gb/s serial links or >200k logic cell density; higher power and cost | Choose for next-generation designs needing PCIe Gen3/Gen4 or 10G Ethernet MAC integration |
Compared with XC7A100T-L1CSG324I, the XC7A100T-1CSG324C lacks extended temperature validation and offers no power reduction benefit, while the XCKU035-1FFVA676I provides significantly higher bandwidth and logic capacity at increased complexity and BOM cost.
Availability
XC7A100T-L1CSG324I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging backend, and avionics data concentrator applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7A100T-L1CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Kintex-7 family, including XC7A100T-L1CSG324I, was designed for cost-optimized high-performance applications demanding balanced logic density, I/O bandwidth, and power efficiency in industrial and aerospace systems.
FAQ
What is the maximum supported I/O standard voltage for XC7A100T-L1CSG324I?
The XC7A100T-L1CSG324I supports I/O standards ranging from 1.2 V to 3.3 V, including LVCMOS, LVDS, SSTL, HSTL, and TMDS. Each bank is independently configurable, allowing mixed-voltage interfaces on a single device. This capability enables direct connection to DDR3 memory, image sensors, and legacy industrial buses without level-shifting circuitry. The XC7A100T-L1CSG324I datasheet specifies bank-specific voltage limits and compatibility matrices.
Does XC7A100T-L1CSG324I support partial reconfiguration?
Yes, the XC7A100T-L1CSG324I supports partial reconfiguration through its ICAP (Internal Configuration Access Port) and dedicated configuration logic. This allows runtime swapping of logic modules without resetting the entire device or disrupting active I/O operations. The feature is implemented in Vivado Design Suite and requires specific HDL partitioning and bitstream generation workflows. XC7A100T-L1CSG324I users deploy this for adaptive filtering, protocol switching, and field-upgradable firmware.
What configuration modes are available for XC7A100T-L1CSG324I?
The XC7A100T-L1CSG324I supports Master SPI, Slave SelectMAP, JTAG, and Boundary Scan configuration modes. Master SPI is most common for standalone boot from quad-SPI flash; Slave SelectMAP enables host-processor-controlled loading. All modes are electrically compatible with the same pin set, selected via M0–M2 pins at power-up. The XC7A100T-L1CSG324I configuration user guide documents timing requirements and failure recovery procedures for each mode.
Is XC7A100T-L1CSG324I qualified for automotive applications?
No, the XC7A100T-L1CSG324I is not AEC-Q100 qualified and lacks automotive-grade screening, packaging, or temperature certification. It is rated for industrial temperature range (–40°C to +100°C) and intended for industrial, medical, and avionics applications. For automotive use, AMD offers Zynq-7000 SoC variants with AEC-Q100 Grade 2 or 3 qualification. XC7A100T-L1CSG324I should not be deployed in safety-critical vehicle subsystems without additional system-level validation.
What is the difference between -1L and -2 speed grades for XC7A100T-L1CSG324I?
The -1L speed grade guarantees timing closure at junction temperatures up to 100°C with reduced static and dynamic power versus the -2 grade. It achieves this through optimized transistor threshold voltages and clock tree design, delivering ~15% lower power at equivalent frequency. The XC7A100T-L1CSG324I -1L variant is preferred for thermally constrained enclosures where cooling is limited, while the -2 grade supports higher maximum frequencies in controlled environments.
XC7A100T-L1CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 210
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC7A100T-L1CSG324I FAQ
1.How can I place an order for XC7A100T-L1CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-L1CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-L1CSG324I reliable?
The price and inventory of XC7A100T-L1CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-L1CSG324I is usually 5 days.
3.What payment methods are accepted for XC7A100T-L1CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-L1CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-L1CSG324I?
XC7A100T-L1CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-L1CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-L1CSG324I?
For technical support, including XC7A100T-L1CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-L1CSG324I requirements.
6.How does Aetrix verify that XC7A100T-L1CSG324I is sourced from the original manufacturer or authorized distributors?
All XC7A100T-L1CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-L1CSG324I meets industry standards.
7.What is the process for return or replacement of XC7A100T-L1CSG324I?
All XC7A100T-L1CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-L1CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-L1CSG324I part is unused and in its original packaging.
Return procedure for XC7A100T-L1CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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