AMD XC7A100T-L1FGG484I
- Part No.:
- XC7A100T-L1FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC7A100T-L1FGG484I.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7A100T-L1FGG484I from AMD is a Kintex-7 FPGA with 101,440 logic cells, 13.1 Gb/s transceiver capability, and -1L speed grade in a 484-pin FCBGA package; it serves as a high-performance programmable logic fabric for PCIe Gen2 endpoint designs in industrial vision systems.
For engineers reviewing the XC7A100T-L1FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2–3.3 V), transceiver lane count (16), and thermal design power (5.9 W at typical conditions).
Technical Context
The XC7A100T-L1FGG484I implements a 28 nm HKMG process-based architecture with integrated Block RAM (4,860 kbits), DSP slices (240), and clock management tiles (CMT) containing MMCM and PLL blocks. It supports SelectIO standards including LVDS, SSTL, and HSTL across 285 user I/Os.
Its transceivers comply with PCIe Gen2 (5.0 GT/s), SATA, and CPRI protocols, and configuration is supported via Master SPI, JTAG, or BPI modes using external flash or PROM. The -1L speed grade guarantees timing closure at 640 MHz on BUFG outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 4,860 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external memory |
| DSP Slices | 240 - enables fixed-point arithmetic acceleration for filtering, FFT, or motor control algorithms |
| User I/O Pins | 285 - supports multi-standard interface routing with bank-wise voltage isolation |
| Transceiver Lanes | 16 - delivers 13.1 Gb/s aggregate serial bandwidth for high-speed serial protocols |
| Thermal Design Power | 5.9 W - defines heatsink and PCB copper requirements under typical operating conditions |
| Speed Grade | -1L - ensures timing closure at 640 MHz on global clock networks |
Pinout & Package
Package: 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA), 23 mm × 23 mm, 1.0 mm ball pitch, RoHS-compliant, with thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply input (1.0V); must be decoupled within 10 mm of ball |
| K19 | VCCAUX | Auxiliary supply (1.8V) for configuration, clocking, and transceivers |
| R14 | VCCO_0 | I/O bank 0 output supply (1.2–3.3 V); sets signal voltage level per bank |
| T15 | PROGRAM_B | Active-low asynchronous reset; initiates configuration reload on falling edge |
| V15 | INIT_B | Open-drain status indicator; goes high-Z after successful bitstream load |
| W16 | CCLK | Configuration clock output; drives external PROM during Master SPI mode |
| Y16 | DONE | Open-drain completion signal; pulled high externally when configuration finishes |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two CMTs (each with MMCM + PLL) enable jitter-tolerant multi-phase clock synthesis for mixed-signal synchronization |
| SelectIO Technology | Supports 18 I/O standards including LVDS DCI, SSTL-18, and HSTL-I; allows direct interfacing to DDR3 memory and image sensors |
| PCIe Gen2 Endpoint | Built-in hard IP supports x1/x2/x4 lane configurations with integrated PHY and data link layer |
| Partial Reconfiguration | Enables dynamic logic module swapping without full device reset-critical for runtime protocol adaptation |
| AXI Interconnect Support | Native integration with AXI4/AXI4-Lite/AXI4-Stream protocols simplifies SoC subsystem connectivity |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time pixel processing and sensor bridging in high-resolution endoscopy cameras. IC Role / Device Role / Timing Role: FPGA fabric handles parallel Bayer demosaicing, gamma correction, and MIPI CSI-2 to HDMI conversion. Use Value: 285 user I/Os and LVDS support enable direct connection to CMOS image sensors and display controllers without level-shifting. | Use Scenario: Ultrasound beamforming data aggregation and front-end digital signal conditioning. IC Role / Device Role / Timing Role: XC7A100T-L1FGG484I acts as a time-synchronized data concentrator between ADC arrays and host processor. Use Value: 240 DSP slices accelerate FIR filtering and delay-and-sum beamforming with deterministic latency. |
| Automated Test Equipment | Avionics Data Acquisition |
Use Scenario: High-speed digital pattern generation and response analysis for semiconductor wafer testing. IC Role / Device Role / Timing Role: Configurable I/O banks and precise clocking deliver sub-nanosecond timing margins for ATE pin electronics. Use Value: -1L speed grade and 640 MHz BUFG output guarantee setup/hold compliance at 200+ MHz vector rates. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control data recorders. IC Role / Device Role / Timing Role: Soft-core microblaze plus hard peripheral IP manages dual-bus arbitration and timestamped logging. Use Value: Integrated Block RAM (4,860 kbits) stores protocol state machines and cyclic buffer metadata without external SRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-L1FGG484I | Fewer logic cells (74,000), same package and speed grade; reduced DSP slices (180) | Suitable for lower gate-count protocols like single-lane PCIe or basic video pipelines | Select when system logic utilization stays below 70% and transceiver count can be reduced to 8 lanes |
| XCKU035-FFVA676E | Kintex UltraScale architecture; higher performance (192 GB/s transceiver bandwidth), larger package (676-pin FCBGA), different pinout | Required for PCIe Gen3 x8 or 10G Ethernet MAC offload with deterministic latency | Choose only if migrating to higher bandwidth or requiring hardened 10G Ethernet MAC IP |
Compared with XC7A75T-L1FGG484I, the XC7A100T-L1FGG484I provides 37% more logic resources and 33% more DSP slices for complex algorithm partitioning; versus XCKU035-FFVA676E, it offers proven qualification for extended temperature operation (-40°C to +100°C) and lower power profile in space-constrained enclosures.
Availability
XC7A100T-L1FGG484I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data acquisition requiring stable component supply over extended product lifecycles.
Supply support for XC7A100T-L1FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt efficiency.
The Kintex-7 family targets cost-optimized high-performance applications such as wired communications, video processing, and test equipment where balanced logic density, I/O flexibility, and transceiver capability are essential.
FAQ
What is the maximum operating junction temperature for XC7A100T-L1FGG484I?
The XC7A100T-L1FGG484I has a maximum operating junction temperature of +100°C, validated under industrial temperature grade (I-grade) conditions. This rating applies to continuous operation with proper thermal management-specifically, a board-level thermal resistance (θJA) ≤ 22°C/W and airflow ≥ 200 LFM. The XC7A100T-L1FGG484I datasheet specifies derating curves beyond 85°C ambient.
Does XC7A100T-L1FGG484I support JTAG boundary scan?
Yes, the XC7A100T-L1FGG484I fully supports IEEE 1149.1 JTAG boundary scan for device programming, debugging, and interconnect testing. Its TAP controller implements mandatory instructions (SAMPLE/PRELOAD, EXTEST, IDCODE, BYPASS) and optional ones (CLAMP, HIGHZ). The XC7A100T-L1FGG484I requires dedicated TDI, TDO, TCK, TMS, and TRST pins routed per Xilinx UG470 guidelines.
Can XC7A100T-L1FGG484I configure from a Micron MT25QL QSPI flash?
Yes, the XC7A100T-L1FGG484I supports Master SPI configuration mode and is compatible with Micron MT25QL series QSPI flashes. Verified boot sequences use 3-byte addressing and standard read commands; the XC7A100T-L1FGG484I's CONFIG_IO_VCCO must match the flash I/O voltage (typically 3.3 V or 1.8 V), and timing constraints require tCS ≥ 20 ns and tCH ≥ 5 ns.
What is the minimum configuration time for XC7A100T-L1FGG484I using Master SPI mode?
The minimum configuration time for XC7A100T-L1FGG484I in Master SPI mode is 32 ms at CCLK = 50 MHz, assuming a compressed bitstream stored in a 16 MB QSPI flash. This value derives from the 11,120,000-bit configuration frame size and overhead for SPI command cycles. The XC7A100T-L1FGG484I datasheet Table 10-2 confirms this timing under default startup sequence settings.
Is XC7A100T-L1FGG484I qualified for automotive AEC-Q100?
No, the XC7A100T-L1FGG484I is not AEC-Q100 qualified. It is rated for industrial temperature range (–40°C to +100°C) and intended for non-automotive applications. AMD does not offer AEC-Q100 variants of the Kintex-7 family; automotive-grade alternatives require migration to Xilinx Automotive (XA) families such as XA7A100T, which undergo separate qualification testing. The XC7A100T-L1FGG484I remains suitable for industrial and aerospace-adjacent use cases with extended temperature validation.
XC7A100T-L1FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC7A100T-L1FGG484I FAQ
1.How can I place an order for XC7A100T-L1FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-L1FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-L1FGG484I reliable?
The price and inventory of XC7A100T-L1FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-L1FGG484I is usually 5 days.
3.What payment methods are accepted for XC7A100T-L1FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-L1FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-L1FGG484I?
XC7A100T-L1FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-L1FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-L1FGG484I?
For technical support, including XC7A100T-L1FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-L1FGG484I requirements.
6.How does Aetrix verify that XC7A100T-L1FGG484I is sourced from the original manufacturer or authorized distributors?
All XC7A100T-L1FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-L1FGG484I meets industry standards.
7.What is the process for return or replacement of XC7A100T-L1FGG484I?
All XC7A100T-L1FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-L1FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-L1FGG484I part is unused and in its original packaging.
Return procedure for XC7A100T-L1FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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