My Inquiry
My Account
AMD XC7A100T-L2FGG484E
- Part No.:
- XC7A100T-L2FGG484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC7A100T-L2FGG484E.pdf
- Description:
- IC FPGA 285 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,552
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7A100T-L2FGG484E from AMD is a Kintex-7 FPGA featuring 101,440 logic cells, 13,950 CLBs, 600 DSP slices, and 4.9 Mb of block RAM, packaged in a 484-pin Fine-Pitch Flip-Chip BGA (FFG484). It targets high-performance embedded vision, industrial Ethernet gateway, and PCIe Gen2 endpoint applications.
For engineers reviewing the XC7A100T-L2FGG484E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (300 user I/Os), speed grade (-2), transceiver capability (16 GTP transceivers up to 3.75 Gb/s), and thermal performance (commercial temperature range 0°C to 85°C).
Technical Context
The XC7A100T-L2FGG484E implements a 28 nm HKMG process-based architecture with configurable logic blocks containing two 6-input LUTs and eight flip-flops per slice. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling such as LVDS and TMDS.
It integrates 16 GTP serial transceivers operating at up to 3.75 Gb/s, supports PCI Express Gen2 x4 endpoint configuration, and includes dual 32-bit AXI interconnects for high-bandwidth data movement between processing subsystems and programmable logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,440 - total programmable logic capacity for complex digital functions |
| CLBs | 13,950 - configurable logic blocks each containing 2 LUTs and 8 FFs |
| DSP Slices | 600 - dedicated arithmetic units supporting multiply-accumulate operations |
| Block RAM | 4.9 Mb - on-chip memory for FIFOs, buffers, and lookup tables |
| User I/Os | 300 - single-ended or differential I/O pins with voltage and standard flexibility |
| GTP Transceivers | 16 × up to 3.75 Gb/s - serial interfaces for Gigabit Ethernet, CPRI, or JESD204B |
| Speed Grade | -2 - timing performance level meeting 667 MHz DDR3 and 300 MHz system clock requirements |
Pinout & Package
Package: 484-pin Fine-Pitch Flip-Chip BGA (FFG484), 23 mm × 23 mm, 1.0 mm ball pitch, RoHS-compliant, commercial temperature range (0°C to 85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V supply for FPGA fabric and CLBs |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration, clocking, and transceivers |
| VCCO | I/O bank power | Programmable 1.2–3.3V supply per I/O bank |
| M0–M2 | Configuration mode pins | Determine boot source (e.g., SPI, BPI, JTAG) |
| CCLK | Configuration clock | Input clock during master SPI or slave parallel configuration |
| INIT_B | Configuration status | Active-low open-drain output indicating configuration status |
| PROGRAM_B | Configuration reset | Active-low input to initiate reconfiguration |
| HR Bank Pins | High-range I/O | Support 1.2–3.3V standards including LVDS, TMDS, and SSTL |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HKMG process | Enables higher logic density and lower dynamic power vs. previous 40 nm FPGAs |
| Dual 32-bit AXI interconnect | Provides low-latency, high-throughput communication between PS and PL in Zynq-7000 compatible systems |
| 16 GTP transceivers | Supports multi-protocol serial links including SATA, USB 3.0, and CPRI without external PHY |
| PCIe Gen2 x4 endpoint | Enables direct host CPU connectivity with ≤ 2 μs latency for real-time control loops |
| Integrated XADC | 12-bit 1 MSPS analog-to-digital converter with on-chip temperature and supply monitoring |
Applications
| Industrial Vision System | Automated Test Equipment |
|---|---|
Use Scenario: Real-time image preprocessing and feature extraction from multiple HD cameras in factory-floor inspection stations. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, edge detection, and ROI cropping; GTP transceivers interface with camera sensors via SLVS-EC or HiSPi. Use Value: 101,440 logic cells enable concurrent pipeline stages; 600 DSP slices accelerate convolution kernels at >120 fps. | Use Scenario: High-speed digital pattern generation and response analysis for semiconductor wafer testing. IC Role / Device Role / Timing Role: Configurable I/O banks drive precise voltage/current waveforms; block RAM stores test vectors and expected responses. Use Value: 300 user I/Os support parallel 128-bit wide test buses; -2 speed grade ensures sub-2 ns setup/hold timing margins. |
| Medical Imaging Gateway | Defense Radar Signal Processor |
Use Scenario: Aggregation and protocol translation of DICOM, HL7, and video streams from ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: PCIe Gen2 x4 endpoint connects to host CPU; AXI interconnect routes data between DDR3 controller and video encoders. Use Value: Dual AXI ports sustain 4 GB/s aggregate bandwidth; 4.9 Mb block RAM buffers multi-channel video before compression. | Use Scenario: Pulse-Doppler radar front-end processing with adaptive beamforming and clutter suppression. IC Role / Device Role / Timing Role: DSP slices perform real-time FFTs and FIR filtering; GTP transceivers interface with ADC/DAC converters at 250 MSPS. Use Value: 600 DSP slices execute 1024-point FFT in <1.2 μs; 16 GTP lanes handle 8× 250 MSPS ADC channels simultaneously. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7A75T-L2FGG484I | Fewer logic cells (74,400), same package and speed grade, reduced DSP slices (480) and block RAM (3.8 Mb) | Suitable for cost-sensitive designs with lower algorithmic complexity | Select when full XC7A100T resources are unused and BOM cost reduction is prioritized |
| XC7A15T-L2FTG256C | Smaller 256-pin FTBGA package, 16,640 logic cells, no GTP transceivers, 1.8 Mb block RAM | Targeted at compact, low-bandwidth control and monitoring functions | Choose for space-constrained PCBs where serial connectivity and high DSP throughput are not required |
Compared with XC7A75T-L2FGG484I and XC7A15T-L2FTG256C, the XC7A100T-L2FGG484E delivers highest logic density and transceiver count in the FFG484 footprint, enabling full-feature implementation of PCIe endpoints and multi-sensor vision pipelines without resource bottlenecks.
Availability
XC7A100T-L2FGG484E is available at Aetrix Electronics and suitable for industrial vision systems, medical imaging gateways, and defense radar signal processors requiring stable component supply across extended production lifecycles.
Supply support for XC7A100T-L2FGG484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, client, and embedded markets.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - especially in industrial automation, video processing, and communications infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC7A100T-L2FGG484E?
The XC7A100T-L2FGG484E supports I/O voltages from 1.2 V to 3.3 V per bank, with HR (High Range) banks accommodating LVDS, TMDS, and SSTL-18/25 standards. Each I/O bank is independently powered, allowing mixed-voltage operation across the device. The XC7A100T-L2FGG484E datasheet specifies VCCO tolerance of ±3% and requires proper termination for differential standards.
Does XC7A100T-L2FGG484E include built-in analog monitoring capability?
Yes, the XC7A100T-L2FGG484E integrates the XADC (Xilinx Analog-to-Digital Converter), a 12-bit, 1 MSPS dual-channel ADC with dedicated on-die sensors. It monitors internal die temperature and supply voltages (VCCINT, VCCAUX, VCCBRAM), and supports external analog inputs. This capability is fully implemented in the XC7A100T-L2FGG484E without external components.
Can XC7A100T-L2FGG484E operate as a PCIe Gen2 endpoint without external bridge chips?
Yes, the XC7A100T-L2FGG484E natively supports PCIe Gen2 x4 endpoint functionality using its integrated hard IP. It complies with PCIe Base Specification 2.1 and requires no external PHY or bridge IC. The XC7A100T-L2FGG484E implements link training, error reporting, and TLP handling in hardware, reducing firmware overhead and latency.
What is the thermal design power (TDP) range for XC7A100T-L2FGG484E under typical operation?
The XC7A100T-L2FGG484E has a typical thermal design power of 6.5 W to 12.8 W depending on resource utilization, clock frequency, and I/O activity. At full utilization with 300 MHz system clocks and active transceivers, peak power reaches ~12.8 W. The XC7A100T-L2FGG484E package supports convection-cooled PCB layouts with standard 2 oz copper and thermal vias.
Is XC7A100T-L2FGG484E compatible with Vivado Design Suite version 2023.1?
Yes, the XC7A100T-L2FGG484E is fully supported in Vivado Design Suite 2023.1, including synthesis, implementation, and bitstream generation. Device files, IP integrator support, and constraint templates for the XC7A100T-L2FGG484E are included out-of-the-box. Backward compatibility extends to Vivado 2018.1, but 2023.1 enables latest timing analysis and power estimation features for the XC7A100T-L2FGG484E.
XC7A100T-L2FGG484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Artix-7
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7925
- Number of Logic Elements/Cells:
- 101440
- Total RAM Bits:
- 4976640
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC7A100T-L2FGG484E FAQ
1.How can I place an order for XC7A100T-L2FGG484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7A100T-L2FGG484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7A100T-L2FGG484E reliable?
The price and inventory of XC7A100T-L2FGG484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7A100T-L2FGG484E is usually 5 days.
3.What payment methods are accepted for XC7A100T-L2FGG484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7A100T-L2FGG484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7A100T-L2FGG484E?
XC7A100T-L2FGG484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7A100T-L2FGG484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7A100T-L2FGG484E?
For technical support, including XC7A100T-L2FGG484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7A100T-L2FGG484E requirements.
6.How does Aetrix verify that XC7A100T-L2FGG484E is sourced from the original manufacturer or authorized distributors?
All XC7A100T-L2FGG484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7A100T-L2FGG484E meets industry standards.
7.What is the process for return or replacement of XC7A100T-L2FGG484E?
All XC7A100T-L2FGG484E units undergo pre-shipment inspection (PSI). If there is an issue with XC7A100T-L2FGG484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7A100T-L2FGG484E part is unused and in its original packaging.
Return procedure for XC7A100T-L2FGG484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7A100T-L2FGG484E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
